semi合集-English.pdf - 第5631页

SEMI P10-0705 © SEMI 1990, 2005 126 8.1.287 ETCH_ DEPTH_MODE_USED — ( text) operating mode for ETCH_ DEPTH_EQUIP_USED . 8.1.288 ETCH_DEPTH_SITE_ID — Unique alphanumeric iden tifier of eac h etch depth measurement locatio…

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SEMI P10-0705 © SEMI 1990, 2005 125
8.1.262 END_SHIPPABLE_DATA — Must match data field of START_SHIPPABLE_DATA.
8.1.263 END_SUBSTRATE — Must match data field of START_SUBSTRATE.
8.1.264 END_SURFACE_DEFINITION — Must match data field of START_SURFACE_DEFINITION.
8.1.265 END_SURFACE_INSP_MEASUREMENTS — Must match data field of
START_SURFACE_INSP_MEASUREMENTS.
8.1.266 END_TITLE — (title number) Indicates end of keywords for a specific title. Must match data field of
START_TITLE for which data is complete.
8.1.267 END_TRANSMISSION_MEASUREMENTS — Must match data field of
START_TRANSMISSION_MEASUREMENTS.
8.1.268 END_VENDOR_INFO — Must match data field of START_VENDOR_INFO.
8.1.269 ENGINEERING_ADDRESS — Address for delivery of shippable engineering data.
8.1.270 ENGINEERING_CONTACT — Name of person to contact for technical questions.
8.1.271 ENGINEERING_EMAIL — Internet address for ENGINEERING_CONTACT.
8.1.272 ENGINEERING_FAX — Phone number for facsimile machine of ENGINEERING_CONTACT.
8.1.273 ENGINEERING_PHONE — Phone number for ENGINEERING_CONTACT.
8.1.274 EQUIP_SITE_REQD — Alphanumeric identification of qualified manufacturing site, to be agreed between
customer and vendor, for preceding required equipment. For a given MASK_ID, EQUIP_SITE_REQD may not be
used in combination with MFG_SITE_REQD.
8.1.275 ESTIMATED_ARRIVAL — The date and time when the vendor predicts MASK_ID will be delivered to
the customer, based on the MILESTONE most recently completed.
8.1.276 ESTIMATED_ARRIVALS — (T or F) If T, the vendor is requested to use <mask_results> to supply a
prediction of the delivery date and time when MASK_ID will be delivered to the customer, based on the
MILESTONE most recently completed. ESTIMATED_ARRIVAL will be transmitted each time <mask_results> is
required by either MILESTONES or PERIODIC_UPDATES. If neither have been requested, then
ESTIMATED_ARRIVAL should be transmitted daily.
8.1.277 ETCH_DEPTH_EQUIP_REQD — (text) Etch depth measurement equipment required by customer.
8.1.278 ETCH_DEPTH_EQUIP_USED — (text)
Etch depth measurement equipment used.
8.1.279 ETCH_DEPTH_ERROR — Maximum allowable deviation (in angstroms) of any etch depth measurement
from ETCH_DEPTH_TARGET.
8.1.280 ETCH_DEPTH_MARK_DRAWING — The uniquely identified (for each customer) document which
shows the etching depth measurement mark structure itself, and may show the place(s) within the etching depth
measurement mark which are to be measured.
8.1.281 ETCH_DEPTH_MARK_FEATURE — Text describing the feature to be used for phase etching depth
measurement.
8.1.282 ETCH_DEPTH_MARK_LOCATION — (x,y) Location of etching depth measurement mark relative to the
nominal center of the mask (chrome side up).
8.1.283 ETCH_DEPTH_MARK_LOCATION_DRAWING — The uniquely identified (for each customer)
document which shows the location(s) of the etching depth measurement mark structure.
8.1.284
ETCH_DEPTH_MEASUREMENT_DATE — Etch depth measurement date.
8.1.285 ETCH_DEPTH_MEASUREMENT_FILE_NAME — Name of data file containing results of etch depth
measurement.
8.1.286 ETCH_DEPTH_MODE_REQD — (text) operating mode required by customer for
ETCH_DEPTH_EQUIP_USED.
SEMI P10-0705 © SEMI 1990, 2005 126
8.1.287 ETCH_DEPTH_MODE_USED — (text) operating mode for ETCH_DEPTH_EQUIP_USED.
8.1.288 ETCH_DEPTH_SITE_ID — Unique alphanumeric identifier of each etch depth measurement location
within MASK_SET_ID to identify individual locations when using <mask_results>. If the same coordinates apply
to locations on different masks within the mask set, they may have the same ETCH_DEPTH_SITE_ID, but it is not
mandatory.
8.1.289 ETCH_DEPTH_RANGE — Maximum acceptable variation (in angstroms) of all etch depth measurements,
relative to each other.
8.1.290 ETCH_DEPTH_REFERENCE_ONLY — (T or F) If T, indicates that the etch depth feature is to be
measured and the data transmitted to the customer (if requested by SHIP_PHASE_SHIFT_MEASUREMENTS), but
that deviations in its measured value due to mask processing would NOT be cause for mask rejection.
8.1.291 ETCH_DEPTH_TARGET — Desired mean etch depth in angstroms.
8.1.292 ETCH_DEPTH_TOLERANCE — Maximum acceptable deviation (in angstroms) of the mean of all
measured critical dimensions to the ETCH_DEPTH_TARGET.
8.1.293 EUV_ABSORBER_COMPOSITION (text) — Composition of the absorber stack of an EUV mask, to be
agreed on between customer and supplier, as per SEMI P38.
8.1.294 EUV_ABSORBER_OPTICAL_PROPERTIES — Percentage of absorber reflectivity as defined in Table
11 OF SEMI P38.
8.1.295 EUV_BLANK_RESISTANCE (numeric) — Electrical resistance (in Ohms) measured between the surface
of the absorber stack and the backside of the mask blank.
8.1.296 EUV_BLANK_TYPE — Type of EUV mask blank as defined in Table 1 of SEMI P38.
8.1.297 EUV_CAPPING_COMPOSITION (text) — Composition of capping layers on the multilayer stack of an
EUV mask, to be agreed on between customer and supplier, as per SEMI P38.
8.1.298 EUV_EXPANSION_COEFF — Grade of coefficient of thermal expansion for EUV mask blank as defined
in Table 3 of SEMI P37.
8.1.299 EUV_FLATNESS_BACK — Grade of flatness required for back side of EUV mask within flatness quality
area as per Figure 3 and Table 4 of SEMI P37.
8.1.300 EUV_FLATNESS_FRONT — Grade of flatness required for front side of EUV mask within flatness
quality area as per Figure 3 and Table 4 of SEMI P37.
8.1.301 EUV_MEAN_PEAK_REFLECTIVITY — Grade for percentage reflectivity of the EUV multilayer stack,
as per Table 5 of SEMI P38.
8.1.302 EUV_MMR_WAVELENGTH (wavelength) — Wavelength in nanometers of the mean median reflected of
the multilayer stack of an EUV mask, to be agreed on between customer and supplier, as per SEMI P38.
8.1.303 EUV_MULTILAYER_COMPOSITION (text) — Material composition of the multilayers of an EUV
mask, to be agreed on between customer and supplier, as per SEMI P38.
8.1.304 EUV_PEAK_REFLECTIVITY_UNIFORMITY — Grade of reflectivity uniformity required per Table 6 of
SEMI P38.
8.1.305 EWT_CEILING — (numeric) The maximum monetary amount that can be added to PRICE as an excess
write time charge for the mask. If the charge calculated with EWT_RATE exceeds EWT_CEILING, then
EWT_CEILING is used as the excess write time charge.
8.1.306 EWT_RATE — (numeric) The monetary amount per minute to be added to PRICE for write time
exceeding the EWT_THRESHOLD time. The monetary unit is defined in PRICE_UNITS.
8.1.307
EWT_THRESHOLD — (numeric) The number of minutes that a mask can write before incurring an
Excess Write Time (EWT) charge.
SEMI P10-0705 © SEMI 1990, 2005 127
8.1.308 EXTERNAL_WINDOW — (x1,y1,x2,y2) Area to have all digitized data removed outside the window
described by (x1,y1,x2,y2), relative to the coordinate space of DATA_SOURCE_FILE. The extents of the pattern
file are thus defined by the window.
8.1.309 FAB_TECHNOLOGY – (text) Customer’s designation for the fabrication unit’s wafer manufacturing
process
8.1.310 FIGURE_COUNT — Total number of geometries which are expected in the pattern file. If this is incorrect,
the mask will not be written until it is corrected.
8.1.311 FILE_DATE_TIME — (x,y) Date and time of transmission of mask order. Format will be as in § 6.19.
8.1.312 FILM_COLOR — Color to be used for the mask film.
8.1.313 FILM_NORMAL_TONE — (T or F) If T, digitized data will be dark.
8.1.314 FILM_SCALE — Numeric scale of the film of the mask image.
8.1.315 FILM_SIZE — (x,y) Size in inches of the film.
8.1.316 FINAL_AUDIT_DATE_TIME – (date) The date and time of the finalquality audit prior to shipping the
mask to the customer.
8.1.317 FINAL_QC_AUDITOR — (text) Mask supplier identification of
final Quality Control auditor.
8.1.318 FRACTURE_FILE — Alphanumeric file name of fracture instructions provided by the customer with the
mask order.
8.1.319 FRACTURE_FILE_FORMAT — Format of FRACTURE_FILE (CATS, K2, and others on request).
8.1.320 FRACTURING_SCALE — For optical data (Mann or Electromask) only, this is the scale factor to use in
fracturing the data to E-beam format.
8.1.321 [FTP_DIRECTORY] — Name of target directory for FTP data.
8.1.322 FTP_HOST_NAME — Domain of the FTP host, either in the form n.n.n.n where n is an integer from 0 to
255, or in an equivalent text name if such is supported by the FTP site.
8.1.323 [FTP_LOGIN] — The login name for an FTP account. If an anonymous FTP is used, the data field will be
“anonymous”.
8.1.324 [FTP_MODE] — (ASCII, BINARY or AUTO) Data encoding type for FTP data. If absent, default is
BINARY.
8.1.325 [FTP_PASSWORD] — Password for FTP account.
8.1.326 GOOD_FIELDS — Specifies the 1X reticle fields which must pass inspection criteria and is applied to the
cells immediately instanced by the preceding CELL_ID. Fields are referenced by numbers assigned from left to right
according to their position on the mask, chrome side up. For example, for a mask with 5 fields, the fields would be:
1 2 3 4 5
The required good fields are specified by any logical combination of field numbers, “AND”, “OR”, and parentheses.
In the above example, “(1 OR 2) AND (3 OR 4) AND 5” would require that either 1 or 2 be good, and either 3 or 4
be good, and that 5 be good. No logical precedence is assumed; precedence is defined only by parentheses. This
keyword applies only to 1X reticles.
8.1.327 GUIDES_REQD — (STANDARD, WIDE or BOTH) Applies to 1X reticles only.
8.1.328 INPUT_FILE_FORMAT — Format of INPUT_FILE_NAME.
8.1.329 INPUT_FILE_NAME — (text) Name identifying the input file for RUNSET_NAME. If this keyword
appears in the <mask_order>, it must be explicitly referenced in a RUNSET_NAME and/or a
PARAMETER_FILE_NAME.
8.1.330 INSP_DATABASE_DATA_FORMAT — Alphanumeric description of format for
SHIP_INSP_DATABASE_DATA.