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SEMI G72.2-099 7 © SEMI 1997 10 Design No.PBD0002 SEMI St andard BGA Design Library Revision Initial Date 10/22/ 96 Page 2 of 1 0 PBGA Wire Bond P ad (*1) Solder Ball Location Die W ire Bond Pad (*3) I/O Name (& Comm…

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SEMI G72.2-0997 © SEMI 19979
Design
No.PBD0002 SEMI Standard BGA Design Library Revision Initial
Date
10/22/96
Page
2 of 10
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad (*3) I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
64 Y4 1
164 Y23 3
169 Y24 3
167 Y25 3
168 Y26 3
65 AA1 1
63 AA2 1
69 AA3 1
w/b ring 2 AA4 2
w/b ring 2 AA23 2
165 AA24 3
163 AA25 3
166 AA26 3
68 AB1 1
67 AB2 1
73 AB3 1
71 AB4 1
160 AB23 3
161 AB24 3
159 AB25 3
162 AB26 3
72 AC1 1
70 AC2 1
75 AC3 1
w/b ring 1 AC4 3
84 AC5 2
w/b ring 2 AC6 2
88 AC7 2
w/b ring 1 AC8 3
95 AC9 2
103 AC10 2
w/b ring 2 AC11 2
111 AC12 2
w/b ring 1 AC13 3
115 AC14 2
124 AC15 2
w/b ring 2 AC16 2
128 AC17 2
1st Group AC18 3
w/b ring 1 AC19 2
140 AC20 2
w/b ring 2 AC21 2
147 AC22 2
w/b ring 1 AC23 3
SEMI G72.2-0997 © SEMI 1997 10
Design
No.PBD0002 SEMI Standard BGA Design Library Revision Initial
Date
10/22/96
Page
2 of 10
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad (*3) I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
157 AC24 3
156 AC25 3
158 AC26 3
76 AD1 1
74 AD2 1
w/b ring 1 AD3 3
81 AD4 2
85 AD5 2
89 AD6 2
93 AD7 2
97 AD8 2
101 AD9 2
105 AD10 2
109 AD11 2
113 AD12 2
117 AD13 2
119 AD14 2
122 AD15 2
126 AD16 2
130 AD17 2
134 AD18 2
138 AD19 2
142 AD20 2
145 AD21 2
149 AD22 2
151 AD23 2
w/b ring 1 AD24 3
154 AD25 3
155 AD26 3
w/b ring 1 AE1 3
w/b ring 1 AE2 3
78 AE3 2
80 AE4 2
83 AE5 2
87 AE6 2
91 AE7 2
94 AE8 2
98 AE9 2
100 AE10 2
104 AE11 2
107 AE12 2
110 AE13 2
114 AE14 2
118 AE15 2
SEMI G72.2-0997 © SEMI 199711
Design
No.PBD0002 SEMI Standard BGA Design Library Revision Initial
Date
10/22/96
Page
2 of 10
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad (*3) I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
121 AE16 2
125 AE17 2
129 AE18 2
132 AE19 2
135 AE20 2
139 AE21 2
143 AE22 2
146 AE23 2
150 AE24 2
w/b ring 1 AE25 3
153 AE26 3
w/b ring 1 AF1 3
77 AF2 2
79 AF3 2
82 AF4 2
86 AF5 2
90 AF6 2
92 AF7 2
96 AF8 2
99 AF9 2
102 AF10 2
106 AF11 2
108 AF12 2
112 AF13 2
116 AF14 2
120 AF15 2
123 AF16 2
127 AF17 2
131 AF18 2
133 AF19 2
137 AF20 2
141 AF21 2
144 AF22 2
148 AF23 2
152 AF24 2
w/b ring 1 AF25 3
w/b ring 1 AF26 3
NOTES:
*1. Please refer to Notes column for explanations of wirebond (w/b) rings. PBGA Wirebond Pads are numbered counter clockwise, starting with
Pad #1 in the upper left hand corner. Please refer to Top View of package for package side #1, 2, 3, or 4 (Figure 1).
*2. Metallized wirebond (w/b) ring 2 surrounds die attach area for wirebonding to electrically common die pads and electrical connection with
solder balls designated by 2nd Electrical Group symbol on BGA Design Library Drawing (Figure 1).
*3. Metallized wirebond (w/b) ring 1 surrounds die attach area for wirebonding to electrically common die pads and electrical connection with
both die attach pad and solder balls designated by 1st Electrical Group symbol on BGA Design Library Drawing (Figure 1).
*4. If the number of signal Die Wirebond Pads (not including Electrical Groups) total less than 304, the total number may be divided by 4 and
wirebond placement centered on each package side.