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SEMI D18-0299 E © SEMI 19 99, 2001 13 Figure 6 Cassette Physical Alignm ent Interface-Type B Roller Position Figure 7 Cassette Physical Alignm ent Interface-Type B Roller Shape

SEMI D18-0299
E
© SEMI 1999, 2001 12
Figure 5
Cassette Physical Alignment Interface-Type A
Coupling Pin Shape

SEMI D18-0299
E
© SEMI 1999, 200113
Figure 6
Cassette Physical Alignment Interface-Type B
Roller Position
Figure 7
Cassette Physical Alignment Interface-Type B
Roller Shape

SEMI D18-0299
E
© SEMI 1999, 2001 14
APPENDIX 1
NOTE: The material in this appendix is an official part of SEMI D18 and was approved by full letter ballot procedures on August
15, 1998.
A1-1 Application Notes
A1-1.1 The shape of the teeth holding the substrates is
not specified in this standard. The tooth surface that
touches the substrate should have a large radius to
minimize stress on the substrate and tooth.
A1-1.2 Extra clearance (larger than the pitch) has been
added below the bottom substrate (for non-random
sequential access to the substrates with a faster or less
precise robot). To increase the stability of Type A
Cassettes the points on the cassette bottom that are the
most distant from the lines connecting each pair of
coupling pins should be made as close as practical to
the horizontal datum plane so that the cassette cannot
tip very far off of the kinematic coupling.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.