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SEMI P43-0304 © SEMI 2004 1

SEMI P43-0304

PHOTOMASK QUALIFICATION TERMINOLOGY

This terminology was technically approved by the Global Micropatterning Committee and is the direct

responsibility of the European Micropatterning Committee. Current edition approved by the European

Regional Standards Committee on January 9, 2004. Initially available at www.semi.org February 2004; to be

published March 2004. This document replaces SEMI PR7-0302 in its entirety.

1 Purpose

1.1 This standard defines a unique language in the field

of specification for, and qualification of, photomasks

for use in optical lithography within the semiconductor

industry.

2 Scope

2.1 At present only the International Technology

Roadmap for Semiconductors (ITRS) serves as a

universally accepted working document on how to

specify photomasks, however the definitions used are

subject to interpretation. Different tool makers, mask

makers and mask users are hindered in the

communication with each other, as they first need to

know and understand each others terminology. The

lack of a common terminology complicates comparison

of tools. A uniformly used, and universally accepted

terminology, with a minimum of ambiguity, is required.

2.2 The definitions listed are for mask qualification,

incorporating 3 possible types of value for a given

qualification parameter:

• <(true) qualification parameter>, which would be

the result of an ideal measurement of the total

population of features of interest

• <measured qualification parameter>, the result of

a given population of measurements. It is hereby

mentioned that a measured value (for example the

mean, the standard deviation, the range) is always

subject to the sample size of the measured

population and the measurement method.

Therefore both the sample size and the

measurement method are mandatory information.

• <qualification parameter spec(ification)>, the

maximum or minimum value that may not be

exceeded for the selected population of

measurements which must be defined as mandatory

information.

2.2.1 The first two types of value for a given

parameter, the true and measured qualification

parameters, will be defined in the present document.

1 See reference document in Section 4.2.

2.2.2 The third parameter type, the parameter

specification, will not be discussed here, since it is

subject to the agreement between the individual parties

of the mask qualification process.

2.3 In order to assist users, the major differences in

recommended default values between this standard and

the ITRS mask table definitions are noted where

applicable.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 This document is restricted to dimensional

metrology aspects. Other conventional mask

qualification aspects, including those related to

materials, overlay and defectivity, are not considered

within the scope of this version.

3.2 The definitions listed are specific to state-of-the-art

photomasks, with a focus on reduction reticles. They

may therefore overrule any related terminology in other

standards, with a more general scope. Application to

other types of masks, e.g., for next generation

lithography, may be feasible, but is not within the scope

of the present document.

4 Referenced Standards

4.1 SEMI Standards

SEMI P10 — Specification of Data Structures for

Photomask Orders

SEMI P19 — Specification for Metrology Pattern Cells

for Integrated Circuit Manufacture

SEMI P21 — Guidelines for Precision and Accuracy

Expression For Mask Writing Equipment

SEMI P22 — Guideline for Photomask Defect

Classification and Size Definition

SEMI P24 — CD Metrology Procedures

SEMI P35 — Terminology for Microlithography

Metrology