semi合集-English.pdf - 第2607页

SEMI E91-0600 © SEMI 1999 , 2000 12 ......... PARA M_RECORD00:str ucture cla ss name / clas s name/proc ess pr ogram rec ord name ......... PARAM_RECO RDnn:structure cla ss name/class na me/process progra m record name 8…

SEMI E91-0600 © SEMI 1999, 200011

7.4 Data Item Variable Table

Table 7 Data Item Variable Table

Variable Name Description Class Format Comments

StopUnit Constant which specifies separation of stop

operation in probing.

ECV U1 0=Unit of Die

1=Unit of Wafer

2=Unit of Cassette

3=Unit of Lot

EventJobID Prober Job ID which occurs Prober Job state

transition.

DVVAL A[30] Valid when Prober Job state

transition occurs.

EventJobState Current state of Prober Job whose state changed. DVVAL U2 Valid in event of Prober Job

state transition.

ResultData Processing result in unit of one wafer. DVVAL L[n] Valid only in wafer end event.

8 Process Program Manage ment

8.1 PSEM explains how to specify a process program for the prober and the process program control between the

host and prober.

8.2 Process Program Requirements

8.2.1 The PSEM requires that the G EM capability of process program management be fully supported for this class

of prober.

8.3 Process Program

8.3.1 The process program of the prober consists of the main process program and two or more sub process

programs that are referred to by the main process program.

Table 8 Kinds and Descriptions of Process Programs

Kind Description

Product type master record Master process program for processing.

Sub-parameter record Sub-process program for processing.

Various kinds of parameter records that consist main process program for processing.

8.3.2 These process programs are controlled by the prober with grouped into different categories according to

application purposes and structures. The prober defines PPID with “structure class name/class name/process

program record name.” The number of PPID digits is defined by an equipment supplier. If the number of the digits

is less than a default value, left-justify and fill in space after PPID. Do not use space at some midpoint in PPID. At

present, the prober practically uses the structure class name and class name as shown in the table given below.

Table 9 How to Operate Class Name and Structural Class Name

Classification Operation Remarks

Structural class name Class name indicating major classification of process program record. Defined by supplier.

Class name Class name indicating attribute of process program record. Defined by supplier.

8.4 Master Process Program Reco rd

8.4.1 The master process program re cord is a plain text (ASCII) record like below:

DEVICE:xxxxxxxx

WAFER_SIZE:xx

DIE_SIZE:xxxxxx,xxxxxx

SEMI E91-0600 © SEMI 1999, 2000 12

.........

PARAM_RECORD00:structure class name/class name/process program record name

.........

PARAM_RECORDnn:structure class name/class name/process program record name

8.4.1.1 Each line has a structure:

TAG + ":" + parameter(s) + line terminator

8.4.1.2 The line terminator is some of CR+LF (0x0d0a), CR (0x0d), LF (0x0a).

8.4.1.3 Specific parameters of equipment supplier may be put between "HOT_CHUCK_TOLE" and

"PARAM_FILE00".

Table 10 Tag Parameters in Master Process Program

Tag Description Format Unit

PRODID Product name (i.e., Device type) A[1,24] -

WAFER_SIZE Wafer size A[1,3] mm

DIE_SIZE_X Die size X A[1,6] micron

DIE_SIZE_Y Die size Y A[1,6] micron

MULTI_DIE Multi probing number A[1,3] -

REFERENCE_DIE_COORD_X Reference die coordinator X A[1,4] -

REFERENCE_DIE_COORD_Y Reference die coordinator Y A[1,4] -

OVER_DRIVE Over drive value A[1,4] micron

FLAT_ANGLE Flat orientation A[1,3] degree

FLAT_TYPE FLAT or NOTCH A[1,5] -

HOT_CHUCK Flag of hot chuck usage A[2,3]

“ON” or “OFF”

HOT_CHUCK_TEMP Hot chuck temperature A[1,4] Celsius

HOT_CHUCK_TOLE Hot chuck tolerance A[1,3] Celsius

PARAM_RECORDnn Sub-parameter record nn A[ ] -

9 Map Data

9.1 This section defines handling o f map data in the PSEM equipment. The contents of map data are not defined

here. The specification in this section is provisional. This will be revised in the near future.

9.2 Use of Map Data

9.2.1 Map data is divided into two groups: result data which is reported to the host when processing of each wafer

is completed and instruction data which is instructed by the host in a unit of wafer at the time of re-inspection or

marking.

9.3 Structure of Map Data

9.3.1 The map data has a list structu re and the result data is defined by class <DVVAL> and the instruction data is

defined by <CEPVAL>.

9.3.1.1 Example:

L,n

1. <Data

SEMI E91-0600 © SEMI 1999, 200013

n. <Data

9.4 Uploading (Reporting) Result Data

9.4.1 Result Data is reported by S6,F11 upon completion of the inspection in each wafer.

9.4.1.1 Example:

L,3

1. <DATAID>

2. <CEID>:Wafer End

3. L,a

1. L,2

1. <RPTID1>

2. L,7

1. <LOTID>

2. <PROCID>

3. <IDTYP>

4. <MID>

5. <ROWCOLCT>

6. <REFDIEPOS>

7. <ResultData>

a. L,2

1. <RPTIDa>

2. L,b

1. <LOC>

2. <PRODID>

3. <WAFSIZE>

4. <FLATTYPE>

5. <FLATANGL>

6. <REFDIECOORD>

7. <BINLIST>

b. <Vb>

9.5 Downloading Instruction Data

9.5.1 If the past inspection result is required in processing a wafer, the equipment obtains instructed data from the

host in the following procedure.

Comment Host Equipment Comment

Transfer a wafer.

The equipment is ready to receive

previous result data for a wafer

concerned.



S6,F11 “Waiting Previous Data (wait for

reception of previous result data)” event

report.

Check event. S6,F12



Instruction data download

(PRE-DATA_DOWNLOAD)

S2,F49





S2,F50 Reception response.

The processing is performed based on

instruction data.