semi合集-English.pdf - 第332页
SEMI E49.5-0298 © SEMI 1995, 1998 2 6.7 D esign shoul d include a mean s of flow through flushin g and drain ing for removable compon ents or assembl ies. 6.8 P umping systems sho uld inclu d e surge/p ulse suppres sion …

SEMI E49.5-0298 © SEMI 1995, 19981
SEMI E49.5-0298
GUIDE FOR ULTRAHIGH PURITY SOLVENT DISTRIBUTION SYSTEMS
IN SEMICONDUCTOR MANUFACTURING EQUIPMENT
1 Purpose
1.1 This document specifies guidelines for ultrahigh
purity (UHP) solvent distribution systems in
semiconductor production equipment.
2 Scope
2.1 The distribution systems consi st of stainless steel
(SS) piping designed to supply flammable solvents
only.
2.2 Typical tools include photolith ography track
equipment, solvent wet stations, and isopropyl alcohol
vapor dryers.
3 Referenced Documents
3.1 SEMI Standards
SEMI E49 — Guide for Standard Performance,
Practices, and Sub-Assembly for High Purity Piping
Systems and Final Assembly for Semiconductor
Manufacturing Equipment
SEMI E49.6 — Guide for Subsystem Assembly and
Testing Procedures - Stainless Steel Systems
SEMI F1 — Specification for Leak Integrity of High-
Purity Gas Piping Systems and Components
3.2 ASM Document
1
ASM UNS S31603 — Composition of Standard
Stainless Steels
3.3 ASTM Standards
2
See Section 3.3 of SEMI E49.
4 Terminology
See Section 4 of SEMI E49.
5 Performance Guidelines
5.1 Leak Test and Purity Indices
5.1.1 Pressure Decay Test
• Test Media — Nitrogen (N
2
)
Pressure — 2 times system operating pressure
1 American Society of Metals, Metals Park, OH 44073
2 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohoken, PA 19428-2959
• Time — 24 hours
• Temperature — Constant
• Fail-Pressure Loss — > 1% of test pressure
5.1.2 N
2
Particle Count (ptc), at ≥ 0.1 µm Size
• < 0.18 ptc/L (< 5 ptc/ft
3
) average single count
• < 1.8 ptc/L (< 50 ptc/ft
3
) maximum single count
5.1.3 Moisture Level — ≤ 200 ppb
5.2 All performance measures are absolute values,
relative to respective test instrument background level.
5.3 See SEMI E49.6 for recommended solvent system
testing procedures.
5.4 Reliability and Maintainability Indices —
Equipment supplier should provide actual gas system
performance data and/or component reliability data,
accompanied by the associated failure analysis method.
Indices Hours
Mean time between failure (MTBF)
Mean time between assists (MTBA)
Mean time to repair (MTTR)
Start-up time (Initial)
6 Design Guidelines
6.1 All weld joints should be automatically orbital butt
welded.
6.2 Mechanical fittings should be used where required
for component removal/replacement.
6.3 Dead volumes should be less t han three pipe
diameters in length/height. Blind runs such as pressure
gauges should not be used.
6.4 A means of process liquid sampling should be
installed as close as possible to point of dispense.
6.5 Incoming process liquids require filters and should
be located downstream of any regulator and as close as
possible to point of dispense.
6.6 The system internal volume should be minimized
by use of Dead Space Free (DSF) branch valves and/or
multi-component integrated assemblies.

SEMI E49.5-0298 © SEMI 1995, 1998 2
6.7 Design should include a means of flow through
flushing and draining for removable components or
assemblies.
6.8 Pumping systems should include surge/pulse
suppression devices and provisions for vibration
isolation.
6.9 Supply and drain lines on a recirculation system
should be separated by an isolation valve. The system
should not use one line to perform both functions.
6.10 All filters should be able to be isolated from
process stream for maintenance.
6.11 Ball and needle type valves should not be used.
6.12 Backflow/back pressure protection should be
included in the system.
6.13 For processes requiring pressu re control,
regulators should be included in the system. Pressure
transducers and a means of pressure display should be
included on the equipment.
6.14 The systems should have a means of manifolding
supply and drain lines onboard, so that there is a single
point connection for each individual liquid.
7 Materials Guidelines
7.1 Material Mechanical Characte ristics - Stainless
Steel
7.1.1 All tubing greater than or equal to 1.27 cm (1/2
in.) diameter should conform to ASTM A 269.
7.1.2 Tubing less than 1.27 cm (1/2 in.) diameter
should conform to ASTM A 632.
7.1.3 All bar stock should conform to ASTM A 479.
7.1.4 All steel should conform to ASM UNS S31603
for chemical composition with the following
exceptions:
• Sulfur as reported by the SMTR ≤ 0.030%
• Carbon as reported by the SMTR ≤ 0.030%
7.2 Stainless steel should be 316L electropolished for
solvent system wetted flow streams.
7.3 Materials for valve seats, diaphragms, gaskets, and
O-rings should be chemically compatible to the process
gas.
7.4 Material Performance Guidelines
7.4.1 The performance guidelines below are SS
qualification values to be demonstrated by the original
component manufacturer. Semiconductor equipment
suppliers should provide proof that their components
conform to these requirements.
7.4.2 The performance tests should be considered
production qualification tests. It is the responsibility of
the component manufacturer to provide statistically
valid data which correlates their production tests to
these qualification tests (e.g., Statistical Process
Control, MIL-STD-105D).
7.4.3 The equipment supplier should be responsible
for maintaining and supplying, upon request,
documentation that proves their components meet the
user’s materials performance requirements.

SEMI E49.5-0298 © SEMI 1995, 19983
Table 1 Summary of Recommended Specifications
Description Value Units
Internal Surface Chemistry (AUGER)
Surface chromium oxide enhanced layer thickness at
1/2 peak height of measured oxygen signal level
For an example of a test method, see SEMASPEC 90120573B (AUGER)
≥ 15 Å
Internal Surface Chemistry (ESCA)
Total chromium to iron ratio including both reduced
and oxidized states
For an example of a test method, see SEMASPEC 90120403B (ESCA)
≥ 1.25:1 value
Internal Surface Chemistry (EDX)
Surface foreign elements, those elements not in the
Smelter’s Test Report (SMTR)
Test procedures per ASTM F 1375 (EDX)
0value
Internal Surface Defects
Photos per test method
Counts per photo
Test procedures per ASTM F 1372 (SEM)
5
≤ 50
value
value
Internal Surface Roughness
Average surface roughness
Roughness average (R
a
)
Maximum surface R
a
(individual reading)
For an example of a test method, see SEMASPEC 90120400B (Contact Profilometry)
≤ 0.25
(≤ 10)
≤ 0.38
(≤ 15)
µm
(µin.)
µm
(µin.)
Particulate Contribution
at ≥ 0.1 µm size
at ≥ 0.02 µm size
Test procedures per ASTM F 1394 (Particles)
≤ 0.71 (20)
≤ 2.6 (75)
ptc/L (ptc/ft
3
)
ptc/L (ptc/ft
3
)
Internal Absorbed Moisture
Time to recover to base line from a 2 ppm spike
for low surface area component (valve, regulator)
Time to recover to baseline from a 2 ppm spike
for high surface area component (filters, tubing)
Test procedures per ASTM F 1397
≤ 4
≤ 6
hour
hour
Total Anionic Contamination
Total anionic contamination added to test water
Individual anionic contaminant
Test procedures per ASTM D 4327 (Total Anions)
≤ 1
≤ 0.2
ppm
ppm
Leak Rate
Inboard leak rates for He
Outboard leak rates for He
Cross-seat leak rates for He
Test procedures per SEMI F1 (Leak Rate)
≤ 1 × 10
−9
≤ 1 × 10
−5
≤ 4 × 10
−8
scc/s
scc/s
scc/s
Cycle Life
Manual valves
High pressure automatic valves
Low pressure automatic valves
Test procedures per ASTM F 1373 (Cycle Life)
≥ 25 K
≥ 25 K
≥ 500 K
cycles
cycles
cycles