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SEMI G48-89 © SEMI 1989, 1996 1 SEMI G48-89 SPECIFICATION FOR MEASUREM ENT METHOD FOR MOLDED PLASTIC PACKAGE TOOLING 1 Preface This document is prepared to enabl e standard measurement techni ques to be used. It i s inte…
SEMI G47-88 © SEMI 1988 10
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SEMI G48-89 © SEMI 1989, 1996 1
SEMI G48-89
SPECIFICATION FOR MEASUREMENT METHOD FOR MOLDED
PLASTIC PACKAGE TOOLING
1 Preface
This document is prepared to enable standard
measurement techniques to be used. It is intended that
the measurement techniques described in the
specification will apply to all molded plastic package
tooling, i.e. DIPS, SIPS, PCC, SO, Quad, and TAB.
2 Applicable Documents
2.1 SEMI Specifications
SEMI G14 — Plastic Molded DIP Tooling
SEMI G16 — Plastic Chip Carrier Tooling
SEMI G36 — Plastic Molded High Density TAB Quad
Tooling
SEMI G37 — Plastic Molded SO Package Tooling
3 Basic Equipment
3.1 The following basic equipment is required to
perform the specified measurements:
3.1.1 Toolmaker’s Microscope — 3× objective and
10× eyepiece total 30× with X and Y axes digital
readouts reading to 0.0001" . Minimum travel of stage
must be 2.0" × 2.0" . Eyepiece must be ± 0.0002"
minimum. The toolmaker’s microscope should have a
goniometer on the eyepiece as will as on the stage.
Accuracy of the goniometer shall be 0.1. The TM
microscope should have a Z axis with a digital
measurement capability, reading in increments of
0.0001" . The objective lens must be 20× minimum
which will give 0.0005" accuracy to the Z axis
measurements.
3.1.2 Optical Comparator — Surface illumination. 10"
minimum screen with 3" × 8" minimum travel.
Magnification of 10×, 20× minimum required.
Accuracy of 10× is 0.001" ; accuracy of 20× is 0.0005" .
Some operators may be able to improve on this
accuracy, but this is the best expected from average
inspectors.
3.1.2.1 Overlays at 20× may be used for rapid mea-
surement. The user is cautioned that the thickness of the
line must be controlled. Line widths must not exceed
0.010" in width, which will give an inaccuracy of
0.0005" in the measurement. Overlays must have the
datum marks clearly labeled. Overlays are tools which
speed inspection; however, rejects must be verified by
toolmaker’s microscope measurements, which are more
accurate.
3.1.3 Digital Depth Indicator — Mounted on a stand.
Digital reading with a range of 2" is available. Readout
must display increments of 0.0001" with ± 1 digit
accuracy.
3.1.4 Micrometer — 0 to 1.0" . 0.250" diameter for
measuring to 0.001" accuracy.
3.1.5 Eight (8) inch dial calipers for measuring to
0.002" accuracy.
3.1.6 Granite Surface Plate — Minimum size 18" ×
28" , with a surface accuracy of 0.0002" or better.
3.1.7 Surface Finish
3.1.7.1 Charmille Visual Surface Finish Standard —
(For comparison of Electric Discharge Machined
(EDM) surface only.)
3.1.7.2 Surface Comparator Standards — (For other
machined surfaces.)
3.1.7.3 Surface Analyzer
3.1.8 Binocular, Zoom Microscope — 10—15× mag-
nification with vertical or near vertical lighting.
3.1.9 Dial Indicators — With accuracy of .0001 and
with force not to exceed 5 grams.
3.2 Alternative Equipment — Sophisticated, automatic
equipment is not excluded from use, but the user must
ensure that such equipment meets or exceeds the
accuracy of the basic equipment so that correlation
problems may be avoided.
3.3 Calibration — All equipment to be calibrated on a
regular schedule.
4 Measurements
4.1 The following measurements will be made:
4.1.1 Package Thickness (Section 5.1)
4.1.2 Package Length (Section 5.2)
4.1.3 Package Width (Section 5.3)
4.1.4 Leadframe to Cavity Offset (Section 5.4)
4.1.5 Top Cavity Length (Section 5.5)
4.1.6 Top Cavity Width (Section 5.6)
4.1.7 Bottom Cavity Length (Section 5.7)
SEMI G48-89 © SEMI 1989, 1996 2
4.1.8 Bottom Cavity Width (Section 5.8)
4.1.9 Cavity Overlap/Underlap (Section 5.9)
4.1.10 Cavity to Cavity Mismatch (Section 5.10)
4.1.11 Cavity Depth (Section 5.11)
4.1.12 Molding Protrusions (Section 5.12)
4.1.13 Pin Depths (Section 5.13)
4.1.14 Dambar Trimming Defects (Section 5.14)
4.1.15 Package Warpage (Section 5.15)
4.1.16 Lead Coplanarity (Section 5.16)
4.1.17 Shoulder Bend Location (Section 5.17)
4.1.18 Surface Finish (Section 5.18)
4.1.19 Radii (Section 5.19)
4.1.20 Lead Position (Section 5.20)
4.1.21 Draft Angles (Section 5.21)
4.1.22 Lead Spread (Section 5.22)
4.1.23 Foot Angle (Section 5.23)
4.1.24 Foot Length (Section 5.24)
4.1.25 Plastic Stand-off (Section 5.25)
4.2 Conditions
4.2.1 All measurements to be made on molded
components, which have been processed to agreed
conditions including post mold cure.
4.2.2 All measurements to be performed at a
temperature between 20° and 26.7° C (68° , 80° F).
4.2.3 Axis Definition
4.2.3.1 The X axis lies parallel to the rail of the frame
and the Y axis lies perpendicular to the rails of the
frame.
4.2.3.2 The package X and Y axes must be positioned
parallel to the X and Y axes of the measurement stage
travel to avoid measurement errors.
4.2.3.3 The datum of the X and Y axes is the pilot hole
of the leadframe, because it is the most accurate feature.
An additional pilot hole is required to establish the theta
datum.
4.2.3.4 The Z axis is perpendicular to the X and Y axis.
The datum is the leadframe or the top mold parting line,
unless otherwise specified.
5 Measurement
5.1 Package Thickness — (Figure 1)
5.1.1 Equipment — Micrometer
5.1.2 Using the micrometer, measure the thickness of
the package at three (3) places, diagonally across the
package, where the contours allow, at the top edge,
middle and bottom edge of the package. (Note: the top
is the pin 1 identifier edge.)
5.2 Package Length — (Figure 1)
5.2.1 Equipment — Optical Comparator at 10×.
5.2.2 Position the package so that the cross-sectional
view is presented for measurement. Use care to assure
the package is square to the datum plane.
5.2.3 Align the package side draft angle (see Section
5.21) where the draft angle intersects the leadframe.
This is the parting line (datum point). Measure the
overall width at the parting line, including cavity
mismatch.
5.3 Package Width — (Figure 1)
5.3.1 Equipment — Optical Comparator at 10×.
5.3.2 Position the package so that the cross-sectional
view is presented for measurement. Use care to assure
the package is square to the datum plane.
5.3.3 Align the package side draft angle (see Section
5.21) where the draft angle intersects the leadframe.
This is the parting line (datum point). Measure the
overall width at the parting line including cavity
mismatch.
5.4 Leadframe to Cavity Offset — (Figure 2)
5.4.1 Equipment — Toolmaker’s Microscope at 30×.
5.4.2 Position the circle (cross hair) of the filar
eyepiece of similar diameter to the leadframe pilot hole.
Zero the digital readout. Move the stage to the point
where the molded package meets the leadframe at the
parting line. Record digital readout reading as (T1).
Continue to move the stage until the point on the
opposite side where mold compound and leadframe
meet. Record digital readout reading as T2. Continue to
move stage to center of leadframe rail (usually also a
hole). Record the digital readout reading as T3.
5.4.3 Turn part over and BE SURE TO USE THE
SAME HOLE AND PART; repeat the three (3)
readings, B1, B2, and B3.
5.4.4 Derive the data from the readings as follows:
Top Centerline of Frame = (T3)/2
Bottom Centerline of Frame = (B3)/2
Measurement Error = (T3)/2 - (B3)/2
Frame Cavity Offset = (B3)/2 - (B2 + B1)/2