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SEMI D17-0200 © SEMI 1998, 2000 1 SEMI D17-0200 MECHA NIC A L SPECIFICA TION FOR CASSETTES USED TO SHIP FLAT PANEL DISPLA Y GL A SS SUBSTR AT ES This s pecif ication was te chnically approv ed by the G lobal Flat Pane l …

SEMI D16-0998 © SEMI 1998 4

Table 1 Substrate Edge Length, Interface Dimensions, and Tolerances (mm)

Interface Dimensions and Tolerances

Edge Length

(mm)

max.

± 10 mm

max.

± 10 mm

min.

max.

Z6 Z7

max.

550 × 650 925 450 800 400 100 1000 100 900 2000 850 100 105 tba 200

600 × 720 980 500 865 435 100 1065 100 900 2000 850 100 105 tba 200

960 × 1100 1450 900 1360 650 100 1500 100 900 2000 850 100 105 tba 200

NOTICE: These standards do not purport to address safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish appropriate safety and health practices and determine the

applicability of regulatory limitations prior to use. SEMI makes no warranties or representations as to the suitability

of the standards set forth herein for any particular application. The determination of the suitability of the standard is

solely the responsibility of the user. Users are cautioned to refer to manufacturer's instructions, product labels,

product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are

subject to change without notice.

The user's attention is called to the possibility that compliance with this standard may require use of copyrighted

material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

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consent of SEMI.

SEMI D17-0200 © SEMI 1998, 20001

SEMI D17-0200

MECHANICAL SPECIFICATION FOR CASSETTES USED TO SHIP

FLAT PANEL DISPLAY GLASS SUBSTRATES

This specification was technically approved by the Global Flat Panel Display – Equipment Committee and is

the direct responsibility of the North American Flat Panel Display Committee. Current edition approved by

the North American Regional Standards Committee on December 15, 1999. Initially available on SEMI

OnLine January 2000; to be published February 2000. Originally published September 1998.

1 Purpose

1.1 This standard specifies selecte d requirements of

the cassettes used to ship flat panel substrates from the

substrate finisher to the display maker and between

process-added users.

1.2 This document incorporates pertinent dimensional

data from SEMI D18, Specification for Cassettes Used

for Horizontal Transport and Storage of Flat Panel

Display Substrates.

2 Scope

2.1 This standard is intended to se t levels of

specification for a reusable cassette to ship clean glass

substrates and process-added substrates between

organizations without compromising substrate integrity.

This standard is intended to set an appropriate level of

specification that places minimal limits on innovation

while ensuring modularity and interchangeability at

common mechanical interfaces.

2.2 This standard does not purport to address safety

issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

3 Limitations

3.1 Substrate size and thickness ar e not specified so as

not to cause constraints on supplier/customer

relationships.

4 Referenced Standards

4.1 SEMI Standards

SEMI D18 — Specification for Cassettes Used for

Horizontal Transport and Storage of Flat Panel Display

Substrates

SEMI E15 — Specification for Tool Load Port

SEMI E44 — Guide for Procurement and Acceptance

of Minienvironments

NOTE 1: As listed or revised, all documents cited shall be

the latest publications of adopted standards.

5 Terminology

See Figure 1 and Table 1.

5.1 bilateral datum plane — a vertical plane that

equally bisects the substrate and that is perpendicular to

both the horizontal and facial datum planes.

5.2 carrier capacity — the number of substrates that a

carrier holds.

5.3 cassette — as defined in SEMI E44.

5.4 cassette bottom domain — volume (below z4

above the horizontal datum plane) that contains the

bottom of the cassette.

5.5 cassette front — the area between the cassette top

and bottom domains through which substrates pass

during loading and unloading.

5.6 cassette placement sensing pads — surfaces on the

bottom of the cassette for triggering optical or

mechanical sensors.

5.7 cassette rear — the area betwe en the cassette top

and bottom domains opposite the cassette front.

5.8 cassette rear domains — volu mes (from z4 above

the horizontal datum plane to z9 above the top

substrate) that contain rear columns which prevent the

substrates from exiting the cassette rear.

5.9 cassette side domains — volumes (from z4 above

the horizontal datum plane to z9 above the top

substrate) that contain the mizo teeth and mizo plates

that support the substrates.

5.10 cassette top domain — volume (higher than z9

above the top substrate) that contains the top of the

cassette.

5.11 conveyor rails — features on t he bottom of the

cassette for supporting the cassette on roller conveyors.

5.12 conveying surface — entire bottom surface of

cassette (z15 above the horizontal datum plane),

excluding the v-rail, v-groove, and float roller zones,

for supporting the cassette on roller conveyors.

5.13 facial datum plane — a vertical plane that

equally bisects the substrates when the centers of the

substrates are aligned and that is parallel to the front

SEMI D17-0200 © SEMI 1998, 2000 2

side of the carrier (where substrates are removed or

inserted) and is perpendicular to the bilateral datum

plane. On tool load ports, it is also parallel to the load

face plane (as defined in SEMI E15) on the side of the

tool where the carrier is loaded and unloaded.

5.14 first nominal substrate height — the distance (z5)

from the horizontal datum plane to the first nominal

substrate seating plane.

5.15 first substrate end-effector clearance — the

distance (dimension z9) between the top of the cassette

bottom domain and the first nominal substrate seating

plane.

5.16 horizontal datum plane — loa d height as defined

in SEMI E15.

5.17 mizo plate — a plate that contains mizo teeth and

may provide structure to the cassette.

5.18 mizo teeth — elements that sup port the substrates

in the cassette.

5.19 nominal center line — the inte rsection of the

facial and bilateral datum planes.

5.20 nominal substrate seating plane — a horizontal

plane that contains the nominal bottom surface of the

substrate as it rests on the mizo teeth.

5.21 optical substrate sensing paths — lines of sight

for optically sensing the positions of the substrates.

5.22 polystyrene latex sphere (PSL) — Reference

material used to calibrate surface inspection systems.

5.23 robotic handling flanges — projections on the

cassette for handling of the cassette.

5.24 substrate extraction volume — the open space for

extracting a substrate from the cassette.

5.25 substrate pick-up zone — the space that includes

the volume in which the substrate bottom may be

found.

5.26 substrate pitch — the distance between adjacent

nominal substrate seating planes.

6 Requirements

6.1 Physical Protection of Substrate

6.1.1 No chipping, scratching, or oth er damage shall

occur under normal handling and shipping conditions.

6.1.2 Substrates shall be contained t o prevent excess

movement during shipment.

6.2 Provisions for Tracking and Identification —

Provision for a printed label should be made.

6.3 Thermal Requirements — Construction materials

shall withstand cleaning temperatures of 90ºC,

following which the cassette shall meet the dimensional

and other requirements of this specification.

6.4 Loading/Unloading of Substrates

6.4.1 Cassettes furnished to this spe cification must be

compatible with manual and automated loading/

unloading systems, while minimizing cassette volume.

6.4.2 Such cassettes must also facili tate transfer of

substrates to and from, a Transportation/Automation

Cassette.

6.5 Cassette Physical Alignment In terface — The

cassette should be registered to the tool interface by one

of the three following registration types, A, B, or C.

The locations of the registration features have been

chosen such that all three types may coexist on the

same cassette.

6.5.1 Cassette Physical Alignment Interface Type A —

This interface consists of three features (not specified,

but recommended to be inverted V-shaped grooves)

placed on the bottom of the cassette that mate with

three coupling pins located on the tool interface. The

coupling pins are located by dimensions x14 and y13

relative to the bilateral and facial datum planes

respectively.

6.5.1.1 Coupling Pin Shapes — The p hysical

alignment mechanism on the bottom of the wafer

carrier consists of features (not specified in this

standard) that mate with three pins underneath. As

shown in Figure 5 and defined in Table 3, each pin is

radially symmetric about the vertical center axis line

and can be seen as the intersection of a cylinder of

diameter d1 and a sphere of radius r3 (which might

contact a flat plate). An additional rounding radius r5

provides contact with angled mating surfaces, and blend

radii r4 and r6 smooth the resulting edges. The final

roughness height of the overall surface finish must be

less than or equal to r7. Dimensions r2 and z13 have

zero tolerance because they only give a distance to

another toleranced dimension. (Dimensions in

parenthesis are not part of the requirements in this

standard but are intended to clarify the preparation of

manufacturing instructions.)

6.5.1.2 The three features on the botto m of the cassette

that mate with the coupling pins must provide a lead-in

capability that corrects a cassette misalignment of up to

10 mm (0.4 in.) in any horizontal direction, although 15

mm (0.6 in.) is recommended. The exclusion zones for

the three coupling features on the cassette are shown in

Figure 3 and Table 1 and specified by dimensions x14,

z9 and r1.

6.5.2 Cassette Physical Alignment Interface Type B —

This interface consists of three features, a v-rail, float

surface, and facial datum plane v-groove. The v-rail and