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SEMI INTERNATIONAL STANDARDS FACILITIES Semiconductor Equipment and Materials International

SEMI PR8-0703 © SEMI 2003 66

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SEMI INTERNATIONAL STANDARDS

FACILITIES

Semiconductor Equipment and Materials International

SEMI F1-96 © SEMI 1990, 19961

SEMI F1-96

SPECIFICATION FOR LEAK INTEGRITY OF HIGH-PURITY GAS PIPING

SYSTEMS AND COMPONENTS

NOTE: This entire document was revised in 1995.

1 Purpose

This specification defines the leak testing requirements

and leakage rates for high-purity gas piping systems

and components used in semiconductor manufacturing.

It is also intended as an aid in the procurement and

installation of equipment, materials, and services.

2 Scope

2.1 This specification applies to high-purity gas piping

systems and components used in semiconductor

manufacturing facilities and comparable research and

development areas.

2.2 It includes testing methods for complete systems,

subsystems, and individual components.

2.3 It states requirements for both the user and

manufacturer and establishes leak rate limits for

acceptance testing and qualification testing.

3 Limitations

3.1 This specification is not a replacement for safety

regulations. It is the responsibility of the user to ensure

that piping systems and components comply with all

applicable safety regulations.

3.2 Interferences

3.2.1 Mass spectrometer leak testing with helium can

result in misleading indications due to high

permeability of polymeric materials by helium.

Permeation is often indicated by a delayed leakage

indication and a continually rising apparent leakage

rate. Helium tracer gas under pressure is absorbed by

permeable materials, and subsequent desorption can

inhibit later testing at sensitive levels. Therefore,

perform the tests in this order: inboard, internal, and

outboard.

3.2.2 For low pressure tests, 1 MPa (147 psig) or less,

the space to be filled with tracer gas must be purged or

evacuated to avoid dilution. This applies both to

enclosures and to the interiors of test objects.

3.2.3 Long tubing lines or small diameter tubing at an

inlet may require purging to ensure that the tracer gas

reaches the test object.

3.2.4 Conductance between the test object and the leak

detector must be adequate to ensure test sensitivity.

Restrictions such as regulators or check valves between

the test object and the leak detector may require testing

the test object before installing the downstream

components.

3.2.5 Air flow can severely hinder capture of leaking

gas by a detector probe. If possible, such air flow

should be reduced to a minimum during testing. If

testing must be performed in an area with substantial air

flow, a protective film, such as is described in ASTM E

499, Method B, should be placed around the probe tip

when examining each joint.

3.2.6 Temperature variations may affect leak

performance. However, this specification does not

address this effect.

4 Referenced Documents

All documents cited shall be the latest published

revisions.

4.1 SEMI Document

SEMI S2 — Safety Guidelines for Semiconductor

Manufacturing Equipment

4.2 ASTM Standards

E 493 — Standard Test Methods for Leaks Using the

Mass Spectrometer Leak Detector in the Inside-Out

Testing Mode

E 498 — Standard Methods of Testing for Leaks Using

the Mass Spectrometer Leak Detector or Residual Gas

Analyzer in the Tracer Probe Mode

E 499 — Standard Methods of Testing Leaks Using the

Mass Spectrometer Leak Detector in the Detector Probe

Mode

5 Terminology

5.1 acceptance test — A test conducted on each

component, subsystem, or system produced. It is the

basis for acceptance or rejection by the purchaser. The

purpose of acceptance testing is to provide a check to

ensure that the component, subsystem, or system has

been properly assembled or manufactured.

5.2 component — An individual piece or a complete

assembly of individual pieces capable of being joined

1 American Society for Testing and Materials, 100 Barr Harbor

Drive, West Conshohoken, PA 19428-2959