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SEMI P10-0705 © SEMI 1990, 2005 122 8.1.182 DEFECT_SIZE_DK_ISO_REP — Maximu m dimension of sm allest unaccepta ble dark, repeating isolated defect. 8.1.183 D EFECT_TYPE — (PINHOLE, EDGE, PINDOT, CD, SEMI_TRANS, MASSIVE, …

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SEMI P10-0705 © SEMI 1990, 2005 121
8.1.156 DATABASE_WITH_JOB — (T OR F) Database inspection must use job file (DATABASE_JOB_NAME
and DATABASE_JOB_LEVEL if supplied by customer) to consolidate pattern files.
8.1.157 DEFECT_COUNT — Integer maximum allowable number of defects within the INSPECTION_AREA.
8.1.158 DEFECT_COUNT_REP — Integer maximum number of repeating defects within the
INSPECTION_AREA.
8.1.159 DEFECT_DENSITY — Maximum allowable number of defects per square centimeter within the
INSPECTION_AREA.
8.1.160 DEFECT_EQUIP_REQD — Alphanumeric identification of acceptable equipment for defect inspection.
8.1.161 DEFECT_EQUIP_USED — Defect inspection equipment used.
8.1.162 DEFECT_INSP_DATE — DEFECT inspection date.
8.1.163 DEFECT_INSP_MODE_REQD — Alphanumeric operating mode for DEFECT_EQUIP_REQD.
8.1.164 DEFECT_INSP_MODE_USED — (text) DEFECT_EQUIP_USED operating mode.
8.1.165 DEFECT_INSP_PIXEL_SIZE_REQD — Pixel size used by DEFECT_EQUIP_REQD.
8.1.166 DEFECT_INSP_PIXEL_SIZE_USED — Pixel size used by DEFECT_EQUIP_USED.
8.1.167 DEFECT_INSP_SENSITIVITY_REQD — Sensitivity to be used by DEFECT_EQUIP_REQD.
8.1.168 DEFECT_INSP_SENSITIVITY_USED — Sensitivity used by DEFECT_EQUIP_USED.
8.1.169 DEFECT_QUALITY_ID — (text) Customer’s for a collection of defect quality specifications, to be used
only in addition to explicit quality requirement keywords. This may be used in the data structure in addition to, but
not in place of, explicit quality requirement keywords. This may not be used in combination with
QUALITY_GROUP_ID. Customer and vendor should document the meaning of this quality grade before using it in
SEMI P10.
8.1.170 DEFECT_SETUP_FILE_NAME_REQD — Alphanumeric name of setup file for
DEFECT_EQUIP_REQD.
8.1.171 DEFECT_SETUP_FILE_NAME_USED — Alphanumeric name of setup file for
DEFECT_EQUIP_USED.
8.1.172 DEFECT_SIZE — Maximum dimension of smallest unacceptable defectall types.
8.1.173 DEFECT_SIZE_CL — Maximum dimension of smallest unacceptable clear defect.
8.1.174 DEFECT_SIZE_CL_ADJ — Maximum dimension of smallest unacceptable clear, non-repeating edge
defect.
8.1.175 DEFECT_SIZE_CL_ADJ_REP — Maximum dimension of smallest unacceptable clear, repeating edge
defect.
8.1.176 DEFECT_SIZE_CL_ISO — Maximum dimension of smallest unacceptable clear, repeating isolated defect.
8.1.177 DEFECT_SIZE_CL_ISO_REP — Maximum dimension of smallest unacceptable clear, non-repeating
isolated defect.
8.1.178 DEFECT_SIZE_DK — Maximum dimension of smallest unacceptable dark defect.
8.1.179 DEFECT_SIZE_DK_ADJ — Maximum dimension of smallest unacceptable dark, non-repeating edge
defect.
8.1.180 DEFECT_SIZE_DK_ADJ_REP — Maximum dimension of smallest unacceptable dark, repeating edge
defect.
8.1.181 DEFECT_SIZE_DK_ISO — Maximum dimension of smallest unacceptable dark, non-repeating isolated
defect.
SEMI P10-0705 © SEMI 1990, 2005 122
8.1.182 DEFECT_SIZE_DK_ISO_REP — Maximum dimension of smallest unacceptable dark, repeating isolated
defect.
8.1.183 DEFECT_TYPE — (PINHOLE, EDGE, PINDOT, CD, SEMI_TRANS, MASSIVE, CLIPPED,
PATTERN, REFL_PATTERN, PAT_PINHOLE, REFL_PINHOLE, CORNER, LINE_END, BASIC, ISO,
MID_SIZE and others on request) Setup parameter for defect inspection.
8.1.184 DEFECTIVE_DIE_DENSITY — Maximum allowable number of die with defects per square centimeter
within the INSPECTION_AREA.
8.1.185 DEFECTIVE_DIE_COUNT — Integer maximum allowable number of die with defects within the
INSPECTION_AREA.
8.1.186 DEFECTIVE_DIE_COUNT_REP — Integer maximum number of repeating defective die within the
INSPECTION_AREA.
8.1.187 DELIVERABLE_MASK — (T or F) If F, the mask is to be held internally by the mask shop for the
production of other deliverable masks. For a MASK_ID with MULTIWRITE, only the final write and process step
MASK_ID within the multiwrite group may have DELIVERABLE_MASK = T.
8.1.188 DELIVERY_PRIORITY — Alphanumeric text, to be agreed between the customer and supplier, describing
urgency for delivery (e.g., rush, standard, slow).
8.1.189 DESIGN_RULE — Numeric data field indicates the nominal minimum dimension of wafer geometries.
8.1.190 DIE_TO_DIE_INSPECTION — (T or F) If T, die-to-die inspection is required.
8.1.191 DIE_TO_DIE_MEASUREMENTS – (T or F) If T, indicates that the defect inspection performed was die-
to-die. If F, indicates defect inspection performed was die-to-database.
8.1.192 DIGITIZED_DATA_DARK — (T or F) If T, the image of digitized data is to be opaque on the mask. If F,
the image of digitized data is to be clear.
8.1.193 DROPOUT — (x,y) Row and column of pattern or cell placement which is to be omitted in the array.
These array coordinates are rectangular (even if the actual written array is non-rectangular), with the origin at the
lower left of the array (chrome side up before mirroring).
8.1.194 DUE_DATE_TIME_COMMITTED — (date,time) For delivery (at customer) committed by vendor.
8.1.195 DUE_DATE_TIME_REQUESTED — (date,time) Requested for delivery (at customer).
8.1.196 DXF_ANGLE — (integer) To be used if DATA_FORMAT is DXF.
8.1.197 DXF_UNIT — (integer) To be used if DATA_FORMAT is DXF.
8.1.198 EDGE_ROUGHNESS — The (numeric) maximum value of edge roughness, based on physical
measurements.
8.1.199 ELAPSED_TIME — Numeric hours between masking steps in the wafer fab. Used in conjunction with
LAYER_PRIORITY, provides scheduled due dates based on the delivery of each previous mask. No mask may
have both ELAPSED_TIME and DUE_DATE_REQUESTED. See LAYER_PRIORITY.
8.1.200 ELAPSED_TIME_COMMITTED — Numeric hours for delivery (at customer) committed by vendor.
8.1.201 ELAPSED_WRITE_TIME — (number) The total time in minutes that the given lithography operation took
to write the mask.
8.1.202 EMAIL_ADDRESS — Internet address.
8.1.203 END_BARCODE — (text) must match data field of START_BARCODE.
8.1.204 END_BILLING_INFORMATION — (text) Indicates the end of the <billing_information> section. Must
match data field of START_BILLING_INFORMATION.
8.1.205 END_CD — Alphanumeric data field must match data field of START_CD.
SEMI P10-0705 © SEMI 1990, 2005 123
8.1.206 END_CD_GROUP_MEASUREMENTS — (text) must match data field of
START_CD_GROUP_MEASUREMENTS.
8.1.207 END_CD_ISO_DENSE — (text) must match data field of START_CD_ISO_DENSE.
8.1.208 END_CD_ISO_DENSE_RESULTS — (text) must match data field of
START_CD_ISO_DENSE_RESULTS
8.1.209 END_CD_MEASUREMENT — Alphanumeric data field must match data field of
START_CD_MEASUREMENT.
8.1.210 END_CD_SET— Alphanumeric data field must match data field of START_CD_SET.
8.1.211 END_CD_SET_RESULTS — Alphanumeric data field must match data field of
START_CD_SET_RESULTS.
8.1.212 END_CD_XY_DEFINITION — Alphanumeric data field must match data field of
START_CD_XY_DEFINITION.
8.1.213 END_CD_XY_RESULTS — Alphanumeric data field must match data field of
START_CD_XY_RESULTS.
8.1.214 END_CELL — Must match data field of CELL_ID for which data is complete.
8.1.215 END_CELL_INSTANCE — (text) must match data field of CELL_INSTANCE.
8.1.216 END_CELL_INSTANCE_OPTIONS — Must match data field of CELL_INSTANCE for which pattern
options are complete.
8.1.217 END_CELL_OPTIONS — Must match data field of CELL_ID for which options are complete.
8.1.218 END_CLOSURE_MEASUREMENTS — Must match START_CLOSURE_MEASUREMENTS data
field.
8.1.219 END_COATING — (text) Indicates the end of the <coating> section. Must match START_COATING
data field.
8.1.220 END_DATA_FRACTURE — Must match START_DATA_FRACTURE data field.
8.1.221 END_DATA_FUNCTION — Must match START_DATA_FRACTURE data field.
8.1.222 END_DATA_MANIPULATION — (text) must match data field of START_DATA_MANIPULATION.
8.1.223 END_DATA_MEDIUM — Must match data field of DATA_MEDIUM for which data is complete.
8.1.224 END_DATA_PATTERN_NAME — Must match data field of DATA_PATTERN_NAME.
8.1.225 END_DATA_SOURCE_FILE — Must match DATA_SOURCE_FILE data field.
8.1.226 END_DEFECT_DEFINITION — (text) must match data field of START_DEFECT_DEFINITION
8.1.227 END_DEFECT_MEASUREMENTS — (text) must match data field of
START_DEFECT_MEASUREMENTS.
8.1.228 END_ETCH_DEPTH_MEASUREMENTS — Must match START_ETCH_DEPTH_MEASUREMENTS
data field.
8.1.229 END_FTP_HOST — Must match data field of FTP_HOST_NAME.
8.1.230 END_LITHO_INFORMATION — Alphanumeric data field must match data field of
START_LITHO_INFORMATION.
8.1.231 END_MASK — Must match data field of MASK_ID for which data is complete.
8.1.232 END_MASK_GROUP — Must match data field of MASK_GROUP_ID for which data is complete.
8.1.233 END_MASK_GROUP_OPTIONS — Must match data field of MASK_GROUP_ID for which options are
complete.