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SEMI E127-0705 © SEMI 2003, 2005 5 SEMI E32 — Material Movement Manag ement (MMM) SEMI E39 — Object Se rvices Standard : Co ncepts, Beha vior, a nd Services SEMI E40 — Standard for Processing M anagem ent SEMI E41 — Exce…

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1 Purpose
1.1 Integrated Measurement
1.1.1 The purpose of integrated measurement (metrology or inspection) is to facilitate intra-equipment process
monitoring through rapid access to measurement data, reduce material handling between process and measurement
equipment, and the opportunity to increase process monitoring with minimal or no decrease in throughput. The
benefits of integrated measurement also allow Advanced Process Control systems to use the results with reduced
feedback lag time.
1.2 Specification for the Integrated Measurement Module Communications (IMMC)
1.2.1 The purpose of the IMMC specification is to provide an object-based specification of an Integrated
Measurement Module together with a standard interface between an integrated measurement module and its control
and data ports where these are commonly implemented by different suppliers. The interface allows access to the
properties and services of specific objects. This will facilitate the effort needed for the integration of the module into
a larger system.
1.2.2 An additional purpose of this standard is to provide sufficient information through a combination of on-line
services and interface documentation that an IMMC-compliant integrated measurement module may be integrated
with multi-module equipment without requiring a software change in either the module or the equipment. This may
require configuration changes made by the end-user through the equipment user interface where certain options are
left to the module supplier.
2 Scope
2.1 Scope of This Document
2.1.1 The Integrated Measurement Module Communications specification covers concepts, behaviors, and services
to be provided by a metrology or inspection module so that it may be integrated into production equipment intended
for large substrates processing. However, nothing should preclude its application to smaller substrate
manufacturing.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
3 Limitations
3.1 Host/Integrated Equipment Interface
3.1.1 This specification does not apply to the communications interface between the host and integrated equipment.
3.2 Object-Based Implementation
3.2.1 Compliance to this standard does not require object-oriented implementation. However, it does require the
appearance of implentation of those objects defined in this document.
3.3 In-Situ Processing
3.3.1 This specification applies only to measurement components that are contained within a module that provides
its own material handling and does not measure during a process step. Interactions with in-situ measurement
components are expected to differ significantly from the current specification.
4 Referenced Standards and Documents
4.1 SEMI Standards
SEMI E5 — SEMI Equipment Communications Standard 2 Message Content (SECS-II)
SEMI E30 — Generic Model for Communications and Control of Manufacturing Equipment (GEM)
SEMI E30.5 — Specification for Metrology Specific Equipment Model (MSEM)
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SEMI E32 — Material Movement Management (MMM)
SEMI E39 — Object Services Standard: Concepts, Behavior, and Services
SEMI E40 — Standard for Processing Management
SEMI E41 — Exception Management (EM) Standard
SEMI E42 — Recipe Management Standard: Concepts, Behavior, and Message Services
SEMI E53 — Event Reporting
SEMI E58 — Automated Reliability, Availability, and Maintainability Standard (ARAMS): Concepts, Behavior,
and Services
SEMI E90 — Specification for Substrate Tracking
SEMI E98 — Provisional Standard for the Object-Based Equipment Model (OBEM)
SEMI E116 — Provisional Specification for Equipment Performance Tracking
SEMI E120 — Provisional Specification for the Common Equipment Model (CEM)
SEMI M20 — Specification for Establishing a Wafer Coordinate System
4.2 Other Sources
Unified Modeling Language (UML) Specification, Version 1.4, OMG Specification 01-09-67, available from
http://www.omg.org/technology/documents/modeling_spec_catalog.htm.
uuid: ISO/IEC 11578:1996 Information technology - Open Systems Interconnection – Remote Procedure Call
(RPC),
http://www.iso.ch/cate/d2229.htm.
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
5 Terminology
NOTE 1: Terms defined in §5 that are used in other definitions have been underlined
.
5.1 Abbreviations and Acronyms
5.1.1 IMM — Integrated Measurement Module
5.1.2 IMMC — Specification for Integrated Measurement Module Communications: Concepts, Behavior, and
Services
5.1.3 IMMDTOSM — IMM Data Table Object State Model
5.1.4 SLOSM — Substrate Location Object State Model (SEMI E90)
5.1.5 STPO — Substrate Transfer Path Object, an abstraction of the IMM capability to load and unload substrates
into the IMM.
5.1.6 STPOSM — Substrate Transfer Path Object State Model
5.2 Definitions
5.2.1 array, n. — an ordered list of numeric values. A valid data type for table row entries.
5.2.2 conversion recipe, n. — a recipe or portion of a recipe that describes the steps required for taking
measurement data and reporting a result. This does not need to be a physically separate recipe.
5.2.3 error message, n. — a notification to the user/client that an error has occurred. It may or may not be
associated with an alarm. Note: depending upon the communication protocol, error messages may or may not be
treated differently from normal collection events.
5.2.4 inspection, n. — an examination of an area of material to detect anomalies.
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5.2.5 inspection module, n. — a measurement module that inspects substrates and reports information regarding
anomalies. Inspection modules may determine the location of anomalies relative to a coordinate system and may
also provide other types of data related to the anomaly.
5.2.6 integrated measurement module, n. — a measurement module intended to be integrated into manufacturing
equipment, and with the capability of receiving substrates from the equipment, measuring those substrates, and
returning the substrates and the measurement results to the equipment and other concerned clients.
5.2.7 measurement module, n. — an equipment module whose intended function is to measure or inspect the
product and to report the results. Measurement of the product is the factory’s means of gaining feedback on the
manufacturing process.
5.2.8 measurement recipe, n. — a recipe or portion of a recipe intended for use during a measurement, that
describes among other things the locations for measurement. This does not need to be a physically separate recipe.
5.2.9 metrology module, n. — a measurement module that collects and reports information on specific
predetermined locations or features on a substrate with consistent data structure, or reports general information
about the entire substrate.
5.2.10 object-based, adj. — a programming language, or database, is called object-based if it supports the concept
of data abstraction, but partly or entirely lacks more advanced concepts such as class, inheritance, polymorphism,
and so on. [Oestereich, Bernd, “Developing Software with UML,” Addison-Wesley (1999)]
5.2.11 substrate context information, n. — information concerning the substrate that may be useful to for analysis,
such as process flow step, substrate orientation, the identifier of the process equipment/chamber most likely to have
affected results, the recipe run on that equipment/chamber, etc.
5.2.12 substrate orientation, n. — the angle of rotation from normal. For wafers, this is the angle of rotation from
the primary fiducial.
6 Conventions
6.1 Object Conventions
6.1.1 This document conforms to the conventions for objects established by SEMI E39, including object diagrams,
object terminology, and requirements for standardized objects. However, the notation used for object diagrams is
the Universal Modeling Language (UML) notation (see ¶4.2 for additional detail).
6.1.2 Formal Name of an Object — The text capitalizes formal object name references, similar to the way
capitalization is normally used when discussing entities. When describing something in the general (like cities)
lower case is used, but when a specific entity is of interest (New York City), then first letters are capitalized. Where
words are concatenated, they retain their capitalization to enhance readability.
6.1.3 Object Attributes — Attribute tables define those public attributes that can be read and set through the basic
OSS services GetAttr and SetAttr. Simple attributes have a single data type as their value. Complex or compound
attributes are made up of an ordered set of other elements, either a list or a structure. See SEMI Compilation of
Terms for the definition of “form” for both the list of valid data type formats and for the different types of formats
themselves.
6.1.4 Attribute Definitions — Attributes are formally defined in an attribute definition table with the following
form:
Attribute Name Definition Access Reqd Form
The formal name of the
attribute.
Defines the requirements of the
attribute.
RO or RW Reqd or
Optional
Data type: see SEMI E39 ¶4.5.
Complex attributes must declare the
order of their components.
6.1.5 Complex Attribute Data — The individual data items of Complex attributes are defined in a separate Attribute
Definition Table as individual attributes. However, these data items are not Attributes and the SEMI E39 GetAttr
and SetAttr services are not valid for them.