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SEMI M49-0704 © SEMI 2001, 2004 11 2. MEASUREMENT FUNCTIONS Item Recommended Specif ication Technology Generation 130 nm 90 nm 9 65 nm 9 Grade A B A B A B Comments and References 2.1.5.4 Spatial Bandwidth f min (mm –1 ) …

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SEMI M49-0704 © SEMI 2001, 2004 10
2. MEASUREMENT FUNCTIONS
Item Recommended Specification
Technology Generation 130 nm 90 nm
9
65 nm
9
Grade A B A B A B
Comments and References
2.1.1 Thickness (Center Point Thickness) SEMI M1, SEMI MF1530
2.1.1.1 Level 3 Variability σ
3
(µm, 1 σ) ≤ 0.5 ≤ 1 ≤ 0.5 ≤ 1 ≤ 0.5 ≤ 1
2.1.1.2 Matching Tolerance ∆
m
(µm) ≤ 0.75 ≤ 1.5 ≤ 0.75 ≤ 1.5 ≤ 0.75 ≤ 1.5
2.1.1.3 Bias (µm) ≤ 0.75 ≤1.5 ≤ 0.75 ≤ 1.5 ≤ 0.75 ≤ 1.5
target until certified reference
materials are available
2.1.1.4 Spatial Bandwidth
f
min
(mm
–1
)
f
max
(mm
–1
)
0
1
Nominal value ± 5% tolerance
2.1.2 Global Flatness (GBIR) SEMI M1 Appendix 1;
SEMI MF1530; JEIDA 43
2.1.2.1 Level 3 Variability σ
3
(nm, 1 σ) ≤ 30 ≤ 65 ≤ 30 ≤ 65 ≤ 30 ≤ 65
2.1.2.2 Matching Tolerance ∆
m
(nm) ≤ 50 ≤ 100 ≤ 50 ≤ 100 ≤ 50 ≤ 100
2.1.2.3 Bias (nm)
≤ 50 ≤ 100 ≤ 50 ≤ 100 ≤ 50 ≤ 100
target until certified reference
materials are available
2.1.2.4 Spatial Bandwidth
f
min
(mm
–1
)
f
max
(mm
–1
)
0
1
Nominal value ± 5% tolerance
2.1.3 Local Flatness (SBIR) SEMI M1 Appendix 1; SEMI
MF1530; JEIDA 43; DIN 50441-5
2.1.3.1 Level 3 Variability σ
3
(nm, 1 σ) ≤ 8 ≤ 17 ≤ 4.7 ≤ 9.3 ≤ 4.2 ≤ 8.3
2.1.3.2 Matching Tolerance ∆
m
(nm) ≤ 12 ≤ 26 ≤ 7 ≤ 14 ≤ 6.3 ≤ 12.5
2.1.3.3 Bias (nm)
≤ 12 ≤ 26 ≤ 7 ≤ 14 ≤ 6.3 ≤ 12.5
target until certified reference
materials are available
2.1.3.4 Spatial Bandwidth
f
min
(mm
–1
)
f
max
(mm
–1
)
0
1
Nominal value ± 5% tolerance
2.1.4 Local Flatness (SFQR) Specifications apply on a site-by-site
basis; SEMI M1 Appendix 1; SEMI
MF1530; JEIDA 43; DIN 50441-5
2.1.4.1 Level 3 Variability σ
3
(nm, 1 σ) ≤ 4.5 ≤ 9 ≤ 2 ≤ 4 ≤ 1.5 ≤ 3
2.1.4.2 Matching Tolerance ∆
m
(nm) ≤ 7 ≤ 13 ≤ 3 ≤ 6 ≤ 2.3 ≤ 4.5
2.1.4.3 Bias (nm)
≤ 7 ≤ 13 ≤ 3 ≤ 6 ≤ 2.3 ≤ 4.5
target until certified reference
materials are available
2.1.4.4 Spatial Bandwidth
f
min
(mm
–1
)
f
max
(mm
–1
)
0
1
Nominal value ± 5% tolerance
2.1.5 Shape (Warp, GMLYMER) SEMI M1 Appendix 2; SEMI
MF1390; JEIDA 43; DIN 50441-5
2.1.5.1 Level 3 Variability σ
3
(µm, 1 σ) ≤ 1 ≤ 2 ≤ 1 ≤ 2 ≤ 1 ≤ 2
2.1.5.2 Matching Tolerance ∆
m
(µm) ≤ 1.5 ≤ 3 ≤ 1.5 ≤ 3 ≤ 1.5 ≤ 3
2.1.5.3 Bias (µm) ≤ 1.5 ≤ 3 ≤ 1.5 ≤ 3 ≤ 1.5 ≤ 3
9 The values for variability, matching and bias for the 90 and 65 nm technology nodes are rounded to one significant decimal digit for those
parameters which scale with the technology generations. Otherwise the values for the 130 nm genertaion are repeated.
SEMI M49-0704 © SEMI 2001, 2004
11
2. MEASUREMENT FUNCTIONS
Item Recommended Specification
Technology Generation 130 nm 90 nm
9
65 nm
9
Grade A B A B A B
Comments and References
2.1.5.4 Spatial Bandwidth
f
min
(mm
–1
)
f
max
(mm
–1
)
0
1
Nominal value ± 5% tolerance
2.1.6 Other Global Flatness Parameters SEMI M1 Appendix 1; SEMI
MF1530; JEIDA 43; DIN 50441-5
2.1.6.1 GFLR, GFLD required
2.1.7 Other Local Flatness Parameters SEMI M1 Appendix 1; SEMI
MF1530; JEIDA 43; DIN 50441-5
2.1.7.1 SPID, SFLR, SFLD, SFQD,
SFSR, SFSD
required
2.1.8 Other Shape Parameters SEMI M1 Appendix 2; SEMI
MF1390; JEIDA 43; DIN 50441-5
2.1.8.1 Sori (GFLYFER), Bow
(GM3YMCD), Warp (GB3NMPR)
required
2.2 Nanotopography These parameters refer to flatness
measurement of individual surfaces;
see SEMI M43.
2.2.1 Analysis Area Size = 2 mm
2.2.1.1 Level 3 Variability σ
3
(nm, 1 σ) ≤ 0.7 ≤ 1.3 ≤ 0.5 ≤ 1.1 ≤ 0.3 ≤ 0.7
2.2.1.2 Matching Tolerance ∆
m
(nm) ≤ 1
≤
≤ 0.8 ≤ 1.6 ≤ 0.5 ≤ 1
2.2.1.3 Bias (nm)
≤ 1 ≤ 2 ≤ 0.8 ≤ 1.6 ≤ 0.5 ≤ 1
target until certified reference
materials are available
2.2.1.4 Spatial Bandwidth
f
min
(mm
–1
)
f
max
(mm
–1
)
0.05
2.5
Nominal value ± 5% tolerance;
optionally a range of f
min
= 0.25 mm
–1
to f
max
= 2.5 mm
–1
2.2.2 Analysis Area Size = 10 mm
2.2.2.1 Level 3 Variability σ
3
(nm, 1 σ) ≤ 2.5 ≤ 5 ≤ 1.7 ≤ 3.3 ≤ 1.2 ≤ 2.3
2.2.2.2 Matching Tolerance ∆
m
(nm) ≤ 3.8 ≤ 7.5 ≤ 2.5 ≤ 5 ≤ 1.8 ≤ 3.5
2.2.2.3 Bias (nm)
≤ 3.8 ≤ 7.5 ≤ 2.5 ≤ 5 ≤ 1.8 ≤ 3.5
target until certified reference
materials are available
2.2.2.4 Spatial Bandwidth
f
min
(mm
–1
)
f
max
(mm
–1
)
0.05
2.5
Nominal value ± 5% tolerance;
optionally a range of f
min
= 0.05 mm
–1
to f
max
= 0.5 mm
–1
2.3 Other Parameters
2.3.1 Waviness user specific
2.3.2 Height (individual wafer surfaces) user specific
2.3.3 Slope user specific
2.3.4 Curvature user specific
2.3.5 Line Scans user specific
2.3.6 Contour Maps user specific
2.3.7 Data Histogram 10 or more bins per channel, arbitrarily
definable, cumulative differential
2.3.8 Edge Roll-off user specific
2.3.9 Additional Parameters user specific
SEMI M49-0704 © SEMI 2001, 2004 12
3. SETUP PARAMETERS
Item Recommended Specification
Technology Generation 130 nm 90 nm 65 nm
Grade A B A B A B
Comments and References
3.1 Nominal Edge Exclusion defining
FQA (mm)
≥ 2
≥
≥ 1
Performance parameters are to be
verified with nominal edge exclusion
≥ 2 mm. Instrument must be capable
of reporting to nominal edge
exclusion ≥ 1 mm. As a guide, the
extended performance for nominal
edge exclusion < 2 mm should not
exceed the performance (σ
3
,
matching, bias) by more than 100 %
as compared to ≥2 mm edge exclusion
given appropriate reference material.
3.2 Site Patterns For local flatness: use any site pattern
compatible with SEMI M1; for
nanotopography use floating sites
Recommended range for site size: 5 –
40 mm, arbitrary combination of
length of rectangular sides; see SEMI
M1, SEMI M43
3.3 Sorting Criteria Sorting is performed by using logical
“AND/OR” combinations of multiple
parameters
3.4 Exclusion Windows a) > 3, curved or linear boundaries with
arbitrary position anywhere on the
entire wafer surface
b) perimeter exclusion windows: N zones
with total area covered ≤ 0.001 of total
wafer area in the range R – 2 mm to R,
total perimeter excluded at R – 1 mm
≤ 4% of total wafer circumference, no
single zone longer than 5 mm.
a) e.g., laser mark exclusion
4. PERFORMANCE
Item Recommended Specification
Technology Generation 130 nm 90 nm 65 nm
Grade A B A B A B
Comments and References
4.1 Throughput
4.1.1 200 mm Wafers > 60 wafers per hour
4.1.2 300 mm Wafers > 40 wafers per hour
4.2 Downward Compatibility At least one previous tool generation of
supplier
Specific tools involved need to be
identified
4.3 Calibration Automated method, Certified Reference
Material (CRM) to be provided by
equipment supplier.
4.3.1 Level 3 Variability Test Interval
≥ 10 measurements over a period of not less
than 2 weeks (See NOTE 1.)
To be performed with throughput
mode used for qualifying product
wafers, 95% confidence interval has
to be less than the specified σ
3
4.4 Dependence of Results on Wafer
Orientation
< 1 σ
3
NOTE 1: This recommended specification is not intended to be a requirement for a two week pre-shipment test. Performance could be verified
through routine SPC (Statistical Process Control).