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SEMI S13-0305 © SEMI 1998, 2005 20 NOTE 2: Byproducts vary with conditions such as exhaust duct diam eter/length/volume, temperat ure, exhaust gas velocity, chamber volume/pressure/configuration, main tenance method/cy c…

SEMI S13-0305 © SEMI 1998, 2005 19

RELATED INFORMATION 8

DOCUMENT CRITERIA WHICH MAY BE DISCUSSED IN A FUTURE

REVISION OF SEMI S12

NOTICE: This related information is not an official part of SEMI 13 and was derived from the work of the SEMI

S13 Revision Task Force. This related information was approved for publication by a letter ballot on November 24,

2004.

R8-1 Purpose of this Related Information

R8-1.1 This related information contains criteria for documents that relate to technical criteria that may be

discussed for a future revision of SEMI S12.

R8-1.2 The criteria in this related information are not included in SEMI S12 as of the time this related information

was written, but are newly suggested as necessary criteria for determining whether the documents provided to the

equipment user conform to SEMI S13.

R8-1.3 The criteria in this related information are arranged to correspond with the sections of SEMI S12.

NOTE 1: It was the intent of the Task Force responsible for SEMI S13 that the criteria in this related information be

incorporated in a future revision of SEMI S12 and that this related information be removed from SEMI S13 by revising SEMI

S13 with the same effective date as the effective date of the addition of these criteria to SEMI S12.

R8-2 Decontamination and Decommissioning Information

R8-2.1 Documents provided to the equipment user should provide recommended decontamination procedure based

on the equipment supplier’s baseline process including the following information:

 decontamination methods in accordance with SEMI S12;

 equipment modules or components requiring decontamination and contaminants, including by-products;

 procedures required to decontaminate equipment effectively;

 components and equipment that require special handling and disposal procedures, including contaminated parts;

parts containing lead, mercury, cadmium, chromium, arsenic, beryllium, barium, vanadium, selenium, organic

solvents, PCB’s, PPB’s, CFCs and other regulated wastes; and

 residual hazardous materials that may remain despite decontamination efforts prior to decommissioning.

R8-2.2 Decommissioning Procedure

R8-2.2.1 Documents provided to the equipment user should provide a recommended decommissioning procedure to

facilitate decontamination and material separation.

R8-2.2.2 The decommissioning procedure should include removal of all hazardous energies (such as chemical,

pneumatic, electrical, pressure, and elevated loads).

R8-2.2.3 The decommissioning procedure should be documented to prevent the mixture of incompatible chemicals.

If it is not feasible, administrative control procedures in order to minimize various risks such as fire, explosion, air

or water pollution and toxicity should be included.

R8-2.2.4 If the chemicals/materials are hazardous, the decommissioning procedure should address how to prevent

their release to the environment. The chemicals include:

 Chemicals used to operate or maintain the equipment (e.g., lubricant and coolant),

 Other potentially hazardous items which are parts of the equipment, such as capacitors, batteries, lamps or

mercury, which require special disposal procedures, and

 Chemicals used in the baseline process of the equipment supplier for which the decontamination and

decommissioning procedures have been provided and their anticipated by-products.

SEMI S13-0305 © SEMI 1998, 2005 20

NOTE 2: Byproducts vary with conditions such as exhaust duct diameter/length/volume, temperature, exhaust gas velocity,

chamber volume/pressure/configuration, maintenance method/cycle, and purge frequency.

R8-2.2.5 The decommissioning procedure should address any hazards of ionizing radiation sources, if they are

present, and address safe removal and storage procedures for these sources.

R8-2.2.6 Specific hazards known to be the result of failures during operation (e.g., mercury vapor lamps create

mercury deposits when a lamp bursts) should be described.

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI S14-0704 © SEMI 2000, 2004 1

SEMI S14-0704

SAFETY GUIDELINES FOR FIRE RISK ASSESSMENT AND

MITIGATION FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT

These safety guidelines were technically approved by the Global Environmental Health and Safety

Committee and are the direct responsibility of the North American Environmental Health and Safety

Committee. Current edition approved by the North American Regional Standards Committee on April 22,

2004. Initially available at www.semi.org June 2004; to be published July 2004. Originally published

February 2000; previously published November 2003.

NOTICE: Paragraphs entitled “NOTE” are not an

official part of this document and are not intended to

modify or supersede the official Safety Guideline.

These have been supplied by the Task Force to enhance

usage of the Safety Guideline.

NOTICE: The intent of the task force that produced

this document is that conformance to the “should”

provisions of this guideline comprises conformance

with this guideline.

1 Purpose

1.1 This document provides considerations to the

manufacturers of semiconductor manufacturing

equipment that will assist them in assessing and

mitigating the risk to equipment and product associated

with fire and combustion by-products.

1.2 Although these guidelines are written in the form

of an assessment tool, they are intended for use

throughout the design and development of

semiconductor manufacturing equipment.

1.3 These guidelines may also be used by the users of

such equipment and by other interested parties to assess

and compare the described risks of various equipment

designs or in the design and evaluation of ancillary

equipment or modifications.

1.4 These guidelines are not intended to specify which

techniques (e.g., selection of materials or detection

systems) are to be used to mitigate fire risk. These

guidelines do, however, recommend that the traditional

risk management hierarchy of elimination, engineering

controls, administrative controls, warning and work

practices be followed.

1.5 The appropriate application of these guidelines will

result in a report which identifies, analyzes and assesses

residual fire risks.

2 Scope

2.1 These guidelines apply to equipment used to

manufacture, measure, assemble, and test semiconduc-

tor products which is intended to be located in clean-

rooms used for semiconductor manufacturing processes

or areas within their recirculation airstream. They

apply to all of the components of the equipment, as

described herein.

NOTE 1: This document is not limited to the structural or

large-area components of equipment.

2.2 This document applies to fire risks originating

within the subject equipment that may result in damage

to it, other equipment, products, or the facility.

2.3 This document identifies considerations for

assessing the fire risk of semiconductor manufacturing

equipment, means of categorizing the risks, and means

of mitigating the risks.

NOTICE: This safety guideline does not purport to

address all of the safety issues associated with its use.

It is the responsibility of the users of this safety

guideline to establish appropriate safety and health

practices and determine the applicability of regulatory

or other limitations prior to use.

3 Limitations

3.1 These guidelines do not establish acceptance

criteria for residual risk.

3.2 This document recommends a hierarchy of

approaches (e.g., elimination of a hazard is preferable

to an engineering control) but neither prescribes which

specific risk mitigation methods (e.g., change of

material or elimination of an ignition source) are to be

used nor ranks their relative merit.

3.3 These guidelines apply to the protection of

property; they do not apply to the protection of

personnel.

NOTE 2: Protection of personnel from fire risk is within the

scope of SEMI S2.