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SEMI G9-89 © SEMI 1 980, 199 6 1 SEMI G9-89 SPECIFICA TION FOR STAMPED LEA D FRAMES FOR PLA STIC MOLDED DUAL-IN-LINE SEM ICONDUCTOR PACKAGES 1 Preface This specificatio n is a guideline for the sta mping manufacture of l…
SEMI G8-94 © SEMI 1983, 19963
10.4 Functional Tests
10.4.1 Die Attach and Wire Bond
10.4.1.1 Die Attach and Wire Bond tests shall be
performed using materials and conditions agreed
between vendor and customer.
10.4.1.2 Die Attach shall be evaluated for shear
strength per MIL-STD-883, Method 2019 or by a
method agreed between vendor and customer.
Resin bleed-out shall also be evaluated when the extent
of the bleed may affect subsequent wire bonding
processes.
10.4.2 Solderability
10.4.2.1 Solderability testing, with or without aging,
shall be agreed between vendor and customer.
Solderability testing shall be performed per MIL-STD-
883, Method 2003.
10.5 Salt Atmosphere Test
10.5.1 Salt Atmosphere Testing Requirements —
Applicability and condition shall be agreed between
vendor and customer. Salt atmosphere testing shall be
performed per MIL-STD-883, Method 1009 or MIL-
STD-750, Method 1041 as appropriate.
10.6 Plating Hardness
10.6.1 If specified, the plating hardness shall be
determined by one of the following methods as
appropriate:
ASTM B 384
ASTM E 10
Note 6: Hardness testing for thin plating is difficult and not
very reliable. The hardness specification shall be agreed
between user and supplier.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G9-89 © SEMI 1980, 19961
SEMI G9-89
SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC
MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES
1 Preface
This specification is a guideline for the stamping
manufacture of leadframes for plastic molded dual-in-
line semiconductor packages. It is a design guideline
for packaging engineers, leadframe stampers and mold
manufacturers, and has been developed to meet the
requirements of automatic bonding.
2 Applicable Documents
2.1 This document specifically ref ers to:
SEMI G4 — Specification for Integrated Circuit
Leadframe Materials Used in the Production of
Stamped Leadframes
SEMI G10 — Standard Method of Mechanical
Measurement
SEMI G21 — Specification for Plating Integrated
Circuit Leadframes
2.2 Related information may also be found in:
MIL-STD-105
1
— Sampling Procedures and Tables for
Inspection by Attributes
MIL-STD-883 — Test Methods and Procedures for
Microelectronics
3 Selected Definitions
burr — A fragment of excess material either horizontal
or vertical attached to the leadframe.
camber — Curvature of the leadframe strip edge (see
Figure 1).
coil set — Longitudinal bowing of the leadframe strip
length (see Figure 2).
coined area — Reference lead flat surface.
crossbow — Transverse bowing of the leadframe (see
Figure 3.)
functional area — The die attach pad and the lead tips.
lead flat surface — Area on the lead tips that is suitable
and available for wire bonding. This is generally
achieved by coining on stamped leadframes and is also
known as the coined area on such leadframes.
1 Military Standards, Naval Publications and Form Center, 508 Tabor
Ave., Philadelphia, PA 19120
Figure 1
Camber
Figure 2
Coil Set
Figure 3
Crossbow
Figure 4
Lead Twist
SEMI G9-89 © SEMI 1980, 1996 2
(insert on received)
Figure 5
Stamped Leadframe Terminology
lead twist — Angular rotation on bonding fingers (see
Figure 4).
pits — Shallow surface depressions or craters in the
leadframe material.
slug marks — Random dents in the leadframe caused
by foreign material in the stamping die.
stamped leadframe terminology — See Figure 5.
Z plane — Lead and pad planarity require a reference in
the Z dimensions. The recommendation for the
reference plane, hereafter called the “Z” plane, is the
average of the two dambars when measured at their
geometric center. This reference method is incorporated
into SEMI G10.
4 Ordering Information
Purchase orders for leadframes for plastic molded dual-
in-line semiconductor packages furnished to this
specification shall include the following items:
1. Part Specification
2. Material
3. Number of Leads
4. Material Certification
5. Packaging and Marking (see Section 8)
5 Dimensions
See applicable part specification as referred to in
Ordering Information, Section 4.
6 Defect Limits and Parame ters(See SEMI G10
to Measure)
6.1 Bond Targets
6.1.1 Minimum area for bonding to allow placement
of true position target of diameter taken (See Table
below); 100% within the lead flat area and
recommended to be 0.025" (0.63 mm) length from the
tip, where plane geometry allows. (See SEMI G10,
Section 14.)
Design Lead
Width
Design Lead
Space
Minimum
Lead Space
Minimum True
Position Target
≥ 0.011 ≥ 0.011 0.006 0.007 Diameter
0.010 0.010 0.005 0.006 Diameter
NOTE: Tolerances for lead designs smaller than 0.010 should
be negotiated between vendor and user.
6.1.2 Minimum metal to metal clear ance to be as
follows:
Material gage 0.010" (0.25 mm) – 0.006" (0.15 mm)
Material gage 0.008" (0.20 mm) – 0.004" (0.10 mm)
(See SEMI G10, Section 14)
6.1.3 Depth of coining on stamped leadframes to be no
greater than 30% of material gage. (See SEMI G10,
Section 15.)
6.1.4 Lead twist is not to exceed 3° 30' (0.0006" per
0.010" (0.016 mm per 0.25 mm)). (see SEMI G10,
Section 3).
6.1.5 Lead tip will exhibit maximum 0.006" (0.15
mm) radius measured in the x-y plane at the lead flat
surface (see Figure 6).
Figure 6
Lead Flat Radius
6.2 Die Attach Pad Surface
6.2.1 Die attach pad x-y axis locatio n to be as follows:
rail-pad tie bar length 0.50" (12.5 mm) ± 0.002" (0.05 mm)
rail-pad tie bar length 0.50" (12.5 mm) ± 0.003" (0.08 mm)
from nominal drawing location. (See SEMI G10,
Section 14.)
6.2.2 Die attach pad tilt to be as foll ows:
depressed pad — maximum 0.002" (0.05 mm) per
0.100" (2.5 mm)
undepressed pad — maximum 0.001" (0.025 mm) per
0.100" (2.5 mm) (see SEMI G10, Section 5)
6.2.3 Die attach pad flatness to be within 0.0002"
(0.005 mm) T.I.R. per 0.100" (2.5 mm).
6.3 Die Attach Pad Downset
6.3.1 Die attach pad downset to be maximum ± 0.002"
(0.05 mm) of nominal specified downset (see SEMI
G10, Section 9).