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SEMI E98-1102 © SEMI 2000, 2002 21 Material Location Consumables Location Substrate Location Carrier Location Process Durable Location Figure 11 MaterialLocati on Subtypes 10.4.4.5 MaterialLocati on Object — Fig ure 12 s…

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SEMI E98-1102 © SEMI 2000, 2002 20
Abstract
Equipment
Subsystem
held at
Material
Location
Material
provides
Abstract
EquipmentModule
Equipment
Subsystem
Figure 10
AbstractEquipmentSubsystem Subtypes
10.4 AbstractEquipmentSubsystem Object
10.4.1 The AbstractEquipmentSubsystem is a subtype
of AbstractEquipmentElement and inherits all of its
attributes and services. It may have associated
MaterialLocations to hold Material.
AbstractEquipmentSubsystem represents all subsystem
and subassembly components of which the equipment
is made up. The AbstractEquipmentSubsystem may or
may not be capable of holding material and may or may
not have recipe execution capability.
10.4.2 Figure 10 shows the relationships of the
EquipmentSubsystem.
10.4.3 Material Object
10.4.3.1 An AbstractEquipmentSubsystem may or may
not be able to hold material. Those that are able to hold
material owns any material that it holds at any given
point in time. They are expected to know the type of
material that they hold, whether material is present, and
the identifier of the material. In some cases, the
AbstractEquipmentSubsystem may be able to hold
multiple units of material or more than one type of
material.
10.4.3.2 There are three major subtypes of material
objects: consumables, durables, and substrates, where
the major subtypes of durables are carriers and process
durables.
10.4.3.3 Consumable materials, such as chemicals, are
used up (as opposed to worn out) during the
manufacturing process.
10.4.3.4 Durable material has a significant lifetime and
is not part of the equipment (is removable). It includes
material that some equipment may require to operate.
The subtype of durable of common interest to almost all
equipment is carrier. A carrier is a durable used to hold
substrates. Process durables are of special interest to a
limited subset of equipment. A process durable is an
identifiable durable that is specified for a certain
process step and recipe. For example, reticles are
identified by product id and the mask level where used,
and they are also identified by serial number. The
factory is very interested in the management and
tracking of process durables.
10.4.3.5 Product is typically a Substrate. In the
semiconductor industry, Substrates include Wafer, Die,
and Leadframe. Reticles are considered a Substrate by
some equipment. In the semiconductor industry,
reticles are considered as a process durable rather than a
product. Specific reticles are specified in recipes for
expose tools and modules. In other industries,
substrates include flat panel (for flat panel displays) and
discs (for hard disk drives).
10.4.3.6 Material objects are not formally defined in
OBEM. Carrier objects are defined in SEMI E87
(CMS) and substrate objects are defined in SEMI E90
(STS).
10.4.4 Material Locations
10.4.4.1 A material location is a place that is capable of
holding material.
10.4.4.2 A MaterialLocation is an abstraction used to
facilitate the tracking of material without regard to the
physical component associated with the tracking
location. For example, a substrate chuck is a subsystem
and can hold a single substrate on its surface. The
entire subsystem consists of a stage that may or may not
be able to move. It may use vacuum to hold the
substrate in place, and it may have additional
mechanisms and sensors. The MaterialLocation only
represents the surface of the chuck. For this reason, the
EquipmentSubsystem is said to provide a
MaterialLocation rather than to be made up of
MaterialLocations through aggregation.
10.4.4.3 This relationship is illustrated in Figure 11.
10.4.4.4 The MaterialLocation object is an abstract
type. Figure 11 shows the subtypes of
MaterialLocations of interest to OBEM.
SEMI E98-1102 © SEMI 2000, 2002 21
Material
Location
Consumables
Location
Substrate
Location
Carrier
Location
Process
Durable
Location
Figure 11
MaterialLocation Subtypes
10.4.4.5 MaterialLocation Object — Figure 12 shows the attributes of the MaterialLocation that are defined in
Table 6. Every subtype of MaterialLocation shall have, at a minimum, attributes showing its current state and the
ID of any material present.
LocationState
MaterialType
MaterialID
Material
Location
Figure 12
MaterialLocation Object Type
Table 6 MaterialLocation Attribute Definitions
Attribute Name Definition Access Reqd Form
ObjType Object type RO Y Text=“MatlLoc”
ObjID Object identifier RO Y Text
LocationState Current state. RO Y Enumerated:
Occupied
Unoccupied
MaterialType Type of material held. RO Y Enumerated: One of, or a subtype of, the following
Consumable
Carrier
Substrate
ProcessDurable
MaterialID Identifier of any material that
occupies the location.
RO Y Text. “Unknown” if identifier is not known. Null
(empty) string if location is unoccupied.
10.4.4.6 CarrierLocation Object — The CarrierLocation attribute LocationState may allow an additional
enumeration Not Aligned, as shown in Table 7.
Table 7 CarrierLocation Attribute Definitions
Attribute Name Definition Access Reqd Form
ObjType Object type RO Y Text=“CarrierLoc”
ObjID Object identifier RO Y Text
LocationState Current state. RO Y Enumerated:
Occupied
Unoccupied
Not aligned
SEMI E98-1102 © SEMI 2000, 2002 22
10.4.4.7 SubstrateLocation Object — The SubstrateLocation object is defined in SEMI E90 (STS). STS defines
SubstID as an attribute of SubstrateLocation. Note this is identical to MaterialID in the general case for
MaterialLocation.
10.4.5 AbstractEquipmentSubsystem Requirements
10.4.5.1 AbstractEquipmentSubsystems may or may not be able to hold material.
10.4.5.2 The AbstractEquipmentSubsystem owns all of the MaterialLocations that it provides or that are provided
by one of its components. Similarly, it owns all of the Material at those MaterialLocations.
10.4.6 AbstractEquipmentSubsystem Type — Figure 13 shows the diagram for the AbstractEquipmentSubsystem
object.
Abstract Equipment
Subsystem
MaterialSummary
AddElement
RemoveElement
Figure 13
AbstractEquipmentSubsystem Object Type
10.4.7 AbstractEquipmentSubsystem Attributes
10.4.7.1 Table 8 defines the attributes of the AbstractEquipmentSubsystem.
Table 8 AbstractEquipmentSubsystem Attribute Definition
Attribute Name Definition Access Reqd Form
ObjType Object type RO Y Text=“AbstractEqpSubsystem”
ObjID Object identifier RO Y Text
MaterialSummary List of specifications of material
capacity and current status for
each type of material.
RO N List of
structure composed of
MaterialType, MaterialCapacity, and MaterialCount.
10.4.7.2 Table 9 defines individual elements of AbstractEquipmentSubsystem attributes.
Table 9 Definition of Elements of MaterialSummary Attribute
Element Name Definition Access Reqd Form
MaterialCapacity Number of units of material that can be held at one
time.
RO Y Unsigned integer.
MaterialCount Current number of units of material present. RO Y Unsigned integer.
MaterialType Specifies the type of material held. RO Y Text. Conforms to SEMI E5.
10.4.8 AbstractEquipmentSubsystem Services
10.4.8.1 Add Element
10.4.8.1.1 The user may be able to instruct the equipment to add a specific type of AbstractEquipmentElement. The
supplier may restrict this service to specific AbstractEquipmentElement subtypes, both in destination (the
AbstractEquipmentElement accepting the addition) and in the added element. This is an optional service.