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SEMI G22-1296 © SE MI 1980, 1996 5 Environmental Test Fine Leak — MIL -STD-883, Method 1014, Condition B Gross Leak — MIL-STD-883, Met hod 1014, Condition C Post- Seal Bon d Pull Radiog raphy Die Shear — MIL -STD-883, Me…

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SEMI G22-1296 © SEMI 1980, 1996 4
10 Test Methods
10.1 Mechanical, Electrical, and Thermal Test
Methods — Per MIL-STD-883 unless otherwise noted.
10.1.1 Gold plating and bake test of gold plated
package shall be tested by placing parts on a calibrated
heater per MIL-STD-883, Method 1008 (excluding
temperature).
10.1.1.1 Condition A — 450 ± 10°C for two minutes in
air, or
10.1.1.2 Condition B — 470 ± 10°C for one minute in
nitrogen.
10.1.1.3 After cooling at room temperature the
packages will be examined for the following criteria:
1. Blisters — None allowed at 10× magnification.
2. Any non-uniform color change of the gold at die
attach pad. Discolorations within edges up to 0.015"
(.381 mm) from the cavity wall is acceptable.
3. Any non-uniform color change of the bonding
fingers, seal ring surface, or external pins is not
acceptable.
4. There shall be no flaking or peeling of the package
plating when viewed at 10x magnification.
5. Superficial stains left during drying or prior
operations is not cause for rejection.
6. Plating adhesion tape test.
10.1.2 Lead Pull — Under the test condition of five (5)
pounds ± one-quarter (1/4) pound pull at an angle of
20° or less from the pins vertical line, measured
perpendicular to the package, there shall be no visible
separation of the braze joint under 10x magnification.
This excludes plating.
10.1.3 Lead Fatigue — Test per MIL-STD-883,
Method 2004, Test Condition B2, Section 3.1.
10.2 Functional Test Methods
10.2.1 Die Attach Quality — Destructive die shear test
post environmental testing per MIL-STD-883, Method
2019, Paragraph 3.2C.
10.2.2 Wire Bond Quality — Minimum pre-seal and
post-seal bond strength test per MIL-STD-883, Method
2011, Test Condition D. Reject for bonds which cause
plating to lift from the base metal of the bonding fingers
or fail to meet minimum strength requirement.
10.2.3 Solderability — Test per MIL-STD-883,
Method 2003 (omit aging).
10.2.4 Insulation Resistance — Test per MIL-STD-
883, Method 1003, Condition D.
10.2.5 Hermetic and Environmental Testing per MIL-
STD-883.
10.2.5.1 The hermetic integrity of the package must be
maintained after all environmental testing. Hermetic
checks shall comply with MIL-STD-883, Method 1014,
Test Conditions A, B, C, or D.
10.2.5.2 Environmental testing shall include but not be
limited to the following:
1. Temperature Cycle — MIL-STD-883, Method
1010, Condition C without heat sink; Condition B
with heat sink.
2. Thermal Shock — MIL-STD-883, Method 1011,
Condition C without heat sink; Condition B with
heat sink.
3. Centrifuge — MIL-STD-883, Method 2001,
Condition E. Y1 axis only — cavity up; Y2 axis
only — cavity down (optional).
4. Mechanical Shock — MIL-STD-883, Method 2002,
Condition B.
5. Vibration — MIL-STD-883, Method 2007,
Condition A.
NOTE 1: Package applications requiring a heat sink attach
will require the environmental test requirements (temp. cycle,
shock, etc.) to be evaluated on an individual basis. The
material, form factor, and method of attach used for heat sinks
may result in severe stresses being induced on the package
assembly during environmental testing. Actual accelerated
test requirements should be based on the expected product
application environment and may be less rigorous than those
tests for packages without heat sinks.
11 Sequence of Events and I ncoming Testing
During incoming inspection the sequence of testing
shall be:
A. Visual
B. Dimensional
C. Functional (typical functional tests which may be
applied):
Die Attach
Wire Bond
Pre-seal wire pull
Seal
Heat sink attach (if applicable)
SEMI G22-1296 © SEMI 1980, 19965
Environmental Test
Fine Leak — MIL-STD-883, Method 1014,
Condition B
Gross Leak — MIL-STD-883, Method 1014,
Condition C
Post-Seal Bond Pull
Radiography
Die Shear — MIL-STD-883, Method 2019
Solderability — MIL-STD-883, Method 2003
NOTE 2: An initial vendor qualification may be performed on
the thermal and electrical characteristics of the package. The
characteristics tested will be:
Insulation Resistance — MIL-STD-883, Method 1003,
Test Condition D.
Thermal Dissipation — MIL-STD-883, Method 1012.
12 Packaging and Marking
12.1 Packaging — Containers selected shall be strong
enough and suitably designed to provide maximum
protection against crushing, spillage, and other forms of
damage to the container or its contents to contamination
from exposure to excessive moisture or oxidation by
gases. Packaging materials shall be so selected to
prevent any contamination of the ceramic components
parts with fibers or organic particles.
12.2 Marking — The outer containers shall be clearly
marked identifying the customer part number, customer
purchase order number, drawing number (optional),
quantity, date, and vendor lot number (optional).
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G23-0996 © SEMI 1980, 19961
SEMI G23-0996
TEST METHOD FOR INDUCTANCE OF INTERNAL TRACES OF
SEMICONDUCTOR PACKAGES
NOTE: This entire document was revised in 1996.
1 Purpose
This test method describes the measurement method for
the inductance of internal traces of semiconductor
packages.
2 Scope
2.1 This test method is applicable for the measurement
of package inductance that is greater than 0.5 nH.
2.2 This document describes the measurement of a pin
grid array, one of the package types, as a sample.
2.3 This test method is also applic able to other types
of packages.
2.4 The inductance in this docume nt is limited to that
of internal traces only and does not contain the portions
contributed by the exposed areas such as pins and
wires.
2.5 This document uses SI units.
3 Limitation
It is not practical to apply this test method for fine-pitch
packages where traces or pads (point A of Figure 1)
cannot be connected to with two probes.
4 Referenced Documents
None.
5 Terminology
5.1 internal inductance (of packages) — Inductance of
the circuit that comprises the signal path starts from the
shoulder or in the center of the outside lead (point A of
Figure 1) and ends at the end of the lead on the cavity
side of the lead (point B of Figure 1). The return path is
made by tying all other traces (except for the target
trace in the same electric potential) together. The target
trace is tied to the return path at the bonding finger (see
Figure 2).
Figure 1
Internal Inductance Measurement
Figure 2
Concept of Internal Inductance
5.2 four-point probe — The probe consists of four
coaxial measuring terminals, H
c
(current high), H
p
(potential high), L
c
(current low) and L
p
(potential low),
to measure impedance. Independent coaxial cables are
used between the package being measured and the
measurement instrument to minimize the effect caused
by mutual inductance (between terminals) and/or
interferences from the measured signals (see Figures 3
and 6).
6 Summary of Method
Fabricate the package to be measured. Then measure
the inductance of internal traces using the four terminal
probe method.
7 Interference
7.1 It is desirable that an operator who is familiar with
the measuring system, measuring method, and