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SEMI E21-94 © SEMI 1991, 2002 4 Figure 1 Module Interface with Wafer Trans p ort and Placement Detail (Plan View)

SEMI E21-94 © SEMI 1991, 2002 3

provided in the O-ring flange face as shown in Figure 1

and specified in Figure 3. Alignment pin height above

the flange face is 6 mm (0.24 in.) minimum to 8 mm

(0.31 in.) maximum (see Section R1-6).

6.2.4 Isolation Valves — The transport module is

always equipped with a valve for environmental

isolation at each module interface plane. The intratool

transport port on a process or cassette module may be

equipped with an environmental isolation valve (see

Section R1-7).

6.3 Flange — A flange is specified as 162 mm (6.378

in.) by 340 mm (13.386 in.). One horizontal edge is

specified to be 50 mm (1.969 in.) from the alignment

pins’ centerline (see Figure 4).

6.3.1 Clamping — Clamping grooves as specified in

the International Standards Organization document,

Vacuum Technology, Flange Dimensions (ISO 1609-

1986), Table 2, nominal bores 40 mm-250 mm (1.575

in.Ð9.843 in.) are located at the flange perimeter (see

groove detail in Figure 4). Clamps for ISO flanges can

be used to generate the force necessary to produce an

environmental seal (see Section R1-8).

6.3.2 Non-Flanged Surfaces — A non-flanged surface

may be used to join with a flanged surface. An

attachment means to engage the flange must be

provided. If a flanged adaptor piece is necessary to join

two non-flanged surfaces, then the adaptor piece shall

be located on the process or cassette side of the

interface plane.

LIST OF FIGURES

Figure 1 — Module Interface with Wafer Transport and

Placement Detail (Plan View)

Figure 2 — Wafer Transport Plane Elevation

Figure 3 — Interface Plane

Figure 4 — Flange Specification

Figure 1

Module Interface with Wafer Transport and Placement Detail (Plan View)

Figure 2

Wafer Transport Plane Elevation

Figure 3

Interface Plane