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SEMI S15-0200 © SEMI 2000 7 A P PENDIX 1 TABLE FOR COMP AR ISON OF PERFORMANCE CHARACTERISTICS NOT E: The ma terial in this appendix is an of ficial part of SEMI S15 and w as approved by full letter ballot proc edures on…

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SEMI S15-0200 © SEMI 2000 6
8.8 US Government
Occupational Safety and Health Organization (OSHA)
7
29 CFR - Sections 1910.119 and 1910.1000
US Environmental Protection Agency (EPA)
8
40 CFR
68.13, Subpart C
7 US Government Printing Office, Washington, D.C. 20402
8 Superintendent of Documents, US Government Printing Office,
Washington, D.C. 20402
SEMI S15-0200 © SEMI 20007
APPENDIX 1
TABLE FOR COMPARISON OF PERFORMANCE CHARACTERISTICS
NOTE: The material in this appendix is an official part of SEMI S15 and was approved by full letter ballot procedures on
December 15, 1999 by the North American Regional Standards Committee.
Table A1-1
Performance Manufacturer/Technology
Characteristics A. B. C. D E.
Accuracy
Alarms
Calibration
Certifications and
Classifications
Communications (Serial)
Conditioning
Requirements
Cost of Ownership
Data Archiving
Diagnostics
Display
Drift
Environmental
Conditions
Equipment Failure
Expansion Flexibility
Extractive Systems:
Sampling Distance
Sample Cycle Time
Sample Contamination
Filter Lag
Installation (Wiring
Configuration)
Isolation
Limits of Detection:
Lowest Alarm Level
Limit of Detection
Upper limit of Detection
Linearity
Maintenance Interval
Other Utilities
Outputs
Physical Size
Poisoning
Position Effect
(Attitude Sensitivity)
Power Outage
Power Requirements
Recovery Time
Repeatability
SEMI S15-0200 © SEMI 2000 8
Performance Manufacturer/Technology
Characteristics A. B. C. D E.
Reliability
Replacement/
Replenishment
Resolution
Response Time
RFI/EMI Susceptibility
Self-test
Sensor Exchange
Sensor Specificity
Service and Support
Spare Parts Availability
Special Handling
Considerations
Storage and Shelf-life
Requirements
System Check
System Flexibility
Wake Up Requirements
Warm Up Period
Warranty
NOTICE: SEMI makes no warranties or representations as to the suitability of the guidelines set forth herein for
any particular application. The determination of the suitability of this guideline is solely the responsibility of the
user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other
relevant literature respecting any materials mentioned herein. This guideline is subject to change without notice.
The user’s attention is called to the possibility that compliance with this guideline may require use of copyrighted
material or of an invention covered by patent rights. By publication of this guideline, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
guideline. Users of this guideline are expressly advised that determination of any such patent rights or copyrights,
and the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.