semi合集-English.pdf - 第5492页

SEMI P5-0704 © SEMI 1986, 2004 3 frame wall, and i ts edges m ust be free of visually detectable stringe rs (and particles). Adhesive should form a complete seal between the frame and the m ask over a m inimum of 60% of …

SEMI P5-0704 © SEMI 1986, 2004 2

presence of an AR-coating is determined by agreement

between the user and the supplier.

4.1.2.2 Exposure Range or Wavelength — The

wavelength(s) of the exposure system(s) must be

specified. Table 1 shows the typical exposure

wavelengths.

Table 1 Typical Exposure Wavelengths

Terminology Exposure Wavelength(s)

Broadband 360 nm–440 nm

g-line 436 nm

h-line 405 nm

i-line 365 nm

DUV 248 nm

DUV 193 193 nm

4.1.2.3 Optical Transmission — There are two types of

optical transmission depending on the film type. These

are measured at an incident angle of 90° from the

surface of the pellicle at the specified wavelength(s).

The acceptable values are specified in Tables 2 and 3.

The Minimum Transmission given in Table 3 apply to

all wavelengths the film is specified for.

Table 2 Transmission for Broadband Exposure

Systems

Type Average Minimum

AR-Coated ≥ 98 % 96%

Non-AR-Coated ≥ 91 % 82%

Table 3 Transmission for Monochromatic Exposure

Systems

Type Minimum

AR Coated 99%

Non AR Coated 98%

4.1.2.4 Thickness — This is determined by agreement

between user and supplier. The default thickness

tolerance is ± 0.1 µm maximum for Broadband

Exposure Systems and ± 0.05 µm maximum in all other

cases.

4.1.2.5 Mechanical Strength — The pellicle film must

withstand air blow within ranges shown below:

Air pressure: ≤ 2.1 kgf/cm

(at input of the air blow

gun).

Nozzle diameter of the air blow gun: ≤ 2 mm.

Distance between the nozzle tip and the film: ≥ 25 mm.

4.1.2.6 Defect Limits — Maximum defect limits are

determined by agreement between the user and the

supplier. These are based on the pellicle standoff, the

numerical aperture and exposure wavelength of the

given type of exposure system, and a typical

specification is given in Table 4. For broadband

exposure systems a typical value of size would be 45

µm, and for monochromatic exposure systems the size

will be significantly smaller.

Table 4 Maximum Defect Limits

Characteristics

Max. No.

Allowable

Size Counted for Max.

No. Allowable

Non-removable

Particles None > size µm

Pinholes None >limit of detection

Scratches None Width > size µm

Dirt None >limit of detection

4.2 In addition, the following items may also be

specified:

4.2.1 Frame Material or Type

4.2.2 Frame Finishing or Coating

4.2.3 Frame Shape, Size and Height

4.2.4 Frame Adhesive Material or Type.

4.2.5 Frame Adhesive Thickness and Width.

4.2.6 Film Adhesive Material or Type

4.2.7 Film Adhesive Thickness and Width.

4.2.8 Film Thickness Uniformity.

4.2.9 Pellicle Vent Mechanism, e.g. vent hole.

4.2.10 Frame inner-wall adhesive.

4.3 If two pellicles will be attached to a photomask

then each pellicle should be independently specified.

For thicker photomask substrates a pellicle is only

attached to the patterned side of the photomask. For

thinner photomask substrates a pellicle is normally

attached to both the patterned and glass sides of the

photomask.

5 Requirements

5.1 Film Adhesive — Film must be sealed on the entire

top of the frame. Seal with a minimum of 50% of the

frame width at any location.

5.2 Frame Adhesive — Frame adhesive must be

continuous and allow no gaps larger than the Defect

Size Limit between pellicle frame and adhesive, and

between adhesive and photomask after attachment. No

part of the frame adhesive may extend beyond the

SEMI P5-0704 © SEMI 1986, 2004 3

frame wall, and its edges must be free of visually

detectable stringers (and particles). Adhesive should

form a complete seal between the frame and the mask

over a minimum of 60% of the width of the frame.

5.3 Frame — Pellicle frame must have no visually

detectable machining burrs, discontinuities in

anodization, or particles.

5.4 Light Resistance

5.4.1 For Broadband Exposure Systems this is

expressed by total exposure energy value (mj/cm

j/cm

) on pellicle film until dropping 1% of optical

transmission of one of the peak wavelengths between

360 nm–440 nm. The test conditions (special

characteristics of exposure wavelength, exposure

energy between 360 nm–440 nm, exposure conditions,

and others) must be stated. Under these conditions, the

pellicle shall release no material, which could

contaminate the photomask or the pellicle itself.

5.4.2 For Monochromatic Exposure Systems this is

expressed by total exposure energy value (mj/cm

j/cm

) of specified wavelength on pellicle’s film until

dropping 0.5% of optical transmission at specified

wavelength. Also, the test conditions (half bandwidth of

exposure specified wavelength, energy of exposure

specified wavelength, exposure conditions, and others)

must be stated. Under these conditions, the pellicle shall

release no material, which could contaminate the

photomask or the pellicle itself.

5.5 Other Characteristics — Other characteristics of

pellicles are to be determined between the supplier and

the user. The transmission of light for mask alignment

is such a characteristic.

6 Measurement Methods

6.1 Measurement methods are to be determined

between the user and supplier. General and example

methods are as follows:

Optical Transmission: by spectrophotometer

Optical Film Thickness: by spectrophotometer

Thickness Uniformity: by monochromatic (e.g., green)

light

Width of Film Adhesive: Visual check by minimum

defect sample

Defects: Visual check by maximum sample or particle

detector

7 Sampling

7.1 Inspection levels shall be agreed upon between the

user and supplier.

8 Handling

8.1 Pellicles are to be handled by the frame only.

9 Certification

9.1 Certification is to be determined between the user

and supplier.

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer's instructions, product labels,

product data sheets, and other relevant literature,

respecting any materials or equipment mentioned

herein. These standards are subject to change without

notice.

By publication of this standard, Semiconductor

Equipment and Materials International (SEMI) takes no

position respecting the validity of any patent rights or

copyrights asserted in connection with any items

mentioned in this standard. Users of this standard are

expressly advised that determination of any such patent

rights or copyrights, and the risk of infringement of

such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI P6-88

SPECIFICATION FOR REGISTRATION MARKS FOR PHOTOMASKS

1 General Specification

1.1 Scope

1.1.1 This specification defines the shape, range of

sizes, and general placement of a registration mark for

use on all photomasks. Methods of use will be stated in

accompanying application notes (to be furnished at a

later date).

1.2 Applicable Documents — None.

2 Detail Specifications

2.1 Introduction

2.1.1 The complete specification for this registration

mark is to be agreed upon by the circuit designer, mask

maker, and the mask user.

2.2 Requirements

2.2.1 This specification covers a defined mark placed

photolithographically on photomasks for the express

purpose of determining the registration accuracy of one

imaged photomask to another imaged photomask within

the same set of photomasks.

2.3 Other

2.3.1 This mark is not intended to be used for the

determination of overlay accuracy of an imaged layer of

a photomask onto a maker to any subsequent imaged

layers on the same wafer.

3 Guidelines for Shape and Sizes of

Registration Mark

3.1 The shape of the mark shall be in the form of a

cross (see Figure 1).

3.2 The area of intersection of the horizontal and

vertical lines shall be “user-defined.” The designer,

mask maker, or user may define any shape of geometry

within this area. The “user-defined” geometry used

shall not exceed the width or height of the area of

intersection (see Figure 2).

3.3 The width of both the horizontal and vertical lines

shall be equal.

3.4 The length of both the horizontal and vertical lines

shall be equal.

3.5 The width and length of the horizontal and vertical

lines may vary due to design rules, scaling, process

bias, etc. Table 1 lists the design dimensions for each

type of photomask. Sections 3.3 and 3.4 are not

superceded by this statement.

3.6 Any of the four quadrants created to the outside of

the cross shall be defined as “No-Man’s Land” and

shall not have any geometry or marks placed within

them (see Figure 3).

3.7 A field or registration mark (i.e., dark or clear) is

user-definable.

3.8 The mark shall be placed as per attached

application notes (to be furnished at a later date).