semi合集-English.pdf - 第4014页
SEMI F48-0600 © SEMI 2000 9 NOTICE: SE MI makes no warra nties or representations as to the suitabilit y of the standard set forth herein for any particular application. The determination of the suitability o f the stand…
SEMI F48-0600 © SEMI 2000 8
17 Report Form
17.1 Sample Information Test Date(s): ________________
17.1.1 Person/Company Requesting Analysis: ________________________________________
17.1.2 Method of Obtaining Sample: _______________________________________________
17.1.3 Operator and Laboratory Performing Test: _____________________________________
17.1.4 Sample Material: ________________ Sample Supplier: ___________________
17.1.5 Model/Lot Number: _________________ Date of Sample: ____________________
17.1.6 Circle one: Pre-Production Material or Final Production Material
17.2 Methods
17.2.1 Sample Cleaning Technique (SEMI F40 or other): _______________________________
17.2.2 Digestion Technique (check one)
Dry Ashing Closed Vessel
Type of Crucible: _______ Vessel Material: _____________
Temperature of Ashing: _____°C Reaction Conditions: _______________________
Time of Ashing: _________ hours _______________________________
17.3 Results
Table 1 Trace Metals in Bulk Polymer Worksheet
Element Detection Limit
(µ
g/g)
Procedural Blank
(µ
g/g)
Result with Blank
Subtraction
(µ
g/g)
% Recovery
Aluminum
Barium
Calcium
Chromium
Cobalt
Copper
Iron
Lead
Lithium
Molybdenum
Magnesium
Manganese
Nickel
Potassium
Sodium
Strontium
Tin
Titanium
Zinc
Zirconium
SEMI F48-0600 © SEMI 20009
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standard set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of copy-
righted material or of an invention covered by patent
rights. By publication of this standard, SEMI takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any item
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI F49-0200 © SEMI 20001
SEMI F49-0200
GUIDE FOR SEMICONDUCTOR FACTORY SYSTEMS VOLTAGE SAG
IMMUNITY
This guide was technically approved by the Global Facilities Committee and is the direct responsibility of the
North American Facilities Committee. Current edition approved by the North American Regional Standards
Committee on December 15, 1999. Initially available on www.semi.org February 2000; to be published
February 2000.
1 Purpose
1.1 A guide defining a systems approach to power
conditioning is needed for semiconductor and flat panel
display (FPD) facilities. Semiconductor and FPD
factories require high levels of power quality due to the
sensitivity of equipment and process controls.
Semiconductor and FPD processing equipment is
especially vulnerable to voltage sags. The facility
electrical system distributes power to process
equipment, support equipment, and facility
infrastructure equipment. Facility electrical distribution
systems should be designed to integrate the voltage sag
susceptibility of all the equipment with the power
quality supplied by the utility. Installing effective and
efficient facilities power conditioning requires
identification of appropriate conditioning technologies
and properly applying the conditioning equipment.
1.2 Utilizing recommendations in this guide should
result in effective power conditioning of the facility
electrical distribution system such that the process
equipment, associated support equipment and facilities
infrastructure equipment function within acceptable
ranges.
2 Scope
2.1 This guide is intended for facilities engineers,
equipment engineers, and facilities managers who
specify compatibility requirements for equipment and
utility services, and in particular for electrical power
requirements such as those found in SEMI E51.
2.2 This document provides recommendations for
implementing a systems approach to identification and
resolution of voltage sag events that disturb the
performance of semiconductor process equipment. A
program recommending facilities electrical distribution
system monitoring and control strategies for both the
direct and indirect effect of voltage sags on wafer
processing is outlined as follows:
• Reasons for monitoring and conditioning (see
Section 7.1).
• Facilities electrical distribution system power
monitoring and conditioning (see Section 7.2).
• Quantifying process equipment performance (see
Section 7.3).
• Quantifying support equipment and facilities
infrastructure equipment performance (see Section
7.4).
• Utility power monitoring strategies (see Section
7.5).
• Measurement and modeling strategies (see Section
7.6).
• Power enhancing and conditioning strategies for
use in the facilities electrical distribution system
(see Section 7.7).
2.3 This guide does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this guide to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
3 Limitations
3.1 This guide addresses power quality monitoring and
conditioning solutions primarily within the facilities
electrical distribution system. Process equipment and
utility performance are covered in other related
standards.
3.2 This guide does not address the impact of voltage
sags on equipment beyond the effect to the electrical
components. Effects on interdependent equipment
interlocks are not examined in detail in this document.
3.3 This guide is not intended to address design or
materials issues related to safety which are addressed
elsewhere in the SEMI guidelines (see SEMI S2).
3.4 This document is not intended to supersede
international, national or local codes, regulations and
laws. Each should be consulted to ensure that the
equipment meets regulatory requirements in each
location.
4 Referenced Standards
4.1 SEMI Standards
SEMI S2 — Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment