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SEMI M49-0704 © SEMI 2001, 2004 8 Item Recommended Specification Comment References 5.10 Operating Sequence complete remote control : recipe download, start, stop, define data evaluation via SECS/GEM SEMI E5 5.11 Data In…
SEMI M49-0704 © SEMI 2001, 2004
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Item Recommended Specification Comment References
2.8 Statistical Process Control
(SPC) machine parameters
automated
3 PROCEDURAL
3.1 Acceptance Testing user specific
3.2 Transport and Assembly user specific
3.3 Quality Assurance supplier conforming with ISO 9000/9001 ISO 9000/9001
3.4 Warranty > 1 y
3.5 Test Certificates user specific
3.6 Spares Availability > 10 y
3.7 Change Control supplier conforming with ISO 9000/9001 ISO 9000/9001
4 DOCUMENTATION
4.1 Installation tbd
4.2 Operation tbd
4.3 Service tbd
5 COMPUTER, USER INTERFACE, CONNECTIVITY
5.1 Computer Operating System - Microsoft Windows NT 4.0 or higher, or
- Unix
5.2 Display cleanroom compatible, class 10 (Federal
Standard) or class 4 (ISO), respectively
FED-STD 209E
ISO 14644-1
5.3 Keyboard cleanroom compatible, class 10 (Federal
Standard) or class 4 (ISO), respectively
FED-STD 209E
ISO 14644-1
5.4 Pointing Device cleanroom compatible, class 10 (Federal
Standard) or class 4 (ISO), respectively
FED-STD 209E
ISO 14644-1
5.5 Printer cleanroom compatible, class 10 (Federal
Standard) or class 4 (ISO), respectively
FED-STD 209E
ISO 14644-1
5.6 Data Processing - reprocessing of data
- parallel processing in different modes
during measurement including sorting
- multiprocessing: e.g. recipe editing,
up/downloading during measurements
different modes
refer to data
evaluation e.g.
for two
different site
patterns, or
different
emulation
modes
5.7 Data Access - access to basic measurement results: e.g
thickness map, height map
- data available at SECS/GEM/HSMS
interface in real time
refers to all
functions as
defined in
Table 3
SEMI E5
SEMI E30
SEMI E37
5.8 Data Analysis
(Online/Offline)
on-line/off-line
5.9 Recipe Control - complete recipe generation off-line without
machine specific data (calibration curves)
- off-line recipe editing
- remote recipe control by host computer
- recipes are compatible between different
software versions
SEMI M49-0704 © SEMI 2001, 2004 8
Item Recommended Specification Comment References
5.10 Operating Sequence complete remote control : recipe download,
start, stop, define data evaluation via
SECS/GEM
SEMI E5
5.11 Data Interfaces - SECS/GEM
- optional additionally a mass data standard
transfer protocol (e.g. FTP)
SEMI E5
www.w3.org/Protocols/rfc95
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5.12 Material Tracking System
Support
required, details user specific
5.13 Output File Format standardized formats:
- ASCII or XML for measurement results
- IEEE for raw data (floating point)
- JPEG (or equivalent) for raw data (image
data)
ISO/IEC 8859, ISO/IEC
10646-1
www.w3.org, ISO 8879
IEEE 754, IEEE 854
ISO/IEC 10918
5.14 Network Communications
Standards Support
Ethernet, Fast Ethernet IEEE 802
5.15 SECS/GEM required SEMI E5
5.16 ARAMS required SEMI E58
NOTE 1: The particulate contamination PWP value given for the backside has not been established in commercial practice and is under further
consideration by the SEMI Silicon Wafer Committee.
Table 2 Materials to be Measured
Item Recommended Specification Comments References
1 WAFERS
1.1 Kind of Wafers monocrystalline, unpatterned
silicon wafers with layers as
specified in Table 2, Item 1.3.4
SEMI M1
(SEMI M8)
(SEMI M11)
1.2 Wafer Characteristics – dimensional
1.2.1 Wafer Diameter 200 or 300 or 200+300 mm
nominal
SEMI M1
SEMI MF2074
DIN 50441-4
1.2.2 Wafer Thickness 700–850 µm For reclaim wafers
(performance as
outlined in Table 3
might be reduced):
200 mm: 600–850 µ
300 mm: 650–850 µm
SEMI MF1530
DIN 50441-1
1.2.3 Edge Shape rounded SEMI M1
DIN 50441-2
SEMI MF928
1.2.4 Wafer Shape Range 200 mm wfrs: warp <= 100 µm,
300 mm wfrs: warp <= 200 µm
SEMI M1
SEMI MF1390
DIN 50441-5
1.2.5 Fiducial 200 mm wfrs: notch or flat
300 mm wfrs: notch
SEMI M1
SEMI MF671
SEMI MF1152
(DIN 50441-4)
1.2.6 ID Mark(s) 200 mm wfrs: user specific
300 mm wfrs: according to SEMI
standards
content, type location
of ID mark to be
specified
SEMI M1.15
SEMI M12
SEMI M13
SEMI T7
SEMI M49-0704 © SEMI 2001, 2004
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Item Recommended Specification Comments References
1.3 Wafer Characteristics – electrical,
optical
1.3.1 Electrical Resistivity of Wafers,
Conductivity Type
0.5 mΩcm – intrinsic, p-, n-type Res: SEMI MF673
DIN 50445
SEMI MF84
DIN 50431
Type: SEMI MF42 or
DIN50432
1.3.2 Thermal Donors annealed and not annealed
1.3.3 Wafer Charge no effect with respect to
measurement
1.3.4 Layers (LTO, poly-Si), Epi LTO: thickness: 150 – 900 nm
uniformity: ≤ 10%
poly-Si: thickness: ≤ 2 µm
uniformity: < 20%
Epitaxial layer: customer specific
1.3.5 Wafer Surface Conditions front surface: polished, annealed,
or epitaxial layer
back surface: polished, acid
and/or caustic etched, layers
according to Item 1.3.4
optional conditions of
both surfaces: etched,
lapped, as cut
Table 3 Metrology Specific Equipment Characteristics
1. REFERENCE WAFER PROPERTIES (These wafer specifications refer only to wafers to be used for verifying the
performance of the measurement equipment, see Section 6.5.18. They do not refer to product wafers.)
130 nm node 90 nm node 65 nm node
Property
nominal nominal nominal
1.1 Thickness (200 mm wafers),
µm
725 725 725
1.2 Thickness (300 mm wafers),
µm
775 775 775
1.3 GBIR, nm 1000 1000 1000
1.4 Site Size local flatness, mm
2
25*25 26*8 26*8
1.4.1 SBIR, including
partial sites, nm
250 140 125
1.4.2 SFQR, including
partial sites, nm
130 60 45
1.5 Warp, µm
30 30 30
1.6 Nanotopography, 2 mm, P-V,
nm, at 0.05% defective area
20 16 10
1.7 Nanotopography, 10 mm, P-V,
nm, at 0.05% defective area
70 50 35