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SEMI E49.8-1103 © SEMI 1996, 2003 4 NOTICE: SEMI makes no warranties or representations as to the suitability o f the standards set forth herein for any particular application. The determination of the suitability of the…

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SEMI E49.8-1103 © SEMI 1996, 2003 3
Table 1 Summary of Requirements for High Purity and Ultrahigh Purity Components and SubAssemblies
Description High
Purity
Value
Ultrahigh
Purity
Value
Units
Internal Surface Chemistry (ESCA) — Test method per SEMI F60
Total chromium to iron ratio including both reduced and oxidized states
refer to
SEMI F19
refer to
SEMI F19
value
Internal Surface Defects (SEM) — Test procedures per SEMI F73
Photos per test method
Counts per photo
refer to
SEMI F19
refer to
SEMI F19
value
value
Internal Surface Roughness — Test procedure per SEMI F37
Average surface roughness (Ra)
Maximum surface roughness from an individual measurement
refer to
SEMI F19
refer to
SEMI F19
µm (µin.)
µm (µin.)
Static Flow Particulate Contribution (valves, regulators, flow controllers) —
Test procedures per SEMI F70
Particles ≥ 0.1 µm
Particles ≥ 0.02 µm
≤ 0.71 (≤ 20)
≤ 2.6 (≤ 75)
≤ 0.18 (≤ 5)
≤ 0.71 (≤ 20)
ptc/L (ptc/ft
3
)
ptc/L (ptc/ft
3
)
Internal Absorbed Moisture – Test procedures per ASTM F 1397 or SEMI F58
For low surface area component (valve, regulator), time to recover to
baseline from a 2 ppm spike (ASTM F 1397) or 200 ppb spike
(SEMI F58)
For high surface area component (filters, tubing), time to recover to
baseline from a 2 ppm spike (ASTM F 1397) or 200 ppb spike
(SEMI F58)
≤ 4
≤ 6
≤ 1
≤ 4
hour
hour
Cycle Life (valves, regulators, and MFC’s) — sample at least 4 and no more than
10 components using a 90% confidence interval and exponential hazard
function:
Manual valves – MTTF of ≥ 25 K cycles
Pneumatic valves, regulators, and MFC’s – MTTF of ≥ 500 K cycles
Following cycling, components must meet
the particulate contribution requirements in
this table and the leak rate requirements in
Sections 6.2, 7.2 and 7.3.
7 Component Guidelines
7.1 Components in subassemblies should comply with
the surface requirements listed in SEMI F19, and with
additional requirements listed in Table 1.
7.2 All components should meet the inboard/outboard
leak rate requirements of SEMI F1.
7.3 Valves should be springless, packless diaphragm
type with all metal bonnet seals. All valves should
meet the leak across the seat requirements of SEMI F1.
7.4 Valve flow coefficients (C
v
) should be selected
based on gas flow requirements and gas characteristics.
The C
v
should be determined using SEMI F32.
7.5 Regulators should be sized based on gas flow
requirements and gas characteristics by examination of
a droop curve that shows regulator pressure drop as a
function of flow at the specific inlet pressure and set
outlet pressure conditions.
7.6 Filters in the final line just upstream of the chamber
that are intended to protect the chamber from upstream
particulate contamination should be 9-LOG retention
for particles greater than or equal to 0.003 µm and
should be tested per SEMI F38. The filters should be
made of PTFE, stainless steel, nickel or ceramic media.
7.7 Pressure transducers should minimize the dead
space below the diaphragm.
8 Subsystem Assembly Guidelines
8.1 See SEMI E49.6 for recommended stainless steel
system assembly procedures.
SEMI E49.8-1103 © SEMI 1996, 2003 4
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E51-0200 © SEMI 1995, 20001
SEMI E51-0200
GUIDE FOR TYPICAL FACILITIES SERVICES AND TERMINATION
MATRIX
This guide was technically approved by the Global Facilities Committee and is the direct responsibility of the
North American Facilities Committee. Current edition approved by the North American Regional Standards
Committee on December 15, 1999. Initially available at www.semi.org January 2000; to be published
February 2000. Originally published in 1995; previously published February 1998.
1 Purpose
1.1 The objectives of this guide are to ensure a timely
and cost-effective tool installation with minimum
impact on the existing customer facilities, systems, and
services, and to insure that the quality of facilities
supplied (e.g., water, gases, chemicals, electricity) is
not compromised once internal to the tool.
1.2 This guide provides the equipment supplier with
an understanding of the facilities available at the point
of connection (POC) at the “typical” customer site. If
these typical facility services are considered by tool
manufacturers during their tool design, additional cost
and lead times associated with customizing each tool
installation can be minimized resulting in reduced costs
to build and install semiconductor equipment.
2 Scope
2.1 This document does not include site-specific
conditions. The Typical Facilities Services and
Termination Matrix Example—United States (see Table
1) identifies utilities, performance, and connections at
typical semiconductor facilities. When site
specifications differ, the user should create a Site-
Specific Facilities Services and Termination Matrix
(see Table 2) that is submitted with the request for a
quote. Each tool should be supplied in a “facility
ready” state. This document represents the range of
conditions in which equipment should be capable of
operating.
2.2 This guide does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this guide to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
3 Impact
3.1 A reference to this guide and the Typical Facilities
Services and Termination Matrix (see Table 1) or a
completed Site-Specific Facilities Services and
Termination Matrix (see Table 2) should be included
with other applicable tool purchase specifications.
When the supplier receives these documents, a dialogue
can be established to resolve any installation issues
prior to customer purchase or tool installation. Any
additional facility requirements not identified should be
determined when the tool quote is reviewed.
4 Referenced Standards
4.1 SEMI Standards
SEMI E6 — Facilities Interface Specifications
Guideline and Format
SEMI E7 — Specification for Electrical Interfaces for
the U.S. Only
SEMI E30 — Generic Model for Communications and
Control of Manufacturing Equipment (GEM)
SEMI E33 — Specification for Semiconductor
Manufacturing Facility Electromagnetic Compatibility
SEMI E49 — Guide for Standard Performance,
Practices, and Sub-Assembly for High Purity Piping
Systems and Final Assembly for Semiconductor
Manufacturing Equipment
SEMI F47 — Specification for Semiconductor
Processing Equipment Voltage Sag Immunity
4.2 ANSI Standard
1
ANSI B16.5 — Steel Pipe Flanges, Flanged Valves and
Fittings, as it refers to 150 lb. flanges
4.3 IEEE Standards
2
IEEE 1100 — Recommended Practice for Powering
and Grounding Sensitive Electronic Equipment (IEEE
Emerald Book)
4.4 NFPA Document
3
NFPA 70 — National Electrical Code
5 Terminology
5.1 Acronyms and Abbreviations
5.1.1 amb — ambient temperature conditions
1 American National Standards Institute (ANSI), 11 W. 42nd Street,
New York, NY 10036
2 Institute of Electrical and Electronic Engineers (IEEE), 445 Hoes
Lane, P.O. Box 1331, Piscataway, NJ 08855-1331
3 National Fire Protection Association (NFPA), 1 Batterymarch Park,
P.O. Box 9101, Quincy, MA 02269-9101