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9 SEMI G69-0996 © SEMI 1996, 2004 Adhesive St rength (maxi mum, minimum, average, and where possible, standar d deviation ,
SEMI G69-0996 © SEMI 1996, 2004 8
12.2.2 True Adhesive Strength — The true adhesive strength (CKic) excluding residual stress, is calculated as
follows:
K
ic
MPa m
K
ib1
K
ib2
2
where :
K
ib1
: Apparent adhesive strength when testing is performed with molded side up (MPa m
)
K
ib2
: Apparent adhesive strength when testing is performed with leadframe side up (MPa m
)
13 Report
13.1 The following items should be reported:
13.1.1 Leadframe
13.1.1.1 Material Designation
13.1.1.2 Thickness
13.1.1.3 Production Method (etching or stamping)
13.2 Pre-Treatment — In case that surface pre-treatment is necessary, the process and their condition should be
reported as follows:
13.2.1 Pre-treatment by plating
13.2.1.1 Plating type
13.2.1.2 Plating thickness
13.2.2 Post treatment after plating
13.2.2.1 Corrosion prevention treatment
13.2.2.2 Cleaning treatment
13.2.2.3 Coupling material
13.2.3 Pre-treatment by heating
13.2.3.1 Temperature
13.2.3.2 Atmosphere
13.2.3.3 Oven or Hot Plate
13.3 Molding Compound
13.3.1 Material Designation
13.4 Molding Compound Configuration and Dimension
13.5 Molding Condition
13.5.1 Pre-heat condition (Temperature, Time)
13.5.2 Molding condition (Cure temperature, Cure time, Injection speed, Injection pressure)
13.5.3 Post-cure condition (Temperature, Time)
13.5.4 Sample storage conditions
13.6 Measurement Method (Shear, Pull, or Three-point bending method)
13.7 Measurement Equipment
9 SEMI G69-0996 © SEMI 1996, 2004
Adhesive Strength (maximum, minimum, average, and where possible, standard deviation,
SEMI G69-0996 © SEMI 1996, 2004 10
APPENDIX 1
SAMPLE OF MOLD FOR SHEAR METHOD
NOTICE: The material in this appendix is an official part of SEMI G69 and was approved by full letter ballot
procedures.
A1-1
A1-1.1 A mold to prepare samples for shear method is shown in Figure A1-1 as a sample.
Figure A1-1
Mold Sample