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SEMI E1.9-0701 E2 © SEMI 1994, 2004 1 SEMI E1.9-0701 E2 MECHANICAL SPECIFICATION FOR CASSETTES USED TO TRANSPORT AND STORE 300 mm WAFERS This specification was technically approved by the Gl obal Ph ysical Interfaces &am…

SEMI E1.5-91 © SEMI 1984, 2003 2

Figure 6

150 mm Plastic & Metal Wafer Carrier General Usage

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SEMI E1.9-0701

MECHANICAL SPECIFICATION FOR CASSETTES USED TO

TRANSPORT AND STORE 300 mm WAFERS

This specification was technically approved by the Global Physical Interfaces & Carriers Committee and is

the direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition

approved by the North American Regional Standards Committee on March 22 and April 30, 2001. Initially

available at www.semi.org May 2001; to be published July 2001. Originally published in 1994; previously

published June 1999.

This document was editorially modified in January 2003 to reflect the withdrawal of SEMI E44. Changes

were made to Sections 3.1, 4.2, 4.4, and 4.17. This document was also editorially modified in May 2004 to

reflect the withdrawal of SEMI E19.5. Changes were made to Section 7.1.

1 Purpose

1.1 This standard specifies the cassettes used to

transport and store 300 mm wafers in an IC

manufacturing facility. This includes both manual and

auto-transport use as well as high-speed extraction of

the wafers in processing equipment.

2 Scope

2.1 This standard is intended to set an appropriate level

of specification that places minimal limits on

innovation while ensuring modularity and

interchangeability at all mechanical interfaces. Most of

the requirements given in this specification are in the

form of maximum or minimum dimensions wit very

few required surfaces. Only the mechanical interfaces

for cassettes are specified; no materials requirements or

micro-contamination limits are given. However, this

standard has been written so that both metal and

injection-molded plastic cassettes can be manufactured

in conformance with it.

2.2 The cassette has the following components and

sub-components, and other features. A “† ” symbol

indicates components or features that include

dimensions required for boxes with non-removable

cassettes.

Key:

• Required feature

◊ Optional feature

• 1 top domain

• 2 optical wafer sensing paths

◊ 4 robotic handling flanges (optional)

◊ 1 top cassette identification tag area (optional)

• 2 or 4 side domains (2 in front and 2 in rear, if

needed)

• supports (for 13 or 25 wafers) with correct wafer

pitch (10 mm) †

• 1 optical cassette sensing hole on each front side

domain

◊ 1 side cassette identification tag area on front

right side domain only (optional)

◊ features that prevent wafer creep-out

(optional)

◊ 2 pentagonal side grip pits on each front side

domain (optional)

• 1 bottom domain

• 2 optical wafer sensing paths

• 5 carrier sensing pads †

• 4 info pads †

• 1 pod latch-pin hole

• 2 conveyor rails

• 2 fork-lift pick-up areas

• 2 fork-lift pin holes

• 3 features that mate with kinematic coupling pins

and provide a 10 mm lead in †

◊ 3 features that mate with kinematic coupling

pins and provide a 15 mm lead in (optional)

◊ 1 bottom cassette identification tag area

(optional)

• Other features

• multiple horizontal wafer sensing paths

• 2 end-effector exclusion zones †

3 Referenced Documents

3.1 SEMI Standards

SEMI E15 — Specification for Tool Load Port

SEMI E1.9-0701

SEMI E19 — Standard Mechanical Interface (SMIF)

SEMI E57 — Provisional Mechanical Specification for

Kinematic Couplings Used to Align and Support 300

mm Wafer Carriers

4 Terminology

4.1 bilateral datum plane — a vertical plane that

bisects the wafers and that is perpendicular to both the

horizontal and facial datum planes (as defined in SEMI

E57).

4.2 box — a protective portable container for a cassette

and/or substrate(s).

4.3 carrier capacity — the number of substrates that a

carrier holds.

4.4 cassette — an open structure that holds one or

more substrates.

4.5 cassette bottom domain — volume (below z6 above

the horizontal datum plane) that contains the bottom of

the cassette.

4.6 cassette sensing pads — surfaces on the bottom of

the cassette for triggering optical or mechanical sensors.

4.7 cassette side domains — volumes (from z6 above

the horizontal datum plane to z15 above the top

nominal wafer seating plane) that contain the mizo teeth

or slots that support the wafer and the supporting

columns on the sides and rear of the cassette.

4.8 cassette top domain — volume (higher than z15

above the top wafer) that contains the top of the

cassette.

4.9 conveyor rails — parallel edges on the bottom of

the cassette for supporting the cassette on roller

conveyors.

4.10 facial datum plane — a vertical plane that bisects

the wafers and that is parallel to the front side of the

carrier (where wafers are removed or inserted). On tool

load ports, it is also parallel to the load face plane

specified in SEMI E15 on the side of the tool where the

carrier is loaded and unloaded (as defined in SEMI

E57).

4.11 fork-lift slots — rectangular holes (open to the

front and rear) in the bottom of the cassette for picking

up the cassette with a fork.

4.12 front-opening unified pod (FOUP) — a box (that

complies with SEMI E47.1) with a non-removable

cassette (so that its interior complies with SEMI E1.9)

and with a front-opening interface (that mates with a

FIMS port that complies with SEMI E62) (as defined in

SEMI E47.1).

4.13 horizontal datum plane — a horizontal plane from

which projects the kinematic-coupling pins on which

the carrier sits. On tool load ports, it is at the load

height specified in SEMI E15 and might not be

physically realized as a surface (as defined in SEMI

E57).

4.14 nominal wafer center line — the line that is

defined by the intersection of the two vertical datum

planes (facial and bilateral) and that passes through the

nominal centers of the seated wafers (which must be

horizontal when the carrier is placed on the coupling)

(as defined in SEMI E57).

4.15 nominal wafer seating plane — horizontal plane

that bisects the wafer pick-up volume.

4.16 optical wafer sensing paths — lines of sight for

optically sensing the positions of the wafers. Several

horizontal optical wafer sensing paths are present in

between the cassette side domains. In addition, two

vertical optical wafer sensing paths are created by

rectangular exclusion zones in the front of the cassette

top and bottom.

4.17 pod — a box having a Standard Mechanical

Interface (SMIF) per SEMI E19.

4.18 process batch — a set of substrates that are

processed simultaneously in a process chamber.

4.19 robotic handling flanges — four horizontal

projections on top of the cassette for lifting and rotating

the cassette.

4.20 sensor hole — an indentation on the bottom of the

cassette for inserting optical sensors.

4.21 side grip pits — two rectangular indentations on

each side of the cassette for lifting and rotating the

cassette.

4.22 transport group — a set of substrates that are

transported together between tools.

4.23 virtual tracking unit — an entity (which could be

a number of substrates or an individual die or mask

group) that the factory floor control system treats as a

single unit for tracking purposes.

4.24 wafer carrier — any cassette, box, pod, or boat

that contains wafers (as defined in SEMI E15).

4.25 wafer extraction volume — the open space for

extracting a wafer from the cassette.

4.26 wafer pick-up volume — the space that contains

entire bottom of a wafer if the wafer has been pushed to

the rear of the cassette.

4.27 wafer set-down volume — the open space for

inserting and setting down a wafer in the cassette.