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SEMI P1-1101 © SE MI 1981, 2001 6 Table 4 Glass Substrate D efect Limits per Plate INTERNAL DEFECTS IN THE QUALITY AREA Opaque Spots Bubble Total Defe cts (per cm. 2 )N o t e s HTE Glass > 10 µ m > 10 µ m 01 a n d …

100%1 / 7923
SEMI P1-1101 © SEMI 1981, 20015
Figure 4
Rounded Edge Dimensions
Table 3 Substrate Material Characteristics
Coefficient of Expansion (
°
C
−
1
)
Between 0
°
C and 300
°
C
Minimum Transmittance (%) of 1.5 mm Thick Substrate at Wavelengths of:
Glass Type 157 mm 193 mm 230 nm 254 nm 365 nm 405 nm 436 nm
HTE
80 to 100 × 10
-7
NA NA NA NA 80 85 90
MTE
40 to 60 × 10
-7
NA NA NA NA 80 85 90
LTE
30 to 39 × 10
-7
NA NA NA NA 80 85 90
ULTE
< 7.5 × 10
-7
NA NA 90 90 90 90 90
DFS
< 7.5 × 10
-7
NA 87 90 90 90 90 90
MFS
< 7.5 × 10
-7
82 87 90 90 90 90 90
SEMI P1-1101 © SEMI 1981, 2001 6
Table 4 Glass Substrate Defect Limits per Plate
INTERNAL DEFECTS IN THE QUALITY AREA
Opaque Spots Bubble Total Defects (per cm.
2
)Notes
HTE Glass
> 10 µm > 10 µm
01 and 2
≤ 10 µm ≤ 10 µm
0.0465
MTE Glass
> 5 µm > 7 µm
0
≤ 5 µm ≤ 7 µm
0.0465
LTE Glass
> 5 µm > 5 µm
0
≤ 5 µm ≤ 5 µm
0.031
ULTE Glass
> 2 µm > 2 µm
0
≤ 2 µm ≤ 2 µm
0.0078
DFS Glass
> 1.5 µm > 1.5 µm
0
≤ 1.5 µm ≤ 1.5 µm
0.0078
MFS Glass
> 1.2 µm > 1.2 µm
0
≤ 1.2 µm ≤ 1.2 µm
0.0078
SURFACE DEFECTS IN THE QUALITY AREA
Frontside Residue Scratch Size
Total Scratch
Defects Sleek Size
Total Sleeks Defects
(per cm
2
)
Opaque Spot
Size
Total Opaque Spot
Defects (per cm
2
)
HTE Glass None
> 1.0 µm
0
> 2 µm
0
> 5 µm
0
≤ 1.0 µm
no limit
1–2 µm
0.0465
1–5 µm
0.0465
MTE Glass None
> 1.0 µm
0
> 2 µm
0
2.5 µm
0
≤ 1.0 µm
no limit
1–2 µm
0.0465
1–2.5 µm
0.0465
LTE Glass None
> 1.0 µm
0
> 2 µm
0
2.5 µm
0
≤ 1.0 µm
no limit
1–2 µm
0.0465
1–2.5 µm
0.0465
ULTE Glass None
> 1.0 µm
0
> 2 µm
0
2.0 µm
0
≤ 1.0 µm
no limit
1–2 µm
0.0465
1–2.0 µm
0.0155
DFS Glass None
> 1.0 µm
0
> 1.5 µm
0
1.5 µm
0
≤ 1.0 µm
no limit
1–1.5 µm
0.0310
1–1.5 µm
0.0110
MFS Glass None
> 1.0 µm
0
> 1.2 µm
0
1.2 µm
0
≤ 1.0 µm
no limit
1–1.2 µm
0.0155
1–1.2 µm
0.0052
Backside
HTE Glass
> 3.0 µm
0
> 10 µm
0.0465
≤ 3.0 µm
no limit
≤ 10 µm
no limit
MTE Glass
> 3.0 µm
0
> 10 µm
0.0465
≤ 3.0 µm
no limit
≤ 10 µm
no limit
LTE Glass
> 3.0 µm
0
> 10 µm
0.0465
≤ 3.0 µm
no limit
≤ 10 µm
no limit
ULTE Glass
> 3.0 µm
0
> 10 µm
0.0465
≤ 3.0 µm
no limit
≤ 10 µm
no limit
DFS Glass
> 3.0 µm
0
> 10 µm
0.0465
≤ 3.0 µm
no limit
≤ 10 µm
no limit
MFS Glass
> 3.0 µm
0
> 10 µm
0.0465
≤ 3.0 µm
no limit
≤ 10 µm
no limit
SEMI P1-1101 © SEMI 1981, 20017
DEFECTS OUTSIDE THE QUALITY AREA
Edge Chips Defect Limit Total Number
Radial Depth
≥ 0.76 mm
None Note
Peripheral Cord
≥ 0.76 mm
None
Other Shall be negotiated between vendor and supplier Shall be negotiated between vendor and supplier
NOTE l: The size of internal defects shall be determined by 1/2 (long axis + short axis).
NOTE 2: This table is based on the assumption that defects < 3 µm will fail outside the focal depth of the lens systems and should not print.
NOTE 3: None of any size permitted that break the surface.
D = L – 25.4/2 D = L – 25.4/2
Figure 5
Circular Quality Area
Figure 6
Square Quality Area