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SEMI E130-1104 © SEMI 2003, 2004 2 SEMI M21 ― Specification for Assigning Addresses to Rectangular Elements in a Cartesian Array 4.2 IEEE Standards 1 IEEE 754-1985 – IEEE Standa rd for Binary Floating- Point Arithmetic 4…
SEMI E130-1104 © SEMI 2003, 2004 1
SEMI E130-1104
SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL FOR
300 mm ENVIRONMENT (PSEM300)
This specification was technically approved by the Global Information & Control Committee and is the direct
responsibility of the North American Information & Control Committee. Current edition approved by the
North American Regional Standards Committee on September 3, 2003. Initially available at www.semi.org
October 2003; to be published November 2003.
NOTICE: The designation of SEMI E130 was updated during the 1104 publishing cycle to reflect the
creation of SEMI E130.1.
1 Purpose
1.1 This document establishes a Prober Specific
Equipment Model for prober equipment deployed in a
factory adhering to the Global Joint Guidance for 300
mm standards (PSEM300). The PSEM300 consists of
equipment characteristics and behaviors that apply to
this class of equipment and are required to be
implemented. The intent of this document is to
facilitate the integration of prober equipment into an
automated semiconductor factory. This document
accomplishes this by defining an operational model for
prober equipment as viewed by a host. This definition
provides a standard host interface and equipment
operational behavior.
2 Scope
2.1 The PSEM300 extends the generic Process State
Model of SEMI E30 (GEM) with a Specific Process
State model for prober equipment. This standard
attempts to be protocol independent. There is no
attempt to replace the protocol dependent aspects of
SEMI E30 (GEM). Instead, this document assumes that
certain equipment features not covered within the
concepts and behaviors of the related 300 mm standards
will be supported using the concepts and behaviors
defined within SEMI E30. See Section 9 for a
description of the SEMI E30 provisions.
2.2 This document does not attempt to define the full
set of equipment capabilities. It is understood that
additional value-added features will be provided in
addition to the requirements set forth in this document.
2.3 This document intends host-instructed indexing of
sites within a substrate and the loading/unloading of the
substrates. Automated self-indexing with such
communications as GPIB or RS-232C between tester
and prober equipment is outside the scope of this
specification but is not precluded. See the Related
Information section for reference.
2.4 This document does not describe much about
recovery of exception or manual operation to recover
from alarm / potential-alarm (warning) situations. Such
conditions are usually configuration specific.
2.5 This standard presents a solution from the concepts
and behavior down to the messaging services. It does
not define the messaging protocol.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 This document does not define the format of each
data item specified in the equipment recipe.
3.2 This document does not define a communications
protocol. In order to implement this specification, it
requires a standard communications protocol and data
format specification.
4 Referenced Standards
4.1 SEMI Standards
SEMI E5 — SEMI Equipment Communication
Standard II Message Content (SECS II)
SEMI E30 — Generic Model for Communications and
Control of Manufacturing Equipment (GEM)
SEMI E40 — Standard for Processing Management
SEMI E42 — Recipe Management Standard: Concepts,
Behavior, and Message Services
SEMI E87 — Specification for Carrier Management
(CMS)
SEMI E90 — Specification for Substrate Tracking
SEMI E94 — Provisional Specification for Control Job
Management
SEMI G81 ― Specification for Map Data Items
SEMI G85 ― Specification for Map Data Format
SEMI M20 ― Specification for Establishing a Wafer
Coordinate System
SEMI E130-1104 © SEMI 2003, 2004 2
SEMI M21 ― Specification for Assigning Addresses to
Rectangular Elements in a Cartesian Array
4.2 IEEE Standards
1
IEEE 754-1985 – IEEE Standard for Binary Floating-
Point Arithmetic
4.3 Other Documents
Harel, D., “Statechart: A Visual Formalism for
Complex Systems”, Science of Computer Programming
8 (1987) 231-274.
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
5 Terminology
5.1 Definitions
5.1.1 alignment — a procedure in which a coordinate
system is established on a substrate.
5.1.2 cassette — a physical object containing one or
more substrate locations. See SEMI E87.
5.1.3 chuck — the primary stage for processing a
substrate.
5.1.4 column — synonymous with the term “X-
coordinate”. Columns increase along the X axis.
5.1.5 die — 1. A field sub-unit. 2. An area of substrate
that contains the device being manufactured.
5.1.6 fiducial – flat or notch in the physical substrate
used to identify the substrate orientation.
5.1.7 inker — a resource of the prober. The
electromechanical units to put ink mark on die.
5.1.8 load — 1. Move a substrate onto a substrate
location. 2. Move a carrier onto the equipment.
5.1.9 marking — the process of the prober that
deposits an ink mark on a die using the inker.
5.1.10 pre-align – set up a substrate to be processed on
the chuck. The equipment may have a separate stage
for performing the pre-align function.
5.1.11 probe card — the electromechanical interface
necessary to enable temporary electrical contact
between the substrate to be tested and the tester
resource. May consist of multiple components.
5.1.12 pipeline – an equipment configuration
consisting of multiple stages through which the
equipment sequences material in succession.
1 Institute of Electrical and Electronics Engineers, IEEE Operations
Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, New Jersey
08855-1331, USA. Telephone: 732.981.0060; Fax: 732.981.1721,
Website: www.ieee.org
5.1.13 row — synonymous with the term “Y-
coordinate”. Rows increase along the Y axis.
5.1.14 stage – a general term for a substrate location
that serves a specific function such as pre-align or
chuck.
5.1.15 state — 1. A static set of conditions. If the
conditions are met, the state is current (SEMI E30). 2.
A state reacts predictably to specific stimuli.
5.1.16 substrate — 1. The basic unit of material,
processed by PSEM300 equipment such as wafers.
5.1.17 unload — 1. Remove a substrate from a
substrate location. 2. Remove a carrier from the
equipment.
5.1.18 X axis — the X axis is the horizontal axis from
left to right when the substrate is rotated according to
Orientation.
5.1.19 Y axis — the Y axis is the vertical axis from
bottom to top when the substrate is rotated according to
Orientation.
SEMI E130-1104 © SEMI 2003, 2004 3
6 Conventions
6.1 Remote Command Parameter Table Definitions
6.1.1 The table below provides an example of the tables used to list and describe arguments for services or remote
commands defined in this specification.
Parameter Req/Ind Rsp/Cnf Form Comment
(see below) (see below)
6.1.2 Parameter – Specifies the name of the parameter.
6.1.3 Req/Ind – Specifies relationship of the parameter for the command request or indication message. See below
table for codes used.
6.1.4 Rsp/Cnf – Specifies relationship of the parameter for the command response or confirmation message. See
below table for codes used.
6.1.5 Form – Specifies the data type of the parameter. Data types are as defined in the SEMI compilation of terms
or are included in this specification. Specific representation of the data types will depend on and be defined by the
communications protocol and data format adjunct specification.
6.1.6 The following codes appear in the Req/Ind and Rsp/Cnf columns to define how each parameter is used in each
direction:
M Mandatory Parameter – Must be given a valid value.
C Conditional Parameter – May be defined in some circumstances and undefined in others. Whether a
value is given may be completely optional or may depend on the value of the other parameter.
U User-Defined Parameter
- The parameter is not used.
= (for response only) Indicates that the value of this parameter in the response must match that in the
primary (if defined).
7 Requirements
7.1 Following sections in this document, except such supplementary descriptions as Related Information, are
requirements of this specification.
8 State Model
8.1 The purpose is to define the equipment-specific processing state model to portray the expected operational
states of the equipment to enable host tracking and control in place of a local operator. Process Job Management
standard (SEMI E40) is part of the required behavior of this document as described in Section 9. For additional
description of this behavior see Section 10 or See the actual standard, SEMI E40.
8.1.1 The Process State model tracks the state of the equipment with regard to its ability to perform processing on a
substrate. The Process State model is used to inform the host when a substrate is loaded on the main chuck and has
been properly setup for processing.
8.1.2 It is expected that the prober will be preparing a substrate to be loaded on the main chuck while the host is
processing an existing substrate on the main chuck. This concurrent activity does not impact the host’s ability to
process the existing substrate and therefore does not cause a change in the Process State model. The standard for
Substrate Tracking (SEMI E90) is used for tracking substrates between individual substrate locations.
8.1.3 The processing state model in this document is required for implementing a PSEM300-compliant prober, in
addition to the required state models in the related standards. A state model consists of a state model diagram, state
definitions, and a state transition table. A state model represents the host’s view of the prober, but not necessarily
the actual prober operations. All PSEM300 state model transitions shall be mapped sequentially into the actual