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SEMI E20-0697 © SEMI 1991, 2002 5 Figure R1-2 Example: EMO Connect/ D isconnect Circ ui t(Module Pow er is “off,” as drawn . ) NOTICE : The user’s attention is called to th e possibility that compliance with this standar…
SEMI E20-0697 © SEMI 1991, 2002 4
Figure R1-1
Example: AC Distribution/EMO Block Diagram
SEMI E20-0697 © SEMI 1991, 2002 5
Figure R1-2
Example: EMO Connect/Disconnect Circuit(Module Power is “off,” as drawn.)
NOTICE: The user’s attention is called to the possibility that compliance with this standard may require use of an
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SEMI E21-94 © SEMI 1991, 2002 1
SEMI E21-94 (Reapproved 1102)
CLUSTER TOOL MODULE INTERFACE: MECHANICAL INTERFACE
AND WAFER TRANSPORT STANDARD
This standard was technically reapproved by the Global Physical Interfaces & Carriers Committee and is the
direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition
reapproved by the North American Regional Standards Committee on July 21, 2002. Initially available at
www.semi.org October 2002; to be published November 2002. Originally published in 1991; previously
published in June 1999.
1 Purpose
1.1 The purpose of the standard is to simplify cluster
tool implementation in the fab. Equipment suppliers are
required to provide modules that can be connected into
any cluster tool using the specifications contained
herein.
1.1.1 Process and cassette modules accept wafers at
locations that may vary substantially from one module
to another. This places a burden on the capabilities of
transport modules to move wafers to and from various
modules in a cluster tool. This specification defines
wafer transport planes within cassette and process
modules. This obviates the wafer transport problem to a
large extent, but does not unduly restrict module
content.
2 Scope
2.1 The standard defines the interface plane between
modules in a cluster tool. It provides the mechanical
specifications at the interface that allow modules from
different suppliers to be connected together; no
requirements are imposed on the module content.
2.1.1 The standard is limited to wafers which are 200
mm (~ 8 in.) in diameter or smaller and to the interface
between cluster tool modules, with the following
exception. The transport module operates across the
interface plane; thus, a definition of the wafer transport
plane within cassette and process modules is required.
2.2 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety health practices and determine the
applicability or regulatory limitations prior to use.
3 Impact
3.1 The adoption of the standard requires cluster tool
equipment designers to limit the wafer transport height
to a nominal value at the interface plane between two
modules. It also requires equipment designers to assure
that wafer transport planes within cassette and process
modules be clear for wafer transport. The transport
module requires the capability for a minimum reach
outside the module across the interface plane. Modules
may be connected using a quick connect/disconnect
clamping system. Constraints are placed on sealing
surfaces.
4 Referenced Standards
ISO 1609-1986 (E)
1
— “Vacuum Technology — Flange
Dimensions,” International Organization for
Standardization (ISO).
5 Terminology
5.1 Definitions
5.1.1 cassette module — a two-port module. One port
accepts or presents a cassette of wafers or possibly, in
an automated factory, an individual wafer for intertool
transport; the second port accepts or presents a single
wafer within the module for intratool transport.
5.1.2 cluster tool — an integrated, environmentally
isolated manufacturing system consisting of process,
transport, and cassette modules mechanically linked
together. The modules may or may not come from the
same supplier.
5.1.3 environmental isolation — separated from the
ambient atmospheric environment.
5.1.4 interface plane — the vertical surface defined by
the mating surfaces of two joined modules.
5.1.5 interface seal zone — an absolute surface or face
reserved for establishing an environmental seal between
modules.
5.1.6 intertool transport — wafer or cassette
movement between independent tools.
5.1.7 intratool transport — wafer movement inside a
cluster tool.
5.1.8 module — an independently-operable unit that is
part of a tool or system.
1 International Organization for Standardization, ISO Central
Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,
Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30
Website: www.iso.ch