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APPENDIX 1 HOOK POSITION VS. PULL STRE NGTH (DEPENDENCE ON PULL SPEED) NOTICE : The material in this appendix is an o fficial part of SEMI G73 and was approved by full letter b allot procedures. A1-1 Figure A1-1 3 SEMI G…

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8 Procedure
8.1 Fix samples using a clamper or adhesive, so that
the sample will not float, without applying excessive
stress to the wire.
8.2 Set pull speed to 0.5 mm/sec while measuring.
8.3 Insert the hook under the bonded wire between the
top of the first bonding and the center of the loop.
NOTE 2: Select hook position accordingly to package,
wiring condition, and wire diameter.
NOTE 3: Place the hook perpendicular to wiring direction if
there is no specific instruction.
NOTE 4: Do not measure damaged or deformed wire.
8.4 Pull the hook perpendicular to die/substrate.
8.5 Record the force that breaks the wire as the pull
strength.
8.6 Repeat the measurement on another wire.
NOTE 5: Do not change the position while testing the same
samples.
Figure 2
Hook Position
9 Report
9.1 Report of the pull test must contain the following
information.
9.2 Pull Strength
9.3 Breaking Mode — Choose the closest position
from Figure 3 below and represent the broken position
by number or alphabet in the figure.
9.3.1 Breaking Mode (Report in number or alphabet)
1,A: The first bond
2,B: The first bond neck
3,C: Loop
4,D: The second bond neck
5,E: The second bond
Figure 3
Breaking Mode
9.4 Hook Position
9.5 Rejection — Criterion of each semiconductor
manufacturer to each product. Refer to “Minimum
Strength” of the attached MIL-STD-883D.
10 Related Documents
10.1 SEAJ Document
2
SEAJ Technical Term Dictionary, 3rd Edition
10.2 JEITA Standard
3
JEITA ED4703 — In-Line Evaluation Methods and
Structural Analysis Methods for Semiconductor
Devices
10.3 IEC Standard
4
IEC 749 — Semiconductor Devices: Mechanical and
Climatic Test Methods
2 Semiconductor Equipment Association of Japan, 4F Grand Maison
Shinjuku Gyoen., 1-7-10 Shinjuku Shinjuku-ku, Tokyo 160-0022
Japan, 03(3353)7651 Fax 03(3353)7970,
http://www.seaj.or.jp/english/index.htm.
3 Electronic Industries Association of Japan, Available through:
Japan Electronics and Information Technology Industries
Association, 3rd Fl., Mitsui Sumitomo Kaijo Bldg. Annex 11, Kanda
Surugadai 3-chome, Chiyoda-ku, Tokyo 101-0062, Japan,
http://www.jeita.or.jp/eiaj/english/
4 International Electrotechnical Commission, 3 rue de Varembe, CH-
1211, Geneva 20, Switzerland, Phone: 41 22 919 02 11, Fax: 41 22
919 03 00, E-mail: IEC Central Office, http://www.iec.ch/
SEMI G73-0997 © SEMI 1997, 2004 2
APPENDIX 1
HOOK POSITION VS. PULL STRENGTH (DEPENDENCE ON PULL
SPEED)
NOTICE: The material in this appendix is an official part of SEMI G73 and was approved by full letter ballot
procedures.
A1-1
Figure A1-1
3 SEMI G73-0997 © SEMI 1997, 2004
APPENDIX 2
HOOK POSITION VS. PULL STRENGTH (DEPENDENCE ON HOOK
DIAMETER)
NOTICE: The material in this appendix is an official part of SEMI G73 and was approved by full letter ballot
procedures.
A2-1
Figure A2-1
NOTICE: SEMI makes no warranties or representations as to the suitability of the standard set forth herein for any
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SEMI G73-0997 © SEMI 1997, 2004 4
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