semi合集-English.pdf - 第4028页

SEMI F50-0200 © SEMI 2000 6 Impulse Insulation Levels ( BIL) are just som e of the ways that events can be eliminated. 6.4.3 Ser vice Configurations 6.4.3.1 Determ i ne the factors th at are f i xed for the purposes of i…

100%1 / 7923
SEMI F50-0200 © SEMI 20005
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
1 10 100 1000
Duration (cycles)
Percent of Nominal Voltage
Figure 3
Example of Chart Summarizing
Monitoring Data
6.3.2 Correlate data to impact on factory.
6.3.2.1 For new sites, categorize voltage sag events
within magnitude/duration bins.
6.3.2.2 When evaluating new sites that are located in
different electrical utility service areas it is beneficial to
normalize the voltage sag data prior to comparison.
The use of magnitude/duration bins to place historical
or predicted event data creates discrete blocks of like
kind events. The impact on factories, causes of events,
and potential improvements may be evaluated on each
individual bin or groups of bins. Increasing the number
of magnitude/duration bins used in the data comparison
refines the accuracy, but also increases the effort
needed to translate events into discrete data bins. (See
IEEE 1346 and Related Information 2.)
6.3.2.3 For existing sites, define categories of event
impact on manufacturing process. For example:
In Spec Event/No known impact
In Spec Event/Minor impact
In Spec Event/Major impact
Out of Spec Event/No known impact
Out of Spec Event/Minor impact
Out of Spec Event/Major impact
6.3.2.3.1 The boundary between major and minor
impact is often cost or number of wafer moves lost
converted to an equivalent cost.
6.4 Recommend Improvements
6.4.1 Analyze costs, benefits, and risks.
6.4.1.1 The improvement recommendation process
should include the equivalent of identifying the costs
related to the disturbances, the costs related to
improvements, and the effectiveness of improvements.
The risks should be identified for taking no action, the
possibility that events will occur during the
implementation of improvements, and that events will
occur as a result of unknown factors resulting from the
installation of improvements. Improvements can
include corrective action to eliminate system faults,
changes to service configurations, and power
enhancements.
6.4.2 Corrective action to eliminate system faults.
6.4.2.1 The key to influencing an electric utility’s
voltage sag performance is mutual understanding of
measurement and improvement processes. Voltage
sags on utility electric systems are created because of
faults (short circuits) caused by a variety of events,
including lightning, trees contacting power lines,
equipment failure, and vehicles striking power poles.
In order to reduce the number of voltage sag events, it
is important to understand the specific cause of each
fault. Semiconductor manufacturers should request that
electric utilities share disturbance investigation reports
and statistics. If data is not available, or tracking fault
causes is not a focus (many utilities track only outage
causes) then a fault tracking system should be
established.
6.4.2.2 Many times, the initially identified fault cause
(for example lightning) has a more specific cause (for
example a contaminated insulator), with an even more
specific root cause (for example salt contamination on
coastal power lines in dry weather seasons).
Identifying this root cause helps to establish the
appropriate corrective action (for example, improved
insulator cleaning practices to include weather
considerations on coastal lines). Semiconductor
manufacturers and their electric utilities should work
together to ensure voltage sag event root cause
identification processes exists.
6.4.2.3 Analysis steps for electric utilities to identify
the root cause of system faults include the following:
Step 1 Locate the fault and identify what initiated the
fault.
Step 2 Investigate the underlying causes of the fault
to discover the root cause.
Step 3 Track faults and root causes in a database.
Step 4 Identify corrective actions.
6.4.2.4 Some of the more obvious corrective actions
include additional animal guards on exposed electrical
devices to reduce the effects from inadvertent touch.
Additional patrols and early removal of birds nests,
sources of nesting material, reduction in potential
roosting and nesting sites, sealing any possible entry to
electrical equipment against wildlife intrusion, and
designs using larger phase spacing and higher Basic
SEMI F50-0200 © SEMI 2000 6
Impulse Insulation Levels
(BIL) are just some of the
ways that events can be eliminated.
6.4.3 Service Configurations
6.4.3.1 Determine the factors that are fixed for the
purposes of improvement development and evaluation.
Some examples include, but are not limited to, physical
location of site, utility system configuration beyond the
immediate vicinity of the site, and electric rate
structures.
6.4.3.2 Once the electrical reliability and power
quality needs of a semiconductor factory are identified
and the reliability and power quality of the electrical
network in the area has been characterized, electric
utility service configuration can be considered. The
electric utility and the semiconductor manufacturer
should jointly develop a plan that balances reliability
and power quality. This plan should consider the
following service configuration options.
6.4.3.3 High voltage service configura tions.
6.4.3.3.1 Utility electrical service configurations have
a significant effect on the levels of power quality and
reliability. Semiconductor manufacturing facilities can
typically derive the highest service quality and
reliability from electrical service provided at the highest
voltage level. By bringing service to the semiconductor
factory from the highest available voltage system,
semiconductor facilities can eliminate their exposure to
electrical disturbances on lower voltage systems.
Seldom are disturbances that result from events
originating in lower voltage systems transferred into the
higher voltage systems to any significant degree.
Utility industry studies have indicated approximately
6075% fewer voltage sag events (below 70% of
nominal) on the high voltage systems.
6.4.3.3.2 For plants with loads greater than 10 MW,
the highest voltage available is usually service at a
voltage between 69 kV and 345 kV. Voltages above
this range, while widely used by utilities, are not
usually economical to adapt to loads less than 60 MW
and may require lengthy regulatory approvals. If new
overhead power lines are required, environmental and
public issues associated with locating the lines may
reduce access to higher voltage lines.
6.4.3.4 Redundancy.
6.4.3.4.1 All on-site facilities and internal factory
distribution should have at least N+1 component
redundancy. Where N is the number of components
required to operate for maximum loading conditions
and +1 indicates a single additional component that will
operate to maintain the system capability in the event
that one of the original components is out-of-service. If
the plant is to be operated with no annual shutdowns for
maintenance, then the system should be designed with
enough redundancy to maintain every component in the
plant without dropping service to any load. This
requires at least a dual feed system that originates with
two or more utility sources and continues throughout
the semiconductor factory with appropriate transfer
schemes to keep the loads energized at all times and to
transfer loads without interruptions.
6.4.3.4.2 The most reliable service is one where there
are multiple sources connected in a network to the
semiconductor factory. This allows for adequate power
supply, even if one of the sources fails. If a network is
not available, a dual feed system can be configured to
provide an immediate transfer to the backup system in
the case of primary source failure, reducing outage time
to near zero. Additionally, if the two sources are
independent, a static transfer switch may increase
quality to a level higher than that of a network. If only
one source is available to a semiconductor factory with
a load of less than five megawatts, an alternative is on
site generation combined with a voltage sag ride-
through system.
6.4.3.5 Minimize exposure.
6.4.3.5.1 When choosing source configurations, it is
important to consider exposure at the semiconductor
factory site. The more line length the factory is
connected to, the more exposure there is.
a) It might not be desirable to have three lines serving
the plant if one is a long line that is prone to
failures. As a rule of thumb, more than three lines
connected in a network may reduce quality without
adding significantly to reliability.
b) If service is taken from a distribution class circuit,
then consider purchasing a so-called express or
dedicated feeder from the utility to isolate the plant
from neighboring facilities.
c) Review the line routes with the utility and consider
changes to reduce exposures, such as: where the
poles are vulnerable to being struck by vehicles, or
where trees are growing close to the transmission
lines.
6.4.4 Power Enhancements Technologies
6.4.4.1 All disturbances will not be eliminated from
the utility grid. In order to achieve the next step in
plant protection, it may be necessary to implement
some type of custom power option. Custom power is
so called because it is thought to be a custom solution
tailored to the needs of the process and the unique
situation of the site. Custom power options usually
involve some type of power enhancement and
conditioning system. These power electronics systems
are most often connected between the semiconductor
SEMI F50-0200 © SEMI 20007
factory and the electric utility at the point of common
coupling (also known as the electrical service point).
Many custom power options include some energy
storage to ride through the disturbance, but they are
usually designed to carry the factory through only
momentary interruptions. In fact, for large factories
(>10 MW) some available ride-through systems only
operate to boost the voltage during sags and will not
carry the factory site through even short outages. The
trade-off is cost versus protection. The systems should
be economically evaluated as well as matched
technically to the needs of the site.
6.4.4.2 Electric utility provided custom power options
should be balanced against factory system voltage sag
immunity covered in industry guide for factory systems
voltage sag immunity.
6.5 Select and Implement Improvements
6.5.1 Both the electric utility and the semiconductor
manufacturer should agree criteria methodology for
prioritizing improvements. The following are examples
of prioritization criteria.
Expected frequency of disturbances.
Impact of fault on electric utility and
semiconductor processing.
Relative cost of system improvement.
Ability of action to reduce effects.
6.5.2 Select improvement to be implemented, identify
the schedules for installation, and define the new
system performance expectations.
6.5.3 Implement selected improvements.
6.5.4 With identified fault tracking and root cause
analysis processes electric utilities will be in a position
to communicate the cause of events, their corrective
actions, and the impact of improvements. Results will
be both immediate and long-term, but to ensure that the
continuous improvement process remains successful,
the impacts of improvements should be tracked. The
results of this tracking should provide feedback to the
continuous improvement process as a whole.
7 Related Documents
7.1 SEMI Standards
SEMI F42 — Test Method for Semiconductor
Processing Equipment Voltage Sag Immunity
SEMI F47 — Provisional Specification for
Semiconductor Processing Equipment Voltage Sag
Immunity
SEMI F49 — Guide for Semiconductor Factory
Systems Voltage Sag Immunity
SEMI E51 — Guide for Typical Facilities Services and
Termination Matrix
7.2 IEEE Standards
1
IEEE 141 IEEE Recommended Practice for Electric
Power Distribution for Industrial Plants
IEEE 446 — IEEE Recommended Practice for
Emergency and Standby Power Systems for Industrial
and Commercial Applications
IEEE 493 — IEEE Recommended Practice for the
Design of Reliable Industrial and Commercial Power
Systems
IEEE 1100 — IEEE Recommended Practice for
Powering and Grounding Sensitive Electronic
Equipment
IEEE 1250 — IEEE Guide for Service to Equipment
Sensitive to Momentary Voltage Disturbances
NOTE 3: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the guides set
forth herein for any particular application. The
determination of the suitability of the guide is solely the
responsibility of the user. Users are cautioned to refer
to manufacturer’s instructions, product labels, product
data sheets, and other relevant literature respecting any
materials mentioned herein. These guides are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this guide may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this guide, SEMI takes
no position respecting the validity of any patent rights
or copyrights asserted in connection with any item
mentioned in this guide. Users of this guide are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights, are entirely their own responsibility.