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SEMI G86-0303 © SEMI 2003 4 NOTICE: SEMI makes no warranties or representations as to the suitability o f the standards set forth herei n for any pa rticular application. The determination of the suitability o f the stan…

SEMI G86-0303 © SEMI 2003 3

Datum plane Support

5 °

Figure 3

Setting Condition of Test Specimen

7 Test Specimens

7.1 The shape and dimensions of the test specimens

shall be agreed between the interested parties.

7.2 Test specimen shall be Silicon Die.

7.3 At least 25 test specimens shall be pulled from a

wafer.

8 Procedure

8.1 Measure the thickness h, width b, and length w.

The accuracy of h and b shall be within ± 5%.

8.2 Adjust the span L in accordance with the following

conditions,

at h < 0.1 mm : L ≤ 2 mm and L ≤ 50 h

at h ≥ 0.1 mm : 2 mm ≤ L and L ≤ 20 h

8.3 Place the test specimen on the two supports within

± 5° of the deviation from datum plane (see Figure 3).

The evaluated surface shall be applied the tensile force.

8.4 Set the test speed less than 5 mm/min in order to

avoid the impact on test specimen and apply the force at

midspan.

8.5 Record the force of the specimen at the break.

9 Calculation

9.1 Flexural Stress — Calculate the flexural stress

parameters defined in Section 4 using the following

equation:

(1)

Where:

is the flexural stress at break in question (Mpa);

is the applied force at break, in newtons (N);

L is the span, in millimeters (mm);

b is the width, in millimeters (mm), of the test

specimen; and

h is the thickness, in millimeters (mm), of the test

specimen.

NOTE 5: Equation (1) can only be used for test specimens

with linear stress/strain behavior.

10 Test Report

10.1 The test report shall include the following

information:

• the directions major axes of the specimens if test

specimen has,

• the evaluated surface,

• the dimensions of the test specimens (thickness h,

width b, length w),

• the nominal span length used,

• the number of specimens tested,

• the speed of testing,

• the individual test results, the flexural stress at

break, and

• the date of the test.

SEMI G86-0303 © SEMI 2003 4

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer's instructions, product labels,

product data sheets, and other relevant literature,

respecting any materials or equipment mentioned

herein. These standards are subject to change without

notice.

By publication of this standard, Semiconductor

Equipment and Materials International (SEMI) takes no

position respecting the validity of any patent rights or

copyrights asserted in connection with any items

mentioned in this standard. Users of this standard are

expressly advised that determination of any such patent

rights or copyrights, and the risk of infringement of

such rights are entirely their own responsibility.

SEMI G86-0303 © SEMI 2003 5

RELATED INFORMATION 1

ADDITIONAL INFORMATION FOR TESTING

NOTICE: This related information is not an official part of SEMI G86 and was derived from the work of the

originating task force. This related information was approved for publication by full letter ballot procedures on

January 10, 2003. It is provided for information purposes.

R1-1 Test Machine

R1-1.1 When the measurement of deflection is based

on the movement of loading edge, the frame

compliance of the test machine should be more than

40 kN/mm.

R1-1.2 The interval of data sampling, such as test force

and movement of the loading edge, should be more than

500 times per second when the test machine records the

data in digital format.

R1-2 Test Specimens

R1-2.1 The number of test specimen is 0.25 of

Acceptance Quality Level, specified in ISO/DIS2859-

1.2，Sampling procedures for inspection by attributes

— Part 1: Sampling schemes indexed by acceptable

quality level (AQL) for lot-by-lot inspection.

R1-2.2 Test specimens should be pulled from a wafer

in every direction without leaning.

R1-2.3 When test results are compared, same test

specimens size (span L and width b) should be used.

R1-2.4 When excessive film is attached to test

specimens, equation (1) in Section 9.1 for stress on a

silicon material may not be applied.

R1-3 Recording the Force

R1-3.1 Not only the force at the break points but also

test force of the specimen under the test should be

recorded. It is recommended that an automatic

recording system is used .

R1-4 Test Report

R1-4.1 Test report should include the failure

characteristics of the failed specimens.

R1-4.2 When possible, the test report should include

failures which occur at any notable defect on the die.