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SEMI G72.2-099 7 © SEMI 1997 1 SEMI G72.2-0997 DESIGN PROPOSA L FOR B A LL GRID A RR A Y DESIGN LIBRARY: 388 PIN PLA STIC B ALL GRID A RR A Y Table 1 Plastic B all Grid A rra y (PBG A) G eneral Design Characteristics Bal…

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SEMI G72.1-0997 © SEMI 1997 10
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SEMI G72.2-0997 © SEMI 19971
SEMI G72.2-0997
DESIGN PROPOSAL FOR BALL GRID ARRAY DESIGN LIBRARY:
388 PIN PLASTIC BALL GRID ARRAY
Table 1 Plastic Ball Grid Array (PBGA) General Design Characteristics
Ball Count Signal I/O Body Size Pitch Matrix Array
Thermal
Enhan.
Profile
Height
Cavity
Orient.
Wirebond
Rings
388 304
35×35
1.27
26×26
depopulated
6×6
2.33 up 2
Substrate
Material
Metal
Layers
Die Inter-
connect
Encapsulation
Design / Material
Ball
Composition
JEDEC
Designation
Precondition-
ing Level
Design
No.
SEMI
Designa-
tion No.
BT Laminate 2(2S0P0G) wirebond overmolded epoxy 63/37 Sn/Pb MO-151
BAR-2, B
Level 3,Rev 0 PBD0002 G72.2
SEMI G72.2-0997 © SEMI 1997 2
Figure 1
388 Pin Plastic Ball Grid Array 35×35 mm Body Design