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SEMI E33-94 © SEM I 1994 6 APPENDICES The appendices are not an of ficial part of this standard. Ho wever, they co nta in re leva nt i nfor mati on for customizing the bas ic standards for testing of semiconductor equipm…

SEMI E33-94 © SEMI 1994, 19965

ELF emissions shall be measured using a calibrated

ELF meter. Equipment emissions shall be measured at a

distance of 1.5 meters from the entire perimeter of the

EUT at a height of 1 meter. Facility ELF shall be

measured at a height of 1 meter in the region where

ELF-sensitive equipment installation is intended.

Measurement points shall be no greater than 0.5 meter

apart in the regions specified above. Facilities electrical

systems and adjacent equipment should be in normal

operation to assure accurate measurement of the actual

operating environment.

At each measurement point, the ELF sensor should be

oriented to produce the maximum reading. The

maximum from all the measurement points is then used

to determine the level from the table below:

Level A — ELF of less than 0.25 milliGauss rms

Level B — ELF of less than 0.50 milliGauss rms

Level C — ELF of less than 1.00 milliGauss rms

Level D — ELF of less than 2.00 milliGauss rms

Level E — ELF of 2.00 milliGauss rms and greater

6 Equipment Installation and Grounding

Special installation, power, and grounding requirements

necessary to meet this standard shall be thoroughly

documented by the equipment supplier. FIPS

Publication 94 and the IEEE Emerald Book are

suggested sources of information for recommended

practices in this area.

Removable shielded panels or doors that must be

properly secured to meet this standard should be labeled

“SECURE THIS PANEL TO REDUCE

ELECTROMAGNETIC EMISSIONS.” This labeling

requirement is not applicable to interlocked panels that

must be in place for the equipment to operate.

7 Documentation

Upon request of the purchaser a report of the test results

against this standard shall be furnished. Similarly, the

supplier may use this standard as a reference in

specifying the environmental requirements of

equipment.

8 Alternate Testing

Testing completed under a different, but substantially

similar standard may be substituted for the basic

standards specified herein if the performance criteria

and test levels are similar to those above. Such

substitution shall be noted in the test report, and must

be agreed to by the concerned parties. Examples

include substitution of ANSI C63.4-1991 testing for

CISPR 22.

Similarly, equipment which satisfies the European

EMC Directive and bears the CE mark meets this

specification.

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

SEMI E33-94 © SEMI 1994 6

APPENDICES

The appendices are not an official part of this standard.

However, they contain relevant information for

customizing the basic standards for testing of

semiconductor equipment and facilities, and point out

areas of concern for which no standard currently exists.

A.1 Appendix A: Charged Wafer Testing

Due to overriding microcontamination concerns, non-

static-dissipative wafer carriers must be used during

semiconductor fabrication. It is suggested that any

equipment which handles wafers be tested with wafers

charged to 18 kV/in. The charge generator used for

801-2 testing can be used to charge the wafer. Some

experimentation will be required to determine the best

means to carry out this test. Alternately, the handling

mechanism may be challenged by air or contact

discharge directed to the mechanism.

It is suggested that wafer handlers be designed to

dissipate charge on incoming wafers in a controlled,

non-sparking manner. A simple AM radio tuned

between stations and placed near the handler has been

found to be a good qualitative means to detect sparking.

Sparking will result in pops and static being heard on

the radio.

A.2 Appendix B: ESD Test Methods

Although the contact method of ESD testing has been

found to be much more reproducible than the air

discharge, the air discharge is a more realistic

simulation of possible events that can occur in the

semiconductor factory. Also, the air discharge method

is the only realistic way to test objects that are primarily

fabricated from insulators, such as wet stations and

keyboards.

In addition to testing surfaces that come in contact with

humans and wafers, it is important to test any area of

the equipment that can be exposed to ESD. For

instance, wet stations are composed of assemblies

involving large masses of insulators in proximity to

metallic sensors and controllers. It is possible for the

insulating surfaces to build up charge, which then

sparks to a sensor or controller — all internal to the

equipment itself.

A.3 Appendix C: Future Directions

Items in this section are not requirements of this

standard, but are included to indicate currently ill-

defined goals for further improvements to

semiconductor factory EMC.

A.3.1 Static Charge — Minimization of static charge

promotes cleanliness, and avoids damage to material in

process and reticles.

It is suggested that electrostatic fields be held to under

200 V/cm (500 V/in). This would be applicable to

personnel, wafers, cassettes, cassette boxes, reticles,

reticle boxes, and all equipment and facility surfaces in

proximity to these items as well as all surfaces exposed

to filtered airflow. Measurements shall be made using a

properly-grounded electrostatic field meter in

accordance with its manufacturer's instructions.

A.4 Appendix D: National Requirements

A.4.1 U.S. — Section 5.1.1 Table 1, row 1.2: Radiated

immunity testing outside a shielded enclosure is legally

accomplished by obtaining an experimental license

from the FCC using FCC form 442. The FCC

recommends using techniques such as scanning or

hopping to avoid interference.

A.4.2 Europe — The earth port: Refer to Table 1.6 of

the informative annex to EN 50 082-2 for test

requirements applicable to the earth.

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E34-95 © SEMI 19951

SEMI E34-95

GUIDELINE FOR MASS FLOW DEVICE RETURN

NOTICE: This safety guideline does not purport to

address all of the safety issues associated with its use. It

is the responsibility of the users of this guideline to

establish appropriate safety and health practices and

determine the applicability of regulatory limitations

prior to use.

1 Purpose

Mass flow devices (mass flow controllers, mass flow

meters and flow control valves) are used as an integral

part of the chemical delivery system in semiconductor

processing equipment. Many of the chemicals used in

semiconductor processes can be hazardous to

equipment and personnel. Once exposed to these

chemicals, the contaminated mass flow devices can

present a hazard to repair personnel and equipment if

not handled properly.

Implementing the procedures outlined in this guideline

provide a mechanism to reduce the risk associated with

shipping and/or receiving any potentially hazardous

mass flow device used to monitor or control gases or

liquids.

2 Scope

This guideline is intended to:

Recommend and encourage the purging of devices used

with hazardous materials prior to removal to reduce the

risk of handling them.

Alert the recipient of possibly hazardous mass flow

devices to the nature of the hazard.

Establish mechanism for properly identifying and

documenting possibly hazardous mass flow devices by

using an orange tag and a health and safety disclosure

form.

3 Referenced Documents

49 CFR

— Title 49 of the Code of Federal

Regulations (CFR)

NFPA 704

— Standard System for the Identification

of Fire Hazards of Materials

1 United States Government Printing Office, Washington, D.C. 20402

2 National Fire Protection Association, Batterymarch Park, Quincy,

MA 02269

4 Terminology

4.1 hazardous materials — Those chemicals or

substances that are physical hazards or health hazards

as defined and classified in NFPA 704 whether the

materials are in use or in waste conditions.

4.2 mass flow controller (mfc) — A self-contained

device, consisting of a mass flow transducer, control

valve, and control- and signal-processing electronics,

commonly used in the semiconductor industry to

measure and regulate the mass flow of gas.

4.3 mass flow meter (mfm) — A self-contained device,

consisting of a mass flow transducer and signal-

processing electronics, commonly used in the

semiconductor industry to measure the mass flow of

gas.

4.4 material safety data sheet (msd s) — Written or

printed material concerning a hazardous material which

is prepared in accordance with the provisions of 29

CFR 1910.1200.

4.5 protective container — A sealable plastic bag or

other container which will keep hazardous material

from the mass flow device from contaminating the

outer package. The container should be transparent, if

possible.

4.6 purge — To dilute potentially harmful material in

the mass flow device by flowing an inert gas through

the device. Purging a chemical delivery line containing

a mass flow device with an inert substance is intended

to dilute hazardous materials and reduce the level of the

hazard. To be effective, the inert substance must be able

to reach all points within the chemical delivery system

in sufficient quantity to dilute the hazardous material to

safe levels. The nature of the hazard and the physical

configuration of the chemical delivery system must be

considered when developing a purge procedure.

4.7 safe — Free of conditions that can cause

occupational illness, injury, or death to personnel or

damage to or loss of equipment or property or the

environment.

5 Procedure

5.1 Disclosure Form

• Complete the disclosure form for mass flow device

return.

• Send the completed form via Fax or other suitable

method to the recipient of the mass flow device.