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SEMI G2-94 © SEMI 1994 5 Desc ription Cavity Length Cavity W idth Lead-For med Widt h, Top Bond Finge r Layout End vs. Side Nominal Progres sion Unit 24SD3M 0 .430 ± 0.010 0.180 ± 0.01 0 0.311 ± 0.003 8 4 1.510 in 10.92 …

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SEMI G2-94 © SEMI 1994 4
Table 1 Typical Ceramic Cer-DIP Metallic Leadframes Dimension and Tolerance Requirements
Description Cavity Length Cavity Width Lead-Formed Width, Top
Bond Finger Layout
End vs. Side
Nominal
Progression Unit
8SSI - 0.120 ± 0.007 0.311 ± 0.003 0 4 0.945 in
3.05 ± 0.178 7.90 ± 0.076 24.00 mm
8MSI - 0.140 ± 0.007 0.311 ± 0.003 0 4 0.945 in
3.56 ± 0.178 7.90 ± 0.076 24.00 mm
8LSI - 0.160 ± 0.007 0.311 ± 0.003 0 4 0.945 in
4.06 ± 0.178 7.90 ± 0.076 24.00 mm
14SSI 0.160 ± 0.007 0.120 ± 0.007 0.311 ± 0.003 4 3 0.945 in
4.06 ± 0.178 3.05 ± 0.178 7.90 ± 0.076 24.00 mm
14MSI 0.260 ± 0.007 0.140 ± 0.007 0.311 ± 0.003 4 3 0.945 in
6.60 ± 0.178 3.56 ± 0.178 7.90 ± 0.076 24.00 mm
16SSI 0.160 ± 0.007 0.120 ± 0.007 0.311 ± 0.003 4 4 0.945 in
4.06 ± 0.178 3.05 ± 0.178 7.90 ± 0.076 24.00 mm
16MSI 0.260 ± 0.007 0.140 ± 0.007 0.311 ± 0.003 4 4 0.945 in
6.60 ± 0.178 3.56 ± 0.178 7.90 ± 0.076 24.00 mm
16LSI 0.260 ± 0.007 0.170 ± 0.007 0.311 ± 0.003 4 4 0.945 in
6.60 ± 0.178 4.32 ± 0.178 7.90 ± 0.076 24.00 mm
16SLSI 0.360 ± 0.007 0.170 ± 0.007 0.311 ± 0.003 4 4 0.945 in
9.14 ± 0.178 4.32 ± 0.178 7.90 ± 0.076 24.00 mm
16VLSI 0.330 ± 0.007 0.180 ± 0.007 0.311 ± 0.003 6 2 0.945 in
8.38 ± 0.178 4.57 ± 0.178 7.90 ± 0.076 24.00 mm
18MSI 0.260 ± 0.008 0.140 ± 0.008 0.311 ± 0.003 4 5 1.061 in
6.60 ± 0.203 3.56 ± 0.203 7.90 ± 0.076 26.95 mm
18LSI 0.260 ± 0.008 0.170 ± 0.008 0.311 ± 0.003 6 3 1.061 in
6.60 ± 0.203 4.32 ± 0.203 7.90 ± 0.076 26.95 mm
18VLSI 0.330 ± 0.008 0.180 ± 0.008 0.311 ± 0.003 6 3 1.061 in
8.38 ± 0.203 4.57 ± 0.203 7.90 ± 0.076 26.95 mm
20MSI 0.210 ± 0.008 0.140 ± 0.008 0.311 ± 0.003 4 6 1.175 in
5.33 ± 0.203 3.56 ± 0.203 7.90 ± 0.076 29.85 mm
20LSI 0.260 ± 0.008 0.170 ± 0.008 0.311 ± 0.003 6 4 1.175 in
6.60 ± 0.203 4.32 ± 0.203 7.90 ± 0.076 29.85 mm
20VLSI 0.330 ± 0.008 0.175 ± 0.008 0.311 ± 0.003 6 4 1.175 in
8.38 ± 0.203 4.45 ± 0.203 7.90 ± 0.076 29.85 mm
22MSI 0.270 ± 0.010 2.10 ± 0.010 0.411 ± 0.003 6 5 1.250 in
6.86 ± 0.254 5.33 ± 0.254 10.44 ± 0.076 31.75 mm
22LSI 0.310 ± 0.010 0.240 ± 0.010 0.411 ± 0.003 6 5 1.250 in
7.87 ± 0.254 6.10 ± 0.254 10.44 ± 0.076 31.75 mm
22VLSI 0.350 ± 0.010 0.260 ± 0.010 0.411 ± 0.003 8 3 1.250 in
8.89 ± 0.254 6.60 ± 0.254 10.44 ± 0.076 31.75 mm
24MSI 0.260 ± 0.010 0.260 ± 0.010 0.611 ± 0.003 6 6 1.510 in
8.38 ± 0.254 6.60 ± 0.254 15.01 ± 0.076 38.35 mm
24LSI 0.330 ± 0.010 0.285 ± 0.010 0.611 ± 0.003 6 6 1.510 in
8.38 ± 0.254 7.24 ± 0.254 15.01 ± 0.076 38.35 mm
24VLSI 0.420 ± 0.010 0.290 ± 0.010 0.611 ± 0.003 6 6 1.510 in
10.67 ± 0.254 7.37 ± 0.254 15.01 ± 0.076 38.35 mm
24SD3S 0.260 ± 0.010 0.170 ± 0.010 0.311 ± 0.003 6 6 1.510 in
6.60 ± 0.254 4.32 ± 0.254 7.90 ± 0.076 38.35 mm
SEMI G2-94 © SEMI 19945
Description Cavity Length Cavity Width Lead-Formed Width, Top
Bond Finger Layout
End vs. Side
Nominal
Progression Unit
24SD3M 0.430 ± 0.010 0.180 ± 0.010 0.311 ± 0.003 8 4 1.510 in
10.92 ± 0.254 4.57 ± 0.254 7.90 ± 0.076 38.35 mm
24SD4M 0.210 ± 0.010 0.210 ± 0.010 0.411 ± 0.003 6 6 1.510 in
5.33 ± 0.254 5.33 ± 0.254 10.44 ± 0.076 38.35 mm
28MSI 0.260 ± 0.011 0.260 ± 0.011 0.611 ± 0.003 8 6 1.724 in
6.60 ± 0.279 6.60 ± 0.279 15.01 ± 0.076 43.79 mm
28LSI 0.325 ± 0.011 0.275 ± 0.011 0.611 ± 0.003 8 6 1.724 in
8.26 ± 0.279 6.99 ± 0.279 15.01 ± 0.076 43.79 mm
28VLSI 0.420 ± 0.011 0.280 ± 0.011 0.611 ± 0.003 8 6 1.724 in
10.67 ± 0.279 7.11 ± 0.279 15.01 ± 0.076 43.79 mm
40MSI 0.270 ± 0.012 0.260 ± 0.012 0.611 ± 0.003 10 10 2.300 in
6.86 ± 0.305 6.60 ± 0.305 15.01 ± 0.076 58.42 mm
40LSI 0.375 ± 0.012 0.295 ± 0.012 0.611 ± 0.003 12 8 2.300 in
9.53 ± 0.305 7.49 ± 0.305 15.01 ± 0.076 58.42 mm
NOTE: While a 0.311 top form is still currently being used, numerous users have changed to a 0.314 top form to prevent interference between the
Cer-DIP base and leadframe.
Table 2
Leads Planarity Coplanarity
8–14–16 +0.003"/–0.004" (+ 0.076 mm/–0.102 mm) 0.004" (0.102 mm)
18 +0.004"/–0.005" (+0.102 mm/–0.127 mm) 0.005" (0.127 mm)
20 +0.004"/–0.005" (+0.102 mm/–0.127 mm) 0.006" (0.152 mm)
22 +0.004"/–0.006" (+0.102 mm/–0.152 mm) 0.006" (0.152 mm)
24 +0.004"/–0.006" (+0.102 mm/–0.152 mm) 0.007" (0.178 mm)
28 +0.005"/–0.007" (+0.127 mm/–0.178 mm) 0.008" (0.203 mm )
40 +0.006"/–0.008" (+0.152 mm/–0.203 mm) 0.010" (0.254 mm)
SEMI G2-94 © SEMI 1994 6
Figure 1
Bow
Figure 2
Camber
Figure 3
Stamped Leadframe Terminology