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SEMI P40-1103 © SEMI 2003 6 Pin sidewall angle Chuck Pin spacing, S p θ Pin period, P p Pin height, H p Figure 5 Dimensions of Pins or Pede stals on the Chuck Surface NOTICE: SEMI makes no warranties or represen tations …

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SEMI P40-1103 © SEMI 2003 5
P
1
Mounting surface
Flatness error
Chuck
Figure 3
Definition of Flatness Error
P
1
is the best fit plane that minimizes the maximum deviation of the surface from P
1
.
P
1
Mounting surface
Flatness error
Chuck
Figure 4
Definition of Flatness Error for a Pin or Pedestal Chuck
P
1
is the best fit plane that minimizes the maximum deviation from the surface that passes through the
highest points on the chuck surface.
SEMI P40-1103 © SEMI 2003 6
Pin sidewall angle
Chuck
Pin spacing, S
p
θ
Pin period, P
p
Pin height, H
p
Figure 5
Dimensions of Pins or Pedestals on the Chuck Surface
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
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Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI P41-0304
E
© SEMI 2004 1
SEMI P41-0304
E
SPECIFICATION FOR MASK DEFECT DATA HANDLING WITH XML,
BETWEEN DEFECT INSPECTION TOOLS, REPAIR TOOLS, AND
REVIEW TOOLS
This specification was technically approved by the Global Micropatterning Committee and is the direct
responsibility of the Japanese Micropatterning Committee. Current edition approved by the Japanese
Regional Standards Committee on January 9, 2004. Initially available at www.semi.org February 2004; to be
published March 2004.
E
This standard was modified in September 2004 to correct editorial errors. Changes were made to Tables 2
and 3.
1 Purpose
1.1 This data structure specification uses the standard
XML format for defect information communication
between defect inspection tools, repair tools, and
review tools at the mask production floor.
1.1.1 Mutual use of the defect information between the
tools.
1.1.2 Optional usage by tools and systems other than
defect inspection, repair, and review tools.
1.2 The equipment suppliers who utilize this
standardized data structure can send and receive
required information, with no dependence on specific
software and specific hardware.
2 Scope
2.1 This standard can be applied to defect-related
information on photomasks for semiconductor
manufacturing.
2.2 This data structure defines the data hierarchy, the
tag name, and contents of an XML file, which are
transmitted. A particular database or a particular
programming language is not specified in this standard.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 This standard does not include the provision of
defect information for wafer fabs.
3.2 This standard does not specify particular schema.
3.3 This standard does not address the name space
issue.
4 Referenced Standards
4.1
World Wide Web Consortium Documents
1
Extensible Markup Language (XML) 1.0 (Second
Edition) — W3C,6 October 2000
(
http://www.w3.org/TR/2000/REC-xml-20001006)
4.2 JEITA Documents
2
Reticle Data Management Guideline Ver.1.0 (2001)
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
5 Terminology
5.1 Abbreviations and Acronyms
5.1.1 MDML — Mask Defect Markup Language
5.2 Definitions
5.2.1 defect inspection information — the information
gathered with mask defect inspection tools, such as
defect position and shape.
5.2.2 mask defect markup language — the name of the
XML file defined in this standard.
6 Requirements
6.1 This standard defines the layered structure of an
XML file, an element name, an attribute name and the
contents described in them. Users of this standard have
to define the style of the information described in an
element and an attribute, and it must be published.
6.2 The information on defect inspection information,
defect repair information, and defect review
information is treated as one file. The MDML data
item specifications defined in this standard are shown in
1 World Wide Web Consortium (W3C), ,Website:
http://www.w3c.org
2 Japanese Electronic and Information Technology Industries
Association, Tokyo Chamber of Commerce and Industry Bldg. 2-2,
Marunouchi 3-chome, Chiyoda-ku, Tokyo 100-0005, Japan. Website:
http://www.jeita.or.jp