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SEMI E19.5-0996 © SEMI 1978, 2003 1 SEMI E19.5-0996 (Withdrawn 1103) SPECIFICATION FOR 300-mm BO TTOM-OPENING STANDARD MECHANICAL INTERFACE (SMIF) NOTICE: This docum ent was balloted and appro ved for withdrawal in 2003.…

SEMI E19.4-0998

APPENDIX 1

APPLICATION NOTES

NOTICE: This appendix was approved as an official part of SEMI E19.4 by full letter ballot procedure, but the

recommendations in this appendix are optional and are not required to conform to this standard.

A1-1 Notes

A1-1.1 Automated pod transfer between load port and

automated material handling system (AMHS) might

require a lead-in capability of more than 5 mm. This

can be achieved by increasing the height of the guide

rails (dimension B5). SEMI standard E15 limits this

height to 50 mm (1.97 inches) maximum (see Figure

A1-1). The capture range can be increased to more than

15 mm (0.6 inches) if supplier and customer agree to

increase the guide rail height without violating SEMI

E15.

Figure A1-1

Optional Rail Dimensions

A1-1.2 The dimensions of the pod bottom are not

specified in this standard (see Section 6.2.5.1). It is

recommended that these dimensions should not exceed

282.0 mm (11.14 inches) in one direction and 292.6

mm (11.52 inches) in the other direction. These

maximum outer dimensions ensure a sufficient gap

around the pod and the guide rails in relation to B1 and

B2 to allow a reliable motion of the pod onto the port

plate.

A1-1.3 It is important that the external top of the pod

does not exceed the top of the cassette by more than 50

mm (1.97 inches). This is to prevent possible

interference between the pod and the equipment.

NOTICE: By publication of these standards,

Semiconductor Equipment and Materials International

(SEMI) takes no position respecting the validity of any

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any item mentioned in these standards. Under the

current law of the United States and numerous other

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protection. Users of these standards are expressly

advised that determination of any such patent rights or

copyrights, and the risk of infringement of such rights

are entirely their own responsibility.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E19.5-0996 © SEMI 1978, 2003 1

SEMI E19.5-0996 (Withdrawn 1103)

SPECIFICATION FOR 300-mm BOTTOM-OPENING STANDARD

MECHANICAL INTERFACE (SMIF)

NOTICE: This document was balloted and approved

for withdrawal in 2003.

NOTICE: Hewlett-Packard has patent coverage for this

concept and is offering non-exclusive licenses on an equal

basis to any company. Companies intending to manufacture

products to this standard should be aware of Hewlett-

Packard' s position.

The user’s attention is called to the possibility that

compliance with this standard may require use of an

invention covered by patent rights. By publication of

this standard, Semiconductor Equipment and Materials

International (SEMI) takes no position with respect to

the validity of any patent rights asserted in connection

with any item mentioned in this document. Users of this

document are expressly advised that determination of

any such patent rights, and the risk of infringement of

such rights are entirely their own responsibility.

1 Purpose

This standard specifies a standard interface for

containers intended to control the transport environment

of contained wafers. The interface must address the

proper container orientation for material transfer and

maintain continuity between the container and

equipment environment in order to control particulate

and non-particulate contamination.

2 Scope

This specification describes an approach to interfacing

a clean transport container (pod) to a clean

environmental housing on a piece of semiconductor

processing equipment or to other clean environments.

The system concept involves mating a pod door to a

port door in an equipment interface and transferring the

wafers into, and out of, the equipment without exposing

the wafers to outside contamination.

The incorporation of this standard may require

equipment designers to include the features of the

interface into the tool design. Spacing between

equipment interface ports must be considered when

incorporating this interface. Designers are directed to

the recommendations made in SEMI E15.1 in this

regard.

This standard is specific to the size of the designated

wafer and references the appropriate Semiconductor

Equipment and Materials International (SEMI) cassette

and wafer diameter. This specification focuses on

applications in which the interface port is positioned

horizontally.

3 Referenced Documents

3.1 SEMI Standard

SEMI E15.1 — Provisional Specification for 300-mm

Tool Load Port

4 Terminology

(See Figure 1 for a pictorial depiction of most terms.)

Figure 1

Port Terminology

SEMI E19.5-0996 © SEMI 1978, 2003 2

4.1 box — A protective portable container for a

cassette and/or substrate(s) (as defined in SEMI E44).

4.2 cassette — An open structure that holds one or

more substrates (as defined in SEMI E44).

4.3 horizontal datum plane — A plane that is parallel

to the floor and coincides with the tool interface

surface. A more detailed definition will be included in a

companion document currently under development.

4.4 guide rail — A component of a port plate that

provides coarse and final location for placing the pod

on the port assembly.

4.5 hold-down latch — A mechanism for securing the

pod to the port plate.

4.6 kinematic socket (pod door) — Grooves in the

bottom of the pod door that fit over kinematic pins on

the top of the port door when the pod is placed on the

port door.

4.7 kinematic pins (port door) — Pins that provide

fixed position and orientation between the port door and

pod door. The kinematic pins fit into the kinematic

sockets in the bottom of the pod door.

4.8 latch pins — Pins that engage the pod door latch

and accomplish the pod door lock/unlock functions.

Latch pins are carried by the port door.

4.9 pod — A box having a Standard Mechanical

Interface (as defined in SEMI E19, SEMI E44).

4.10 pod door — A removable bottom for the pod that

contains a means for properly positioning the wafer

cassette.

4.11 pod lock — A mechanical latch that holds the pod

door to the pod until activated by the latch mechanism

pins. Upon activation, the pod door is released from the

pod.

4.12 port assembly — An assembly of the port plate

and port door.

4.13 port door — A door for the port plate opening that

provides a mating surface for the bottom of the pod

door when the pod is in place on the port plate. The port

door contains the kinematic location pins and the pod

door latch pins.

4.14 port plate — A horizontal mating surface for the

base of the pod that provides a seal surface for the

bottom surface of the pod perimeter. The port plate

contains the guide rails and the pod hold-down latches.

5 Requirements

(See Table 1 for 300 mm (12-inch) port dimensions.)

Table 1 Port Dimensions for 300 mm (12-inch) Wafer Cassette

Port Door: A1 185.00 mm rad. ± 0.13 mm (7.283 in. rad. ± 0.005 in.)

Guide Rails: B1 208.71 mm rad. ± 0.13 mm (8.217 in. rad. ± 0.005 in.)

B2 106.00 mm ± 0.13 mm (4.190 in. ± 0.005 in.)

B3 119.00 mm ± 0.13 mm (4.690 in. ± 0.005 in.)

B4 25.00 mm max. (0.984 in. max.)

B5 70.0 mm max. (2.75 in. max.)

Latch Pins: C1 16 deg. ± 0 deg. 30 min. (16 deg. ± 0 deg. 30 min.)

C2 86 deg. ± 0 deg. 30 min. (86 deg. ± 0 deg. 30 min.)

C3 26.72 mm dia. ± 0.05 mm (1.052 in. dia. ± 0.002 in.)

C4 3.175 mm dia. ± 0.025 mm (0.125 in. dia. ± 0.001 in.)

C5 ----------- ----------

C6 9.14 mm ± 0.25 mm (0.360 in. ± 0.010 in.)

C7 Full Spherical Radius Full Spherical Radius

Pod Hold-Down Latches: D1 22.10 mm ± 0.25 mm (0.870 in. ± 0.010 in.)

D2 10 deg. ± 0 deg. 30 min. (10 deg. ± 0 deg. 30 min.)

Pod in Place Sensor: E1 26.92 mm ± 0.25 mm (1.060 in. ± 0.010 in.)

E2 12.70 mm ± 0.25 mm (0.500 in. ± 0.010 in.)

Activation Height: E3 4.32 mm min. (0.170 in. min.)

Latch Pin Force (Torque): F1 8.08 kg cm min. (7 lbs. in. min.)

17.27 kg cm max. (15 lbs. in. max.)