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SEMI E49.4-0298 © SEMI 1995, 1998 1 SEMI E49.4-0298 GUIDE FOR HIGH PURITY SOLV ENT DISTRIBUTION SYSTE MS IN SEMICONDUCTOR M ANUFA CTURI NG EQUIPMENT 1 Purpose 1.1 Thi s docum ent specifies gui de l i nes for h igh purity…

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SEMI E49.2-1104 © SEMI 1995, 2004 8
10.7.2 To avoid the cost involved in performing the
Particle test (Section 9.4) and Ionic and Metallic
Contamination tests (Section 9.5) on every Assembly
delivered directly to an end user, Assemblies shall be
selected which represent all unique components and
production techniques. The Assemblies will be
certified as meeting the requirements within Table 1
based on the outcome of the representative tests and a
periodic testing program.
10.7.3 Particular attention and increased testing
frequency are recommended for Assemblies that
include components not covered by SEMI F57.
10.7.4 The supplier of an Assembly shipped directly to
an end user should specify which components do, and
which components do not, comply with SEMI F57
where SEMI F57 is applicable.
10.8 The certification program for Assemblies not
delivered directly to an end user will specify the
frequency of testing and the test Assembly(s).
10.8.1 To avoid the cost involved in performing
Hydrostatic testing (Section 9.2), the Ultrapure Water
Flush test (section 9.3), the Particle test (Section 9.4)
and the Ionic and Metallic Contamination tests (Section
9.5) on every Assembly, test Assemblies shall be
selected which represent all unique components and
production techniques. The Assemblies will be
certified as meeting the requirements of Table 1 based
on the outcome of the representative tests and periodic
testing program. Particular attention and increased
testing frequency are recommended for Assemblies that
include components not covered by SEMI F57.
10.8.2 The supplier chain should specify which
components do, and which components do not, comply
with SEMI F57 where SEMI F57 is applicable.
11 Supply Chain Traceability
11.1 It will be the responsibility of all Assembly
suppliers to verify that all components covered by
SEMI F57 comply with the specifications set forth in
SEMI F57.
11.2 It will be the responsibility of all Assembly
suppliers to ensure that all components have been
handled and assembled in accordance with the
recommendations set forth in SEMI E49.7.
11.3 It will be the responsibility of all Assembly
suppliers to maintain records that show all assemblies
comply with Section 10 of this document.
11.4 It will be the responsibility of all Assembly
suppliers to ensure that their sources of Assemblies are
controlled to the extent that they support the
requirements within Section 10.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer's instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E49.4-0298 © SEMI 1995, 19981
SEMI E49.4-0298
GUIDE FOR HIGH PURITY SOLVENT DISTRIBUTION SYSTEMS IN
SEMICONDUCTOR MANUFACTURING EQUIPMENT
1 Purpose
1.1 This document specifies guidelines for high purity
(HP) solvent distribution systems in semiconductor
production equipment.
2 Scope
2.1 The distribution systems consi st of stainless steel
(SS) piping designed to supply flammable solvents
only.
2.2 Typical processes are photolithography track
equipment, solvent wet stations, and isopropyl alcohol
vapor dryers.
3 Referenced Documents
3.1 SEMI Standards
SEMI E49 — Guide for Standard Performance,
Practices, and Sub-Assembly for High Purity Piping
Systems and Final Assembly for Semiconductor
Manufacturing Equipment
SEMI E49.6 — Guide for Subsystem Assembly and
Testing Procedures - Stainless Steel Systems
SEMI F1 — Specification for Leak Integrity of High-
Purity Gas Piping Systems and Components
3.2 ASTM Standards
1
See Section 3.3 of SEMI E49.
3.3 ASM Document
2
ASM UNS S31603 — Composition of Standard
Stainless Steels
3.4 ASME Document
3
ASME SA479 — Specification for Stainless and Heat-
Resisting Steel Bars and Shapes for Use in Boilers and
Other Pressure Vessels (ASTM A 479/A 479-90)
(Boiler and Pressure Vessel Codes, 1989)
4 Terminology
See Section 4 of SEMI E49.
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohoken, PA 19428-2959
2 American Society of Metals, Metals Park, OH 44073
3 American Society of Mechanical Engineers, 345 East 47th Street,
New York, NY 10017
5 Performance Guidelines
5.1 Leak Test and Purity Indices
5.1.1 Pressure Decay Test
• Test Media — Nitrogen (N
2
)
• Pressure — 2 times system operating pressure
• Time — 24 hours
• Temperature — Constant
• Fail-Pressure Loss — > 1% of test pressure
5.1.2 N
2
Particle Count (ptc), at ≥ 0.2 µm Size
• < 0.18 ptc/L (< 5 ptc/ft
3
) average single count
• < 1.8 ptc/L (< 50 ptc/ft
3
) maximum single count
5.2 All performance measures are absolute values,
relative to respective test instrument background level.
5.3 See SEMI E49.6 for recomme nded gas system
testing procedures.
5.4 Reliability and Maintainability Indices —
Equipment supplier should provide actual gas system
performance data and/or component reliability data,
accompanied by the associated failure analysis method.
Indices Hours
Mean time between failure (MTBF)
Mean time between assists (MTBA)
Mean time to repair (MTTR)
Start-up time (Initial)
6 Design Guidelines
6.1 All weld joints should be automatically orbital butt
welded.
6.2 Mechanical fittings should be used where required
for component removal/replacement.
6.3 Dead volumes should be less than five pipe
diameters in length/height. Pressure gauges with gauge
protectors should be used. Pressure transducers are
optional.
6.4 A means of process liquid sampling should be
installed as close as possible to point of dispense.
SEMI E49.4-0298 © SEMI 1995, 1998 2
6.5 Incoming process liquids require filters and should
be located downstream of any regulator and as close as
possible to point of dispense.
6.6 Design should include a means of flow through
flushing and draining for removable components or
assemblies.
6.7 Pumping systems should include surge/pulse
suppression devices and provisions for vibration
isolation.
6.8 Supply and drain lines on a recirculation system
should be separated by an isolation valve. The system
should not use one line to perform both functions.
6.9 All filters should be able to be isolated from
process stream for maintenance.
6.10 Backflow/back pressure protection should be
included in the system.
6.11 For processes requiring pressu re control,
regulators should be included in the system.
6.12 The system should have a means of manifolding
supply and drain lines onboard, so that there is a single
point connection for each individual liquid.
7 Materials Guidelines
7.1 Material Mechanical Characte ristics - Stainless
Steel
7.1.1 All tubing greater than or equal to 1.27 cm (1/2
in.) diameter should conform to ASTM A 269.
7.1.2 Tubing less than 1.27 cm (1/2 in.) diameter
should conform to ASTM A 632.
7.1.3 All bar stock should conform t o ASTM A 479 or
ASME SA479.
7.1.4 All steel should conform to ASM UNS S31603
for chemical composition with the following
exceptions:
• Sulfur as reported by the SMTR ≤ 0.030%
• Carbon as reported by the SMTR ≤ 0.030%
7.2 Stainless steel should be 316L electropolished for
solvent system wetted flow streams or as specified by
the customer.
7.3 Materials for valve seats, diaphragms, gaskets, and
O-rings should be chemically compatible to the process
liquid.
7.4 Material Performance Guidelines
7.4.1 The performance guidelines below are SS
qualification values to be demonstrated by the original
component manufacturer. Semiconductor equipment
suppliers should provide proof that their components
conform to these requirements.
7.4.2 The performance tests should be considered
production qualification tests. It is the responsibility of
the component manufacturer to provide statistically
significant data which correlates their production tests
to these qualification tests (e.g., Statistical Process
Control, MIL-STD-105D).
7.4.3 The equipment supplier should be responsible
for maintaining and supplying, upon request,
documentation that proves their components meet the
user’s materials performance requirements.