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SEMI S22-1103a © SEMI 2003, 2005 1 SEMI S22-1103a SAFETY GUIDELINE FOR THE ELECTRICAL DESIGN OF SEMICONDUCTOR MANUFACTURING EQUIPMENT This safety guideline was technically approved by the global Environmental Health and …

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SEMI S21-1103 © SEMI 2003 15
Note 4: Specific protection recommendations for laser radiation above the maximum permissible exposure (MPE).
Note 5: Skin protection should be used for all exposed areas including head and neck.
NOTICE: SEMI makes no warranties or representations as to the suitability of the safety guidelines set forth herein
for any particular application. The determination of the suitability of the safety guidelines is solely the responsibility
of the user. Users are cautioned to refer to manufacturer' s instructions, product labels, product data sheets, and other
relevant literature, respecting any materials or equipment mentioned herein. These safety guidelines are subject to
change without notice.
By publication of this safety guideline, Semiconductor Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in
this safety guideline. Users of this guideline are expressly advised that determination of any such patent rights or
copyrights, and the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
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the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI S22-1103a © SEMI 2003, 2005 1
SEMI S22-1103a
SAFETY GUIDELINE FOR THE ELECTRICAL DESIGN OF
SEMICONDUCTOR MANUFACTURING EQUIPMENT
This safety guideline was technically approved by the global Environmental Health and Safety Committee.
This edition was approved for publication by the global Audits and Reviews Subcommittee on April 7, 2005.
It was available at www.semi.org in June 2005 and on CD-ROM in July 2005. Originally published
November 2003.
NOTICE: This document contains material that has been balloted and approved by the SEMI
Environmental Health and Safety Committee, but is not immediately effective. This material and the date on
which it becomes effective are included in Delayed Revisions Sections 1 and 2. The provisions of this
information are not an authoritative part of the document until their effective dates. The main body of SEMI
S22-1103a remains the authoritative version. Some or all of the provisions of revisions not yet in effect may
optionally be applied prior to the effective date, providing they do not conflict with portions of the
authoritative version other than those that are to be revised or replaced as part of the deferred change, and
are labeled accordingly. Material that is to be replaced by revisions that are not yet in effect is preceded by a
NOTICE indicating its status.
NOTICE: Paragraphs entitled “NOTE” are not an official part of this document and are not intended to modify or
supercede it.
NOTICE: Conformance to the “should” provisions of this guideline is necessary to declare conformance to this
document. Conformance to “may”, “suggested”, “preferred”, “recommended”, “NOTE”, or “Related Information”
provisions is not necessary to declare conformance.
1 Purpose
1.1 This guideline provides a set of design based electrical safety considerations for production equipment used in
the semiconductor industry.
1.2 Basic product safety concerns can be addressed by satisfying the design, construction, and testing principles set
forth in this document or by satisfying the requirements of applicable electrical safety standards.
2 Scope
2.1 This safety guideline applies to semiconductor manufacturing equipment.
2.2 This document contains the following:
1. Purpose
2. Scope
3. Limitations
4. Reference Standards
5. Terminology
6. Alternate Methods of Conformity
7. Design Philosophy
8. General Considerations
9. Facilities Electrical Connection
10. Protection Against Electric Shock
11. Protection Against Risk of Electrical Fire
12. Bonding to the Protective Conductor
13. Safety Circuits
SEMI S22-1103a © SEMI 2003, 2005 2
14. Interface Control
15. Electrical Enclosures
16. Conductors and Cables
17. Wiring Practices
18. Electric Motors ¼ Horsepower and Larger
19. Accessories and Lighting
20. Markings
21. Technical Documentation
22. Testing
2.3 Included in this safety guideline are design considerations for electrical safety interlocks that protect against
electrical as well as non-electrical safety hazards; and non-electrical interlocks that protect against electrical safety
hazards.
2.4 This document applies to the electrical design for all equipment used to manufacture, measure, assemble, and
test semiconductor products unless the equipment is specifically excluded. See Section 3, Limitations.
NOTE 1: This safety guideline is most useful for semiconductor manufacturing equipment where no relevant product safety
standard exists.
2.5 This safety guideline applies to equipment intended to be powered by hazardous voltages or hazardous electrical
power.
NOTE 2: The official values in this guideline are expressed in the International System of Units (SI). Values that:
a) are expressed in Inch-Pound (also known as “US Customary” or “English”) units,
b) are enclosed in parentheses, and
c) directly follow values expressed in SI units
are not official, are provided for reference only, and might not be exact conversions of the SI values.
NOTICE: This safety guideline does not purport to address all of the safety issues associated with its use. It is the
responsibility of the users of this safety guideline to establish appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior to use.
3 Limitations
3.1 This safety guideline does not apply to equipment, subassemblies, and components that have been certified by
an accredited testing laboratory and used within their certification parameters, or that conform to a relevant
international or national product safety standard as defined by the scope of that standard.
NOTE 3: Criteria for jurisdictional acceptance may vary and should be taken into account although it is beyond the scope of this
document.
3.2 This safety guideline is not intended to address any requirements pertinent to explosive atmospheres, hazardous
locations, and/or hazardous process materials.
3.3 This safety guideline does not apply to support equipment that is an integral part of the facility, such as facility
air conditioning, facility fire detection or fire extinguishing systems, or facility power distribution systems, which
include motor-generator sets and transformers.
3.4 This safety guideline does not include design specifications for performance or functional characteristics of the
equipment.
4 Referenced Standards and Documents
4.1 SEMI Standards
SEMI E33 — Specification for Semiconductor Manufacturing Facility Electromagnetic Compatibility