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SEMI G54-93 © SEMI 1993 2 3.9 Over lap — the differen ce i n le n g t h or width between the top and bott o m cav ities. Overlap m a y be a feature des igned into the m old to avoid m i smatch (see Figure 5). A ll statem…

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SEMI G54-93 © SEMI 19931
SEMI G54-93
SPECIFICATION FOR DIMENSIONS AND TOLERANCES USED TO
MANUFACTURE MOLDED PLASTIC PACKAGES
1 Preface
This document is a guideline for ordering the tooling
required to manufacture plastic semiconductor
packages. These packages include the following
JEDEC registered outlines:
Plastic Dual-in-Line Packages (PDIP)
Plastic Leaded Chip Carrier (PLCC)
Plastic Quad Flat Packages (PQFP)
Small Outline I.C. Packages (SOIC — Gull Wing
and “J” lead)
Plastic TAB Quad Packages (PTAB)
NOTE 1: Package outlines registered with other organizations
such as EIAJ and non-registered outlines may use the criteria
in this document by choosing the outline which most closely
resembles the particular package.
Packaging engineers, mold manufactures, and end-of-
line tool makers may use this document to define the
limits of tooling tolerances.
2 Applicable Documents
2.1 Order of Precedence — To avoid conflicts, the
order of precedence when ordering tooling shall be as
follows:
Purchase Order
Referenced Documents
This Specification
2.2 Reference Documents
2.2.1 SEMI Specifications
SEMI G48 — Specification, Measurement Method for
Molded Plastic Package Tooling
2.2.2 JEDEC Specifications
1
Pub. No. 95 — Registered and Standards Outline for
Semiconductor Devices
2.3 Related Documents for Information
2.3.1 Military Specifications
2
MIL-STD-100 — Engineering Drawing Practice
2.3.2 ANSI Specifications
3
1 JEDEC, 2001 Eye Street N.W., Washington, D.C. 20006
2 Military Standards, Naval Publications and Form Center, 5801
Tabor Avenue, Philadelphia, PA 19120
Y14.5 — Dimensioning and Tolerancing
3 Selected Definitions
3.1 Cavity — the plastic body formed by either the top
or bottom mold cavities.
3.2 Gate Feature — plastic protrusions or intrusions
which result from normal molding and degating
operations.
3.3 Lead Bend Angle — the angle to which the leads
are bent in reference to a plane normal to the X-Y plane
of the package. After a suitable radius has been formed
at the shoulder, there must be no compound angle
formation to achieve the lead spread requirements. Lead
Bend Angle may just be a reference if Lead Spread is
specified (see Figures 1A, B, C).
3.4 Lead Coplanarity — the vertical position of a lead
foot with respect to a reference plane created by the
three leads with feet most extended from the bottom
surface of the package body. The term “foot” applies to
both PLCC foot radii and PQFP feet (see Figure 2).
3.5 Lead Shoulder (Dambar Area) Protrusions or
Intrusions — a protrusion (tab) on the shoulder or lead,
or intrusion cut into the shoulder or lead as a result of
dambar trimming (see Figures 3 and 4).
3.6 Lead Sweep — lead movement measured with
respect to a datum, perpendicular to the top or bottom
surface of the package and which passes through the
midpoint of the lead, when viewed from the sides of the
package (see Figure 4).
3.7 Mismatch — misalignment between the top and
bottom cavities. The measurement of mismatch is stated
as the difference between the center lines of the top and
bottom cavities (see Figure 5). All statements regarding
mismatch of cavities are applicable to both the X and Y
axis. All measurements are made prior to lead trim and
form.
3.8 Offset — the difference in the bottom cavity
position from a leadframe datum when compared to
design (see Figure 6). This measurement ignores
leadframe tolerances. All statements regarding offset
are applicable to both the X and Y axis. All
measurements are made prior to lead trim and form.
3 American National Standards Institute, 1430 Broadway, New York,
NY 10018
SEMI G54-93 © SEMI 1993 2
3.9 Overlap — the difference in length or width
between the top and bottom cavities. Overlap may be a
feature designed into the mold to avoid mismatch (see
Figure 5). All statements regarding overlap of cavities
are applicable to both the X and Y axis. All
measurements are made prior to lead trim and form.
3.10 Package Warpage — loss of planarity of a
molded surface excluding protrusions and intrusions
(see Figure 7). Each package type has a maximum
allowable warpage and a warp factor is used to
determine the maximum warpage for a particular
package dimension. The Warp Factor (WF) is defined
as follows:
WF =
Total Warp in inches (mm
)
×1000
Package dimension in inches (mm)
Package warpage is usually caused by incorrect
package design and/or poor molding conditions.
3.11 Parting Line Protrusions, or Intrusions — plastic
excesses (flash) or losses (chips or voids) at the parting
line after normal processing to mold, deflash, trim, and
singulate the packages.
3.12
Surface Protrusions or Intrusions — plastic
excesses (bumps or blisters) or recesses (pits or voids)
on any surface of the package.
4 Ordering Information
Purchase orders for molded plastic tooling furnished to
this document, shall include the following items:
4.1 A package tooling outline drawing showing all the
required dimensions listed in Section 5. The molded
surface finish(es) and the lead finish shall be specified.
4.2
The plastic compound to be used shall be
specified. If the compound is proprietary, then the
molding and molded characteristics shall be supplied.
4.3 The leadframe drawing detailing the material, all
dimensions, and, if applicable, lead finish pre-plate
specifications.
4.4
The type and part number of the molding and trim,
form, singulate press to be used.
4.5 Singulation or off-load requirements.
4.6 Expectations of Tooling Performance — Tooling
performance is not limited to the items listed in Section
5 and 6. Any other customer requirements, such as the
limits on wire sweep, resin bleed or internal voiding,
shall also be included with the purchase order.
4.7
Reference to this specification.
4.8 Vendor certification requirements.
5 Dimensions
5.1 All package dimensions should be specified in
detail.
5.2 Ejector pin mark location from the package
centerline. This should include ejector pin sizes, depths,
and draft angles.
5.3
Pin 1 ID shape and location from the package
center with respect to the lead frame Pin 1 location.
5.4
All critical radii (unspecified radii, often shown
sharp on the drawing, may have the maximum radius
shown in the table of Section 6).
5.5
Plastic stand-off shape and locations from the
package center.
5.6
Lead spread (the distance between the outer edge
of opposing leads).
5.7 Shoulder bend location and lead bend angle
(optional).
5.8
Foot angle radius (maximum a nd minimum).
5.9 Foot length.
5.10 Lead length.
5.11 Shoulder width (maximum width should include
protrusion).
6 Dimensional Tolerance Li mits
These criteria, where applicable, apply only to opaque,
plastic molded semiconductor packages. If an item is
not mentioned in the following table, then the
tolerances on the dimensions of that item follow the
general tolerance limits stated on the drawing.
Dimensions are in inches (millimeters) except as noted.
Dimensions are to be verified per SEMI G48.
SEMI G54-93 © SEMI 19933
Table 1 Tolerance Limits
Dimension (Tolerance) PDIP PLCC SOIC PQFP PTAB UNITS
Package Length/Width ± 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) in. (mm)
Cavity Mismatch ± 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) in. (mm)
Cavity Overlap (Max.) 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) in. (mm)
Package/Leadframe Offset ± 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) 0.001 (0.025) in. (mm)
Plastic Body Thickness —
Top and Bottom ±
0.002 (0.05) 0.002 (0.05) 0.002 (0.05) 0.002 (0.05) 0.001 (0.025) in. (mm)
Surface Protrusions (Max.) 0.001 (0.025) 0.001 (0.025) 0.001 (0.025) 0.001 (0.025) 0.001 (0.025) in. (mm)
Surface Intrusions —
Depth (Max.)
0.001 (0.025) 0.001 (0.025) 0.001 (0.025) 0.001 (0.025) 0.001 (0.025) in. (mm)
-X-Y Dimension (Max.) 0.010 (0.25) 0.010 (0.25) 0.010 (0.25) 0.010 (0.25) 0.005 (0.127) in. (mm)
Ejector Pins — Intrusion only
(Max.)
0.010 (0.25) 0.010 (0.25) 0.010 (0.25) 0.008 (0.20) 0.005 (0.127) in. (mm)
Gate Feature — Intrusion only
(Max.)
0.020 (0.50) 0.020 (0.50) 0.010 (0.25) 0.020 (0.50) 0.002 (0.05) in. (mm)
Gate Feature — Protrusion only
(Max.)
0.004 (0.10) 0.004 (0.10) 0.004 (0.10) 0.004 (0.10) 0.004 (0.10) in. (mm)
Parting Line Protrusion — after
deflash dambar removal
(Max. per side)
0.006 (0.15) 0.006 (0.15) 0.006 (0.15) 0.006 (0.15) 0.005 (0.127) in. (mm)
Parting Line Intrusion —
Plastic (Max.)
0.010 (0.25) 0.010 (0.25) 0.005 (0.127) 0.010 (0.25) 0.005 (0.127) in. (mm)
Parting Line Protrusion —
after package singulation
0.006 (0.15) 0.006 (0.15) 0.006 (0.15) 0.006 (0.15) 0.005 (0.127) in. (mm)
Warp Factor (Max.) —
up to a Limit of
2.5% 0.003
(0.08)
2.5% 0.003
(0.08)
2.5% 0.003
(0.08)
2.5% 0.003
(0.08)
2.5% 0.003
(0.08)
in. (mm)
Draft Angles (Deg. ±) 1 1 1 1 1
Package Radii — Noted Radii ± 0.0025 (0.06) 0.0025 (0.06) 0.0025 (0.06) 0.0025 (0.06) * (*) in. (mm)
Shown Sharp (Max.) 0.020 (0.50) 0.020 (0.50) 0.010 (0.25) 0.020 (0.50) * (*) in. (mm)
Lead Spread ± 0.025 (0.64) 0.010 (0.25) 0.010 (0.25) 0.005 (0.127) * (*) in. (mm)
Lead Bend Angles (Deg. ±) - 5 2 2 2
Shoulder Bend Location ± 0.010 (0.25) 0.010 (0.25) 0.005 (0.127) 0.005 (0.127) * (*) in. (mm)
Lead Sweep (from True position
— Max.) (See Note 2)
0.007 (0.18) 0.004 (0.10) 0.004 (0.10) 0.003 (0.075) 0.003 (0.075) in. (mm)
Foot Length ± - - 0.005 (0.127) 0.005 (.127) * (*) in. (mm)
Foot Radius ± - 0.010 (0.25) - - - in. (mm)
Lead Length ± 0.005 (0.127) - - - - in. (mm)
Foot Width ±
incl. Leadframe Tolerance
- - 0.002 (0.05) 0.002 (0.05) * (*) in. (mm)
Lead Coplanarity (Max.) - 0.003 (0.08) 0.003 (0.08) 0.003 (0.08) 0.002** (0.05) in. (mm)
Dambar Trim Protrusions (Max.) 0.003 (0.08) 0.003 (0.08) 0.003 (0.08) 0.003 (0.08) 0.003 (0.08) in. (mm)
Dambar Trim Intrusions (Max.) 0.002 (0.05) 0.002 (0.05) 0.001 (0.025) 0.001 (0.025) 0.001 (0.025) in. (mm)
* To be determined.
** If applicable.
NOTE 2: SOIC, J leaded packages have the plastic bodies and leads evaluated to the SOIC and PLCC tolerances as appropriate.
NOTE 3: Lead Sweep is not acceptable at buy-off.
7 Sampling Plan
A sampling plan and buy-off procedure to determine compliance to the requirements of Sections 5 and 6 and other
relevant specifications shall be determined between vendor and customer.