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SEMI E130-1104 © SEMI 2003, 2004 18 1) Equipm ent offsets that match the performance of seve ra l pieces of equipment that would otherwi se perfor m differently due to inherent manufacturing differences. Examples are hom…

SEMI E130-1104 © SEMI 2003, 2004 17

19.2 Collection Event Table

19.2.1 Table 3 shows events and reports required for the PSEM300 process state transition. Table 4 shows other

collection events.

Table 3 Collection Events Required by Process State Transition

Transition Transition

No.

Current State New State Typical Variable Data

1 No state

6 HANDLING MATERIAL

Into IDLE

18 IDLE WITH ALARMS

IDLE

Into IDLE with ALARMS 17 IDLE IDLE with ALARMS Alarm Id

2 IDLE

Into SETTING UP

7 HANDLING MATERIAL

SETTING UP

3 SETTING UP

Into AWAITING LOAD

5 HANDLING MATERIAL

AWAITING LOAD

4 AWAITING LOAD

Into HANDLING

MATERIAL

9 AWAITING COMMAND

HANDLING MATERIAL

8 HANDLING MATERIAL

11 MOVING XYZ

X, Y,Z

Into AWAITING

COMMAND

13 SERVICE TASK

AWAITING COMMAND

X,Y,Z, Task Result

Into MOVING XYZ 10 AWAITING COMMAND MOVING XYZ

12 AWAITING COMMAND

Into SERVICE TASK

14 SERVICE TASK

SERVICE TASK Task Id

Into PROCESSING

BLOCKED

15 PROCESS PROCESS BLOCKED

Conditional 16 PROCESSING BLOCKED PROCESS

Table 4 Additional Collection Events

Event Name Contents Typical Variable Data

CleaningMediaDepleted The cleaning media has been depleted. Cleaning media identifier

InkingMediaDepleted The inking media has been depleted.

ProbeCardRemoved The probe card has been removed from the prober. ProbeCardId

ProbeCardInstalled The probe card has been installed on the prober. ProbeCardId

ControlMapCompleted The prober has completed indexing to each of the sites

identified in the control map.

20 Data Item Variables

20.1 The purpose of this section is to define the list of data item variables required by the PSEM300. Values of

these variables will be available to the host through collection event reports and host status queries.

20.2 Requirements

20.2.1 All generic variable data items defined in GEM are required by all PSEM300 equipment. Any supplier-

defined variables shall be documented in the same format used by this document. The following minimum

information is required:

20.3 Data Types

20.3.1 Equipment constants remain in effect until they are overwritten either by manual entry or by a “New

Equipment Constant Send” remote command. Equipment constants have various uses in PSEM300, including the

following:

SEMI E130-1104 © SEMI 2003, 2004 18

1) Equipment offsets that match the performance of several pieces of equipment that would otherwise perform

differently due to inherent manufacturing differences. Examples are home values and motion axis scaling

factors.

2) Setting the configuration of the equipment to allow for different material specifications, equipment options,

material flows, frequency of automatic functions, etc.

3) Managing optional machine features. Examples are constants that tell the system whether optional substrate ID

readers are present and control the configuration and function of these optional subsystems when they are

present.

20.3.2 Status Variables are valid at all times. A status variable may not be changed by the host but may be

changed by the equipment or operator. The value of the status variables may be queried by the host at anytime using

the “Selected Equipment Status Request” remote command (See SEMI E30). Data variables are variables that are

valid only upon the occurrence of specific collection events. An attempt to read a data variable at the wrong time

will not generate an error, but the data reported may not have relevant meaning.

20.3.3 Data Types and Sizes

Table 5 Data Types and Sizes

Type Size Definition

String 0–32767 A string of ASCII characters from zero to “Size” characters in length.

Integer 1,2,4 An integer value that may be represented by “Size” bytes. E.g. If size=2 then the value may be

–32768 to 32767.

Float 4 IEEE single-precision 32-bit floating point type [IEEE 754-1985]

Boolean 1 True or False

Table 6 Composite Data Types

Data Type Definition Comments

DieCoordinate Structure composed of:

XCoordinate

YCoordinate

Structured data used to specify die locations on a substrate

XCoordinate Integer Coordinate in the X direction (column)

YCoordinate Integer Coordinate in the Y direction (row)

20.4 Data Item Variable Table

Table 7 Data Item Variable Table

Variable Name Data Type Size Description Comments

ContactCount Integer 2 The number of times the probe card has come

in contact with a substrate.

This value is reset when the host issues

the SET-PROBE-CARD-ID or RESET-

CONTACT-CNT remote commands.

This data item must be available for the

host to query at all times.

DieXCoordinate Integer 2 The coordinate of the die in the x direction

(column).

Any event associated with the movement

of the chuck requires this variable.

DieYCoordinate Integer 2 The coordinate of the die in the y direction

(row).

Any event associated with the movement

of the chuck requires this variable.

DieZPosition Float 4 The position of the Chuck Z-axis in microns. A

user/supplier defined unit of measure other than

microns is permissible and must be

documented.

Any event associated with the movement

of the chuck requires this variable.

DieZCoordinate Integer 2 The coordinate of the die in the z direction. 0:DOWN, 1:UP

InspectionResult Boolean 1 Result of the last inspection. True:PASS, False:FAIL

Variable Name Data Type Size Description Comments

MinXStep Float 4 The minimum step size in microns in the X

direction.

MinYStep Float 4 The minimum step size in microns in the Y

direction.

MinZStep Float 4 The minimum step size in microns in the Z

direction (Alternative user-defined unit of

measure may be specified for the Z motion).

ProbeCardId String 25 The ID of the Probe Card

TaskID String 50 The ID of the service task being performed. Must be available when a Service Task is

being performed.

21 Recipe Management

21.1 PSEM300 does not attempt to specify how recipes are stored on the equipment or the internal structure of a

recipe. Recipe parameters must be available for query by the host. The equipment must support process tuning as

defined in SEMI E40.

21.2 Recipe Setup Parameters contains the minimum set of recipe attributes required by PSEM300. It is expected

that additional parameters will be used to reflect the capabilities of the specific equipment configuration and

technologies available for use.

21.3 Recipes and Process Programs

21.3.1 Recipes and Process Programs are considered to be the same in this document. The recipe of the prober

consists of the main recipe with optional service recipes referenced within the main recipe.

21.4 Recipe Requirements

21.4.1 The PSEM300 requires that the GEM capability of recipe management be fully supported for this class of

equipment. The Process Job specifies the recipe to be executed.

Table 8 Recipe Setup Parameters

Tag Data Type Size Description Unit

ProdId String 50 Product name (i.e., Device type) -

WaferSize Integer 2 Wafer size millimeters

DeviceSizeX Float 4 Die size X microns

DeviceSizeY Float 4 Die size Y microns

MatrixSizeX Float 4 Matrix size X. For non-matrix substrates, this attribute is equal to

StepSizeX.

microns

MatrixSizeY Float 4 Matrix size Y. For non-matrix substrates, this attribute is equal to

StepSizeY.

microns

MatrixDeviceRows Integer 2 The number of device rows within an expsosure field. For non-

matrix substrates, this attribute = 1. This attribute is dependant

on the Orientation attribute.

MatrixDeviceCols Integer 2 The number of device columns within an exposure field. For

non-matrix substrates, this attribute = 1. This attribute is

dependant on the Orientation attribute.

StepSizeX Float 4 Step Size X. This attribute is dependant on the Orientation

attribute.

microns

StepSizeY Float 4 Step Size Y. This attribute is dependant on the Orientation

attribute.

microns

ReferenceDeviceX Integer 2 X coordinate of the reference device. This attribute is dependant

on the Orientation attribute.

Column