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SEMI M31-0705 © SEMI 1998, 2005 21 APPENDIX 1 APPLICATION NOTES NOTICE: This appe ndix is an official par t of SEMI M31 and was a pproved by full lett er ballot procedures on July 15, 1999. A1-1 Although FOSB parameters …

SEMI M31-0705 © SEMI 1998, 2005 20



= 8 ± 0.5

64 = 42.1 ± 0.5







104

facial

datum plane

horizontal datum plane

of load port

63 = 37.3 ± 0.5



= 30

± 0.5°

63 = 7.5

± 0.5

r 61



16 (above

60)

r 60 = 16 ± 0.5 (below

60)

front side of the box

where wafers are accessed

Figure 14

Side View of Retaining Features on Bottom of FOSB

6 Related Documents

6.1 SEMI Standards

SEMI E22.1 — Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume

Standard

SEMI E63 — Mechanical Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface

SEMI M28 — Specification for Developmental 300 mm Diameter Polished Single Crystal Silicon Wafers

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

SEMI M31-0705 © SEMI 1998, 2005 21

APPENDIX 1

APPLICATION NOTES

NOTICE: This appendix is an official part of SEMI M31 and was approved by full letter ballot procedures on

July 15, 1999.

A1-1 Although FOSB parameters supporting effective reuse and cleaning (washing/drying) are not defined in this

document, it is essential that these capabilities be considered for a successful overall shipping box design.

A1-2 It is important to note that shipping boxes containing wafers are typically bagged for shipment to the IC

manufacturer. It is therefore important to design the outer surfaces of the shipping box to be compatible with this

common practice.

A1-3 Information about Automated-shippable Door

A1-3.1 When Automated-shippable door is used, the following contents should be understood for wafer quality.

A1-3.2 Rear of Door (y51): Increasing the value of y51, might have impact to the capability for absorbing drop

shock and wafer rotation during transportation, especially for x-direction since decreasing the area of holding wafer

by front wafer retainer.

A1-4 Items which need to be considered for automated-shippable door closing and opening process:

A1-4.1 When close or open the automated-shippable door by SEMI E62 compliant load port, not only SEMI E62

defined f30 and f34, but also consideration of other factors which may not be defined by SEMI E62, such as speed,

acceleration and deceleration of door closing and opening, are needed.

A1-4.2 Excessive f34 may cause deformation of the box, as well as breakage of wafers which are contained in the

box. Door may be closed with lesser f34 by deploying designs which utilize door and box related forces, such as

latch key torque.

A1-4.3 It needs to be considered that door may rebound at door opening process.

A1-4.4 Retaining features force (f61): It is noted that strong clamping force may produce plastic deformation.

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant

literature respecting any materials mentioned herein. These standards are subject to change without notice.

The user's attention is called to the possibility that compliance with this standard may require use of copyrighted

material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI M32-0998 © SEMI 1998, 2004 1

SEMI M32-0998 (Reapproved 0704)

GUIDE TO STATISTICAL SPECIFICATIONS

This guide was technically reapproved by the Global Silicon Wafer Committee and is the direct responsibility

of the North American Silicon Wafer Committee. Current edition reapproved by the North American

Regional Standards Committee on March 14, 2004. Initially available at www.semi.org May 2004; to be

published July 2004. Originally published September 1998.

1 Purpose

1.1 Specifications are based on requirements

negotiated between trading partners. This document

describes an explicit specification form that defines the

risk level as a part of parametric specifications. This

approach uses process capability information to focus

quality improvement efforts, reduce sampling, and

maintain low risks. It is based on the fundamental belief

that specifications should facilitate the movement

toward processed-in quality instead of inspected-in

quality.

1.2 It is important for users and suppliers to

acknowledge and mutually agree on quality levels so

the methods employed will satisfy their expectations.

Statistical specifications provide a convenient way to

do this.

1.3 Statistical specifications are designed to facilitate

the movement toward processed-in quality. They are

most appropriate for processes that have been

statistically characterized. This means the shape of the

statistical distribution that created the product is known,

or can be approximated to the satisfaction of the user

and the supplier. It also implies that the statistical

control of the process and the measurement systems are

defined to the level that is necessary to meet the current

needs.

2 Scope

2.1 This guide may be used when changing or adding

specifications to SEMI M18.

2.2 Statistical specifications apply to all processes that

have been statistically characterized. Solutions are

given for two product distribution shapes (normal &

lognormal), and the advantages of these solutions are

explained. Appendix 3 shows the statistically

characterized shape for many common silicon wafer

processes.

2.3 This guide applies to processes related to the

production and use of silicon wafers. It may also be

applied to the production and use of other materials.

2.4 This approach implies that the quality level shipped

is the same as the quality level produced.

2.5 This methodology can be an effective tool for

driving quality improvement.

2.6 This procedure can be coupled with other

techniques for centering the mean and reducing the

variation within the process distribution as deemed

necessary by the user and supplier.

2.7 Appendix 4 further explains the rationale for this

approach.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 Outlier effects are beyond the scope of this

document.

4 Referenced Standard

4.1 SEMI Standard

SEMI M18 — Format for Silicon Wafer Specification

Form for Order Entry

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

5 Terminology

5.1 Abbreviations and Acronyms

5.1.1 Cpk — process capability index

5.1.2 ppm — parts per million

5.2 Definitions

5.2.1 capability based sampling — any method that

uses the process capability as a factor in determining

the required sampling.

5.2.2 ECPK — process capability index on a non-

normal process which is corrected for non-normality.

5.2.3 error — the difference between the quality level

committed to a user and the level that could be

received.

5.2.4 process capability index (Cpk) — the smaller of

(upper spec limit - mean) ÷ 3 sigma, or (mean - lower

spec limit) ÷ 3 sigma.