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SEMI G1-96 © SEMI 1 980, 199 6 13 NOTICE: These st andards do not purport to addres s safety issues, if any, ass o ciated with their use. It is the responsibility of t he user of these standards to establish appropriate …

SEMI G1-96 © SEMI 1980, 1996 12

APPENDIX 2

CERAMIC CERDIP CAP DIMENSIONS AND TOLERANCE

REQUIREMENTS — STANDARD OUTLINES

Table 4 Ceramic Cerdip Cap Dimensions and Tolerance Requirements

Description Body Length Body Width

Thickness

Min. Max. Cavity Length Cavity Width

Cavity Depth

(Measured at

Cavity

Bottom) Units

8SSI 0.380 ± 0.004 0.248 ± 0.003 0.050 - 0.055 0.260 ± 0.004 0.157 ± 0.003 0.018 ± 0.003 in

9.65 ± 0.102 6.30 ± 0.076 1.27 - 1.40 6.60 ± 0.102 6.60 ± 0.102 3.99 ± 0.076 mm

8LSI 0.380 ± 0.004 0.288 ± 0.003 0.050 - 0.055 0.260 ± 0.004 0.185 ± 0.003 0.018 ± 0.003 in

9.65 ± 0.012 7.32 ± 0.076 1.27 - 1.40 6.60 ± 0.102 4.70 ± 0.076 0.457 ± 0.076 mm

14/16SSI 0.760 ± 0.007 0.248 ± 0.004 0.050 - 0.055 0.350 ± 0.004 0.157 ± 0.003 0.018 ± 0.003 in

19.30 ± 0.178 6.81 ± 0.076 1.27 - 1.40 8.89 ± 0.102 4.32 ± 0.076 0.457 ± 0.076 mm

16SLI/VLSI 0.760 ± 0.007 0.288 ± 0.003 0.050 - 0.055 0.450 ± 0.005 0.195 ± 0.003 0.018 ± 0.003 in

19.30 ± 0.178 7.32 ± 0.076 1.27 - 1.40 10.67 ± 0.127 4.95 ± 0.076 0.457 ± 0.076 mm

18MSI 0.890 ± 0.008 0.268 ± 0.003 0.050 - 0.055 0.350 ± 0.004 0.170 ± 0.003 0.018 ± 0.003 in

22.61 ± 0.203 6.81 ± 0.076 1.27 - 1.40 8.89 ± 0.102 4.32 ± 0.076 0.457 ± 0.076 mm

18LSI 0.890 ± 0.008 0.288 ± 0.003 0.050 - 0.055 0.350 ± 0.004 0.185 ± 0.003 0.018 ± 0.003 in

22.61 ± 0.203 7.32 ± 0.076 1.27 - 1.40 8.89 ± 0.102 4.70 ± 0.076 0.457 ± 0.076 mm

18VLSI 0.890 ± 0.008 0.288 ± 0.003 0.050 - 0.055 0.420 ± 0.004 0.195 ± 0.003 0.018 ± 0.003 in

22.61 ± 0.203 7.32 ± 0.076 1.27 - 1.40 10.67 ± 0.102 4.95 ± 0.076 0.457 ± 0.076 mm

20MSI 0.950 ± 0.010 0.268 ± 0.003 0.050 ± 0.055 0.300 ± 0.004 0.170 ± 0.003 0.018 ± 0.003 in

24.13 ± 0.254 6.81 ± 0.076 1.27 - 1.40 7.62 ± 0.102 4.32 ± 0.076 4.57 ± 0.076 mm

20LSI/VLSI 0.950 ± 0.010 0.288 ± 0.003 0.050 - 0.055 0.380 ± 0.004 0.190 ± 0.003 0.018 ± 0.003 in

24.13 ± 0.254 7.32 ± 0.076 1.27 - 1.40 9.65 ± 0.102 4.83 ± 0.076 0.457 ± 0.076 mm

22MSI/LSI/VL

1.070 ± 0.010 0.380 ± 0.004 0.050 - 0.055 0.370 ± 0.005 0.275 ± 0.004 0.018 ± 0.003 in

27.17 ± 0.254 9.65 ± 0.102 1.27 - 1.40 9.40 ± 0.127 6.99 ± 0.102 0.457 ± 0.076 mm

24MSI/LSI 1.250 ± 0.010 0.520 ± 0.006 0.050 - 0.055 0.400 ± 0.005 0.330 ± 0.005 0.018 ± 0.003 in

31.75 ± 0.254 13.21 ± 0.152 1.27 - 1.40 10.16 ± 0.127 8.38 ± 0.127 0.457 ± 0.076 mm

24VLSI 1.250 ± 0.010 0.577 ± 0.006 0.050 - 0.056 0.560 ± 0.006 0.380 ± 0.005 0.018 ± 0.003 in

31.75 ± 0.254 14.65 ± 0.152 1.27 - 1.42 14.22 ± 0.152 9.65 ± 0.127 0.457 ± 0.076 mm

24SD3S 1.250 ± 0.010 0.288 ± 0.003 0.050 - 0.055 0.350 ± 0.004 0.190 ± 0.003 0.018 ± 0.003 in

31.75 ± 0.254 7.32 ± 0.076 1.27 - 1.40 8.89 ± 0.102 4.83 ± 0.076 0.457 ± 0.076 mm

24SD3M 1.250 ± 0.010 0.288 ± 0.003 0.050 - 0.055 0.490 ± 0.005 0.195 ± 0.003 0.018 ± 0.003 in

31.75 ± 0.254 7.32 ± 0.076 1.27 - 1.40 12.45 ± 0.127 4.95 ± 0.076 0.457 ± 0.076 mm

24SD4M 1.250 ± 0.010 0.380 ± 0.004 0.050 - 0.055 0.235 ± 0.004 0.235 ± 0.004 0.018 ± 0.003 in

31.75 ± 0.254 9.65 ± 0.102 1.27 - 1.40 5.97 ± 0.102 5.97 ± 0.102 0.457 ± 0.076 mm

28MSI/LSI 1.450 ± 0.010 0.520 ± 0.006 0.050 - 0.055 0.400 ± 0.005 0.330 ± 0.005 0.018 ± 0.003 in

36.83 ± 0.254 13.21 ± 0.152 1.27 - 1.40 10.16 ± 0.127 8.38 ± 0.127 0.457 ± 0.076 mm

28VLSI 1.450 ± 0.010 0.577 ± 0.006 0.050 - 0.056 0.560 ± 0.005 0.380 ± 0.005 0.018 ± 0.003 in

36.83 ± 0.254 14.65 ± 0.152 1.27 - 1.42 14.22 ± 0.127 9.65 ± 0.127 0.457 ± 0.076 mm

40 MSI/LSI 2.050 ± 0.012 0.520 ± 0.006 0.050 - 0.055 0.475 ± 0.005 0.365 ± 0.005 0.018 ± 0.003 in

52.07 ± 0.305 13.21 ± 0.152 1.27 - 1.40 12.07 ± 0.127 9.27 ± 0.127 0.457 ± 0.076 mm

48MSI 2.450 ± 0.015 0.577 ± 0.006 0.050 - 0.056 0.400 ± 0.005 0.400 ± 0.005 0.018 ± 0.003 in

14.65 ± 0.152 14.65 ± 0.152 1.27 - 1.42 10.16 ± 0.127 10.16 ± 0.127 0.457 ± 0.076 mm

SEMI G1-96 © SEMI 1980, 199613

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

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are expressly advised that determination of any such

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of such rights, are entirely their own responsibility.

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SEMI G2-94 © SEMI 19941

SEMI G2-94

SPECIFICATION FOR METALLIC LEADFRAMES FOR CER-DIP

PACKAGES

1 Preface

1.1 Purpose — This specification defines the materials

and dimensions for the metallic leadframe (stamped or

etched) used in the construction of Cer-DIP Package.

1.2 Scope — The criteria detailed in this document

applies to the iron-nickel leadframe (MIL-M-38510

Type A or Type B) used in Cer-DIP packages.

1.3 Units — U.S. Customary (inch -pound) or metric

(SI) units may be used at the customer’s discretion.

This specification uses the U.S. Customary units as the

prime unit.

2 Referenced Documents

2.1 This document specifically refers to:

MIL-I-23011 — Iron/Nickel Alloys for Sealing to

Glasses and Ceramics

MIL-M-38510 — General Specifications for

Microcircuits

MIL-STD-883 — Test Methods and Procedures for

Microelectronics

2.2 Related information may also be found in:

MIL-STD-105 — Sampling Procedures and Tables for

Inspection by Attributes

3 Terminology

bonding area — Coined area on bond fingers within a

distance of 0.762 mm (0.030") from lead tips.

bottom formed width — See Figure 3.

bow — Curvature of the leadframe strip in the vertical

plane; see Figure 1.

burr — Fragment of excess parent material attached to

the leadframe edges.

camber — Curvature of the leadframe strip edge in the

horizontal plane; see Figure 2.

coined area — The area of the bond fingers planished

to produce a flattened area for functional use; see

Figure 3.

coplanarity — The total indicator reading difference of

the lead tips in the Z direction.

1 Military Standards, Naval Publications and Form Center, 5801

Tabor Ave., Philadelphia, PA 19120

datum plane — M is datum plane; see Figure 3.

discoloration — A darkening or staining of the

aluminum (metallization).

foreign material — Any adhering residue which is not

part of the leadframe composition.

pit — A shallow surface depression or crater with a

visible edge.

planarity — Total indicator reading of the lead tips in

the Z direction relative to datum M.

projection — A raised portion of the surface indigenous

with the parent material, other than a burr.

slug marks — Random dents in the leadframe.

stamped leadframe terminology — See Figure 3.

tilt — The deviation of the plane of the coined area

from a condition parallel to the plane on datum M.

top formed width — See Figure 3.

twist — The angular rotation of one end of the

leadframe or strip with reference to the other end; see

Figure 4.

void — An absence of aluminization from a designated

area of the leadframe.

4 Ordering Information

Purchase order for Cer-DIP metallic leadframes

furnished to this specification shall include the

following items:

4.1 Current drawing of the leadfra me showing all

dimensions and tolerances, including the location of the

metallization layer.

4.2 Material,

4.3 Number of leads,

4.4 Material tensile strength,

4.5 Metallization thickness and type,

4.6 Form of leadframes (i.e., singles, scored strips, or

unscored strips),

4.7 Number of frames per strip; as applicable,

4.8 Material certification,

4.9 Packaging and marking.