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SEMI E30.5-0302 © SEMI 2001, 2002 3 INIT IDLE with Alarms PROCE SSING ACTI VE IDLE ABORTED 1 18 19 17 SETTIN G UP 2 READY WOR KING 3 UNLOAD 4 25 23 24 EXECUTING STO PPING 16 ABORTI NG 6 7 5 13 ALARM PAUSE D PAUSE D 22 21…

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SEMI E30.5-0302 © SEMI 2001, 2002 2
5.1.5 factory automation controller, n. — a computer
system that provides integration of factory shop control
and business systems with semiconductor equipment.
5.1.6 feature, n. — a distinctive item in a pattern, or a
physical characteristic of the substrate. (e.g., line,
point, a wafer flat).
5.1.7 field, n. an exposure repeated in a regular
manner on a substrate.
5.1.8 global alignment, n. procedure which
establishes a coordinate system for the entire substrate
(see alignment). For silicon wafers, this coordinate
system is defined in MSEM as the SEMI M20
coordinate system.
5.1.9 global pattern alignment, n. — a procedure
which establishes a coordinate reference system relative
to repeating features on an entire substrate. For silicon
wafers, this coordinate system is defined in MSEM as
the M20P coordinate system.
5.1.10 logical port, n. one or more physical input or
input/output ports that are controlled by the same
execution of a Process Program.
5.1.11 M20P, adj. — a designation used for the global
coordinate system defined within MSEM, that is
established relative to a pattern on a silicon wafer.
5.1.12 material, n. — a piece or pieces of substrate,
one or more substrate, a lot, a batch, or a run.
5.1.13 metrology equipment, n. — any equipment that
collects and reports information on specific
predetermined sites or features on a substrate with
consistent data structure, or reports general information
about the entire substrate.
5.1.14 notch, n. — a cut on the edge of a wafer that is
commonly located with respect to a specific crystal
plane that adheres to the SEMI M1 standard.
5.1.15 pattern, n. — the physical features on a
substrate.
5.1.16 pre-align, n. — any alignment done prior to
placing a substrate on a measurement process location.
5.1.17 registration, n. — positioning error between two
features on different layers of a substrate.
5.1.18 safe state, n. — a state in which the equipment
presents no danger to the product or user. This implies
that safety interlocks are in place such that the
equipment can be serviced without harm to the operator
and that the material being processed has been removed
from the processing station into an accessible location.
5.1.19 secondary alignment, n. a procedure which
improves the accuracy of the coordinate system
mapping on a substrate in a limited area of the
substrate.
5.1.20 site, n. — a single point on a substrate used for
alignment, or the center of an area of the substrate
within which measurements are made.
5.2 Abbreviations and Acronyms
5.2.1 GEM, n. — Generic Equipment Model
5.2.2 SEM, n. Specific Equipment Model
5.2.3 SEM, n. — Scanning Electron Microscope
5.2.4 TCP/IP, n. — Transmision Communication
Protocol/Internet Protocol.
6 Communication Requirements
6.1 It is required that any MSEM compliant equipment
follow the Communications State Model in SEMI E30.
In addition MSEM compliant equipment shall support
the High Speed Messaging Service (HSMS-SS)
communication Standard, and the SECS-I standard for
sending SECS II messages over TCP/IP or RS232. The
user may determine which of these two lower level
transmission protocols is used in each installation. The
reason for HSMS-SS requirement is the large volume
of data that can be generated by this class of equipment.
7 State Models
7.1 In this section are defined the equipment-specific
processing state model and other state models necessary
to portray the expected operational states of the
equipment to enable host tracking and control in place
of a local operator. See SEMI E30 and Other
References section for additional information on state
charts general rules and utilization.
7.2 Processing State Model Requirements The
Processing state model is required to be implemented as
defined in the next sections of this document. A state
model consists of the following: state model diagram,
state definitions and a state transition table. A state
model represents the host's view of the equipment, not
necessarily the actual equipment operation. All MSEM
state model transitions shall be mapped sequentially
into the appropriate actual equipment events that satisfy
the requirements of those transitions. In certain
implementations, the equipment may enter a state and
have already satisfied all of the conditions required by
the MSEM state model for transition to another state.
The equipment makes the required transition without
any additional actions in this situation.
7.3 Some equipment may need to include additional
states. Additional states may be added, but shall not
change the MSEM defined state transitions. All
expected transitions between MSEM states must occur.
SEMI E30.5-0302 © SEMI 2001, 20023
INIT
IDLE with
Alarms
PROCESSING ACTIVE
IDLEABORTED
1
18
19
17
SETTING
UP
2
READY
WORKING
3
UNLOAD
4
25
23
24
EXECUTING
STOPPING
16
ABORTING
6
7
5
13
ALARM
PAUSED
PAUSED
22
21
H*
9
8
PAUSE
PROCESS
PAUSED
20
14
15
PROCESS
PAUSING
11
12
26
CHECKING
3233
10
38
LOAD
Figure 1
Generic MSEM Processing State Model Diagram
SEMI E30.5-0302 © SEMI 2001, 2002 4
23
WORKING
ALIGN
27
MEASURING
TAKE
MASUREMENT
MEASUREMENT
COMPLETE
28
29
26
24
35
36
34
Figure 2
Working State of Processing State Model
7.4 Processing State Model Diagram
7.4.1 Working State of Processing State Model
7.4.2 Working Sub-states of Processing State Model These states need not to be implemented in all Metrology
equipment but if the equipment has the ability to multiple measurements at a site or provide raw scan date to the user
this is how it is to be implemented.