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SEMI E130-1104 © SEMI 2003, 2004 20 Tag Data Type Size Description Unit ReferenceDeviceY Integer 2 Y coor dinate of the reference device. This attribute is dependant on the Orientation attribute. Row RefDevicePosX Float …

SEMI E130-1104 © SEMI 2003, 2004 19

Variable Name Data Type Size Description Comments

MinXStep Float 4 The minimum step size in microns in the X

direction.

MinYStep Float 4 The minimum step size in microns in the Y

direction.

MinZStep Float 4 The minimum step size in microns in the Z

direction (Alternative user-defined unit of

measure may be specified for the Z motion).

ProbeCardId String 25 The ID of the Probe Card

TaskID String 50 The ID of the service task being performed. Must be available when a Service Task is

being performed.

21 Recipe Management

21.1 PSEM300 does not attempt to specify how recipes are stored on the equipment or the internal structure of a

recipe. Recipe parameters must be available for query by the host. The equipment must support process tuning as

defined in SEMI E40.

21.2 Recipe Setup Parameters contains the minimum set of recipe attributes required by PSEM300. It is expected

that additional parameters will be used to reflect the capabilities of the specific equipment configuration and

technologies available for use.

21.3 Recipes and Process Programs

21.3.1 Recipes and Process Programs are considered to be the same in this document. The recipe of the prober

consists of the main recipe with optional service recipes referenced within the main recipe.

21.4 Recipe Requirements

21.4.1 The PSEM300 requires that the GEM capability of recipe management be fully supported for this class of

equipment. The Process Job specifies the recipe to be executed.

Table 8 Recipe Setup Parameters

Tag Data Type Size Description Unit

ProdId String 50 Product name (i.e., Device type) -

WaferSize Integer 2 Wafer size millimeters

DeviceSizeX Float 4 Die size X microns

DeviceSizeY Float 4 Die size Y microns

MatrixSizeX Float 4 Matrix size X. For non-matrix substrates, this attribute is equal to

StepSizeX.

microns

MatrixSizeY Float 4 Matrix size Y. For non-matrix substrates, this attribute is equal to

StepSizeY.

microns

MatrixDeviceRows Integer 2 The number of device rows within an expsosure field. For non-

matrix substrates, this attribute = 1. This attribute is dependant

on the Orientation attribute.

MatrixDeviceCols Integer 2 The number of device columns within an exposure field. For

non-matrix substrates, this attribute = 1. This attribute is

dependant on the Orientation attribute.

StepSizeX Float 4 Step Size X. This attribute is dependant on the Orientation

attribute.

microns

StepSizeY Float 4 Step Size Y. This attribute is dependant on the Orientation

attribute.

microns

ReferenceDeviceX Integer 2 X coordinate of the reference device. This attribute is dependant

on the Orientation attribute.

Column

SEMI E130-1104 © SEMI 2003, 2004 20

Tag Data Type Size Description Unit

ReferenceDeviceY Integer 2 Y coordinate of the reference device. This attribute is dependant

on the Orientation attribute.

Row

RefDevicePosX Float 4 Offset of the center of the reference device in the X-direction

from the center of the substrate.

microMeters

RefDevicePosY Float 4 Offset of the center of the reference device in the Y-direction

from the center of the substrate.

microMeters

RefDeviceMatrixX Integer 2 X coordinate of the reference device within an exposure field.

For non-matrix substrates, this attribute = 1. This attribute is

dependant on the Orientation attribute.

RefDeviceMatrixY Integer 2 Y coordinate of the reference device within an exposure field.

For non-matrix substrates, this attribute = 1. This attribute is

dependant on the Orientation attribute.

Overdrive Float 4 Over drive value microns

UseControlMap Boolean 1 Probe locations defined in control map. -

Orientation Integer 2 Fiducial (flat or notch) orientation. Defines the Orientation used

to describe the substrate geometries. The substrate may be loaded

onto the equipment chuck with an orientation established by the

OrientationOnChuck attribute. OrientationOnChuck does not

impact the substrate coordinate references.

Degree

OriginLocation Integer 2 Reference Quadrant: 0 = Center, 1 = Upper Right, 2

= Upper Left 3 = Lower Left (default), 4 = Lower Right

OrientationOnChuck Integer 2 Fiducial (flat or notch) orientation of the substrate loaded onto the

chuck. Coordinate references are not impacted by this attribute.

FiducialType Integer 2 0 = NOTCH, 1 = FLAT -

UseHotChuck Boolean 1 Flag set to indicate the use of temperature control. -

HotChuckTemperature Integer 2 Hot chuck temperature. This attribute applies when the

“UseHotChuck” attribute is set to TRUE.

Celsius

HotChuckTolerance Integer 2 Hot chuck tolerance. This attribute applies when the

“UseHotChuck” attribute is set to TRUE.

Celsius

Rows Integer 2 The number of rows of devices on the substrate. For a row to be

included, a row must contain at least one complete device.

Columns Integer 2 The number of columns of devices on a substrate. For a column

to be included, a column must contain at least one complete.

22 Remote Commands

22.1 The purpose of this section is to identify remote commands, command parameters, and valid commands versus

states in the processing state models.

22.2 Requirements

22.2.1 All the remote commands defined by PSEM300 are required.

22.2.2 The GEM remote commands START, STOP, PAUSE, ABORT, RESUME, PP-SELECT and RCP-SELECT

are not used.

22.2.3 The alphanumeric strings defined by PSEM300 for remote commands and command parameters are

required.

22.2.4 If additional remote commands are supported, then the “Remote Command Versus Valid States” matrix must

be generated for these additional commands. Place an “X” in the table for each state in which a given command is

valid.

22.3 Remote Commands Descriptions

22.3.1 CLEAN-PROBES — This command causes the probe cleaning routine to be executed. The recipe will

contain sufficient settings to identify the cleaning processes. If there is more than one cleaning process defined, each

must be identified with a name. If The Process State model was in the AWAITING COMMAND state when the

CLEAN-PROBES command was issued, and the cleaning task requires the substrate to be removed from the chuck,

the Process State model will transition to the SERVICE TASK state the substrate will be suspended. When the

cleaning task is completed, a suspended substrate must be restored to the chuck and the chuck will be returned to the

pre-task coordinates prior to the transition from SERVICE TASK to AWAITING COMMAND.

Parameter Req/Ind Rsp/Cnf Form Comment

RemoteCommand M - Text “CLEAN-PROBES”

Cleaning Process C - Text The name of the cleaning process that is to be performed.

If there is only one cleaning process defined, this

parameter may be omitted.

Die List M - List of type

DieCoordinate,

see Data Types

and Sizes.

List of probe sites to be cleaned. Zero length list indicates

that all sites should be cleaned.

Ack - M Integer Service Acknowledgement.

22.3.2 INDEX — This command is used in conjunction with Control Maps. The USE CONTROL MAP recipe

attribute must be set to TRUE. The INDEX command causes the prober to move the chuck to the next unprocessed

site contained in the control map.

Parameter Req/Ind Rsp/Cnf Form Comment

RemoteCommand M - Text “INDEX”

Ack - M Integer Service Acknowledgement.

22.3.3 INK-DEVICE — This command causes the current die location to be inked.

22.3.3.1 The Process State model transitions to the SERVICE TASK state. When the task is completed, the Process

State model transitions from the SERVICE TASK to AWAITING COMMAND state.

Parameter Req/Ind Rsp/Cnf Form Comment

RemoteCommand M - Text “INK-DEVICE”

Ack - M Integer Service Acknowledgement.

22.3.4 INK-DIE — This command causes the die locations contained in the die-list to be inked. Optionally, the

host can specify a control map containing the sites to be inked.

22.3.4.1 The Process State model transitions to the SERVICE TASK state. When the task is completed, the chuck

is returned to the pre-task coordinates and the Process State model transitions from the SERVICE TASK to

AWAITING COMMAND state.

Parameter Req/Ind Rsp/Cnf Form Comment

RemoteCommand M - Text “INK-DIE”

Die List C - List of type

DieCoordinate,

see Data Types

and Sizes.

List of die sites to be inked.

Control Map C - Text Control Map Identifier

Either Die List or Control

Map must be supplied.

Ack - M Integer Service Acknowledgement.