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SEMI E15-0698 E2 © SEMI 1990, 2003 2 5.1.13 spacing — The minimum spacing between centroids (see Figure 2, S). 5.1.14 tool — Any piece of semiconductor fabrication or inspection equipm ent designed to proc ess wafers del…

SEMI E15-0698

(Reapproved 0703)

SPECIFICATION FOR TOOL LOAD PORT

This standard was technically reapproved by the Global Physical Insterfaces & Carriers Committee and is the

direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition

approved by the North American Regional Standards Committee on March 12, 2003. Initially available at

www.semi.org May 2003; to be published July 2003. Originally published in 1990; previously published

March 2003.

This specification was editorially modified in November 2004 to correct an editorial error. Changes were

made to Table 1.

1 Purpose

1.1 This standard is intended to unify the interface

between process/inspection tools and automated wafer

carrier transport systems while maintaining

compatibility with human transport.

2 Scope

2.1 This specification deals with the mechanical

interface (load port) for wafer carrier transfer between

wafer carrier material transport systems, including

humans, and wafer fabrication/inspection equipment

(tools). The concept defines the placement and

orientation of a wafer carrier on a tool to allow

reasonable interfacing with mechanized material

movement systems without compromising human

access to perform the material exchange function.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Impact

3.1 Compliance with this specification requires the

placement of load ports on tools to specific heights,

orientations, and load depths. Restrictions are also

placed on clearances to obstructions which may be

adjacent to such ports.

4 Referenced Standards

4.1 SEMI Standards

SEMI E1 — Specification for 3 inch, 100 mm, 125

mm, and 150 mm Plastic and Metal Wafer Carriers

SEMI E19 — Standard Mechanical Interface (SMIF)

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

5 Terminology

5.1 Definitions

5.1.1 box — A protective portable carrier for a cassette

and/or substrate(s).

5.1.2 cassette — An open structure that holds one or

more substrates.

5.1.3 cassette centroid — A datum representing the

theoretical center of a stack of wafers in a cassette

formed by the pocket centerline and the “center” pocket

as defined by the location associated with dividing

dimension B3 by two (see SEMI E1, Figure 1).

5.1.4 cassette envelope — A rectangular volume with

vertical sides which completely contains a cassette,

even if the cassette is tilted (see Figure 1).

5.1.5 enclosed load port — A load port with overhead

clearance obstructed by the tool.

5.1.6 global orientation — The general orientation of a

wafer carrier in a tool; may be vertical or horizontal.

5.1.7 load depth — The horizontal distance from the

load face plane to cassette centroid or carrier centroid

(see Figures 2 and 3 (D)).

5.1.8 load face plane — The furthest physical vertical

boundary plane from cassette centroid or carrier

centroid on the side (or sides) of the tool where loading

of the tool is intended (see Figures 2 and 3).

5.1.9

load height — The distance from the bottom of

the cassette or carrier to the floor at the load face plane

(see Figure 3 (H)).

5.1.10 load port — The interface location on a tool

where wafer carriers are delivered. It is possible that

wafers are not removed from, or inserted into, the

carrier at this location.

5.1.11 open load port — A load port with overhead

clearance unobstructed by the tool.

5.1.12 pod — A box having a Standard Mechanical

Interface (SMIF) per SEMI E19.

SEMI E15-0698

5.1.13 spacing — The minimum spacing between

centroids (see Figure 2, S).

5.1.14 tool — Any piece of semiconductor fabrication

or inspection equipment designed to process wafers

delivered in wafer carriers.

5.1.15 tilt — A small angle of offset from the normal

horizontal or vertical orientation of a cassette or wafer

carrier designed to preferentially align or keep wafers in

their intended place within the carrier/cassette (see

Figure 1, T).

5.1.16 wafer carrier — Any cassette, box, pod, or boat

that contains wafers.

5.1.17 wafer carrier centroid — A datum representing

the theoretical location of the center of a stack of wafers

in the carrier.

5.1.18 wafer carrier envelope — A rectangular volume

with vertical sides which completely contains a carrier,

even if the carrier is tilted (see Figure 1).

5.2 Description of Terms Specific to this Standard

5.2.1 carrier — Wafer carrier.

6 Ordering Information

6.1 The following items require communication

between the tool supplier and user and shall be included

in any request for quotation, quotation, or purchase

order:

6.1.1 If the tool has multiple load ports, provide the

spacing, S, between carrier centroids (see Section 7.8).

6.1.2 Specify what carrier (e.g., SEMI standard

cassette, pod) is to be accommodated by the load port.

6.1.3 Specify whether the load port is open or

enclosed.

6.1.4 Specify whether the wafer orientation is

horizontal (per Section 7.3.1) or vertical (per Section

7.3.2).

7 Requirements

7.1 The dimensions for the placement of a wafer

carrier on the load port of a tool are given in Table 1.

7.2 The standard is based upon the concept that any

wafer carrier can be used. Dimensions are usually

specified as clearances to wafer carrier envelopes (see

envelope concept in Figure 1).

7.3 The global orientation of the cassette or wafer

carrier is constrained to be parallel or perpendicular to

the load face plane. Allowable cassette orientations are:

7.3.1 For wafers horizontal, the opening of the cassette

must be opposite the load face plane, and the front

surface of the wafer must face up (see Figure 4);

7.3.2 For wafers vertical, the opening of the cassette

must face up, and the front surface of the wafer must

face the load face plane (see Figure 5).

7.3.3 This requirement also applies to cassettes in

pods.

7.4

The maximum tilt is 10 degrees.

7.5 The load height is specified as follows (see Figure

3):

7.5.1 Dimension H is 900 mm (~35.4 in.), fully

adjustable over ± 10 mm (~0.4 in.).

7.6 The maximum height above H of an obstruction

between the load face plane and the carrier envelope

(such as for an alignment device or identification tag

reader) is 50 mm (~2 in.) (see Dimension H1 in Figure

3).

7.7 Clearances (C1, C2, and C3) are defined with

respect to the largest carrier envelope required. For

cassettes, envelopes are defined using cassette

dimensions from SEMI E1. For pods or other wafer

carriers, envelopes are defined using the carrier

standard (if any) or the carrier manufacturer's

specifications (see Figure 1 for concept and Figures 2

and 3 for use).

7.8 Dimension S specifies the recommended minimum

spacing between cassette/wafer carrier centroids. In any

case, if S violates clearance C1 in any application, then

C1 prevails (see Figure 2).

7.9 Tools with enclosed load ports shall have a

minimum vertical clearance, C3, above the cassette or

carrier at the load port. Open load ports shall have a

vertical clearance above the load port which is

unrestricted by the tool.

Table 1 Dimension Requirements, mm (inches)

Dimension Application Value, mm (in.) Notes

C1 minimum 75 (3)

C2 minimum 30 (1.2)

C3 minimum 225 (9) See Note 1

D maximum 250 (9.8)

SEMI E15-0698

Dimension Application Value, mm (in.) Notes

H range 900 (35.4) ± 10 (.4) See Note 2

H1 maximum 50 (2.0)

S  150 mm carriers

200 mm carriers

350 (13.8)

400 (15.7)

See Section 7.8.

T maximum 10 degrees

NOTE 1: Applies to tools with enclosed port; otherwise, clearance above the port must be unrestricted by the tool (see Section 5.8).

NOTE 2: Fully adjustable over ± 10 mm (~0.4 in.) range.

Table 2 Dimension Definitions

Dimension Description

C1 Minimum side clearance between one carrier envelope and another, or to vertical obstruction.

C2 Minimum rear clearance from carrier envelope to vertical obstruction.

C3 Minimum clearance above carrier envelope to horizontal obstruction on the tool.

D Maximum load depth to carrier centroid.

H Allowable load height to bottom of carrier envelope.

H1 Maximum height of horizontal obstruction above load height between load face plane and carrier envelope.

S Recommended minimum spacing between carrier centroids.

T Maximum cassette or wafer carrier tilt.

Figure 1

Envelope Concept