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SEMI G76-0299 © SEMI 1999 2 Table 3. Adhesive Material Thickn ess Center Thicknes s t/ µ m Tolerance/ µ m 10.0 ≤ t < 14.0 ± 2.0 14.0 ≤ t < 20.0 ± 3.0 For thicknesses other than those above, use nominal value thickn…

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SEMI G76-0299 © SEMI 1999 1
SEMI G76-0299
SPECIFICATION FOR POLYIMIDE-BASED ADHESIVE TAPE USED IN
TAPE CARRIER PACKAGES (TCP)
1. Purpose
1.1 This standard addresses the adhesive demands of
tape carrier packages (TCPs) and how reliability,
versatility and cost may be optimized. The
standardization of polyimide adhesive tape used in TCP
is being promoted in order to meet these demands.
2. Scope
2.1 This standard defines the standard for polyimide-
based adhesive tapes (hereinafter " tape" ).
3. Referenced Documents
NOTE: Standards cited below refer to the latest adopted
revision of the standard. (Draft documents may not be
referenced.)
3.1 JIS Standards
1
C-1303 — High Insulation Resistance Meters
C-2110 — Testing Methods for Electric Strength of
Solid Insulating Materials
C-2318 — Polyester Films for Electrical Purposes
P-8101 — Testing Method for Dissolving Pulp
Z-3282 — Soft Solder
4. Terminology
4.1 camber — Curvature of the tape strip edge.
4.2 machine direction (MD) curl — Curvature along
the length of the tape.
4.3 tranverse direction (TD) curl — Transverse
bowing of the tape.
4.4 twist — Angular rotation of one end of the tape
with reference to the other end.
4.5 wakame — Waviness along the edge of the tape.
5. Ordering Information
5.1 The following items shall be included in purchase
orders for tape which conforms to this standard:
1 Japanese Standards Association, 1-24, Akasaka 4 Chome, Minato-
ku, Tokyo, Japan
5.1.1 Type of adhesive material
5.1.2 Type of base film
5.1.3 Width of adhesive material
5.1.4 Width of base film
5.1.5 Length of product
6. Requirements
6.1 Structure of Polyimide Adhesive Tape Used in
TCP — Adhesive material is applied to polyimide film
defined in Section 6.2. When necessary, a protective
film may be used to stop adhesion of the adhesive
material to the back of the tape to prevent
contamination of the adhesive material, improve
puncture characteristics, etc.
6.2 Base Film Thickness and Width
6.2.1 Base Film Thickness (see Table 1)
Table 1. Base Film Thickness
Thickness (
µ
m) Tolerance (
µ
m)
50.0
± 4.0
75.0
± 5.0
125.0
± 8.0
For thicknesses other than those above, use nominal value
thickness denoted in µm.
6.2.2 Base Film Width (see Table 2)
Table 2. Base Film Width
Width (mm) Tolerance (mm)
34.975
± 0.10
48.175
± 0.10
69.95
± 0.10
For widths other than those above, use nominal value width
denoted in mm.
6.3 Adhesive Material Thickness and Width
6.3.1 Adhesive Material Thickness (see Table 3)
SEMI G76-0299 © SEMI 1999 2
Table 3. Adhesive Material Thickness
Center Thickness t/
µ
m Tolerance/
µ
m
10.0 ≤ t < 14.0 ± 2.0
14.0 ≤ t < 20.0 ± 3.0
For thicknesses other than those above, use nominal value
thickness denoted in µm.
6.3.2 Adhesive Material Width (see Table 4)
Table 4. Adhesive Material Width
Width/mm Tolerance/mm
29.7
± 0.1
42.7
± 0.1
60.6
± 0.1
64.4
± 0.1
For widths other than those above, use nominal value width
denoted in mm.
6.4 Distance from Edge of Base Film to Edge of
Adhesive Material (see Table 5)
Table 5. Distance from Edge of Base Film to Edge
of Adhesive Material
Base Film
Width/mm
Adhesive
Material
Width/mm
Distance/mm
34.975 29.7
≥ 2.40
48.175 42.7
≥ 2.40
69.95 60.6
≥ 4.40
69.95 64.4
≥ 2.40
6.5 Cover Film Type, Thickness and Width
6.5.1 Cover Film Thickness (see Table 6)
Table 6. Cover Film Thickness
Thickness at Center/
µ
m Tolerance/
µ
m
10.0−50.0 ± 2.0
For thicknesses other than those above, use nominal value
thickness denoted in µm.
6.5.2 Cover Film Width — Use the same
measurements as found in Section 6.3.2.
6.6 Adhesive Tape Thickness and Tolerance
6.6.1 Adhesive Tape Thickness — Use the sum of the
nominal thicknesses of the base film, adhesive material
and cover film.
6.6.2 Tolerance — Use the sum of the nominal
tolerances of the base film, adhesive material and cover
film.
SEMI G76-0299 © SEMI 1999 3
6.7 Characteristics (see Table 7)
Table 7. Characteristics of Adhesive Tape
Item Condition Unit Test Method Value
Normal N/cm 8.5.1 (a)
> 5
Heated N/cm 8.5.1 (b)
> 1
Copper Foil Adhesive
Strength
Soaked in solvent N/cm
(see NOTE 3)
8.5.1 (c)
> 3
Cover Film Release
Strength
Normal N/cm 8.5.2
< 0.2
Normal
Ω
8.6.3 (3)(a) Not Specified
In High Temp.
High Humidity
Ω
(see NOTE 4)
8.6.3 (3)(b) Not Specified
Insulation Resistance
In High Temp.
High Humidity,
Under Bias
Ω
(see NOTE 5)
8.6.3 (3)(c) Not Specified
Volume Resistivity Normal
Ω-cm
8.6.1
> 10
13
Surface Resistivity Normal
Ω
8.6.2
> 10
10
Voltage Resistance Normal
Ω
8.6.4 No Flash-over
Relative Permittivity Normal - 8.6.5
< 4.0
Dielectric Dissipation
Factor
Normal - 8.6.5
< 0.07
Solder Heat
Resistance
Normal - 8.7.1 No Delamination
No Swelling
Heat Shrinkage Normal % 8.7.3
< 0.5
Coefficient of
Thermal Expansion
-
cm/cm/°C
8.7.4
< 3.0 × 10
-5
Tensile Strength - Mpa 8.7.5
> 100
Elongation Normal % 8.7.5
> 20
Water Absorption Normal % 8.7.2
< 4.0
Flammability Normal - 8.7.6 Not Specified
NOTE 1: Normal Condition — Normal condition refers to a temperature of 23 ± 5°C, and relative humidity of 55 ± 15%.
NOTE 2: Heated Condition — See Section 8.5.1, (3)(b).
NOTE 3: Soaked in Solvent — See Section 8.5.1, (3)(c).
NOTE 4: High Temperature, High Humidity — See Section 8.6.3, (3)(b).
NOTE 5: High Temperature, High Humidity, Under Bias — See Section 8.6.3, (3)(c).