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SEMI MF154-0305 © SEMI 2003, 2005 7 Figure 34 Crack on the Wafer Edge D ue to Mechanical Con t act, No Preparation Required, Magnificati on 100× Figure 35 Crack on a Wafer Surface Due to Mechanical Con t act, No Preparat…

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SEMI MF154-0305 © SEMI 2003, 2005 6
Figure 25
Slip on a (111) Wafer Following
10-min Wright Etch, Full Wafer
View
Figure 26
Swirl Pattern Developed by
Preferentially Etching a
Czochralski Grown
10 to 20
·cm
Lapped Silicon Wafer
Figure 27
A-swirl on As-grown Float-zone
Silicon Following Preferential
Etch, Full Wafer View
Figure 28
Twin Lines in a (111) Wafer after
Preferential Etching, Full Wafer
View
Figure 29
Twin Line Following 6.5
m
Epitaxial Deposition, No Other
Sample Preparation Required,
Magnification 300×
Figure 30
Twin Lamella in a <110> Cleaved
Vertical Cross Section Following
2.6
m Removal
in Leo (Modified Sirtl) Etch
Figure 31
Area Contamination,
Magnification 100×
Figure 32
Area Contamination Seen With a
High Intensity Light Source, Full
Wafer View
Figure 33
Crack, Resulting from the
Impact on the Wafer Surface,
Following Preferential Etch,
Magnification 450×
SEMI MF154-0305 © SEMI 2003, 2005 7
Figure 34
Crack on the Wafer Edge Due to
Mechanical Contact, No
Preparation Required,
Magnification 100×
Figure 35
Crack on a Wafer Surface Due to
Mechanical Contact, No
Preparation Required,
Magnification 750×
Figure 36
Crack Near the Edge of a Wafer
Surface Due to Mechanical
Contact, No Preparation
Required, Magnification 750×
Figure 37
Cracks in a Wafer Surface
Viewed with High Intensity Light
Exhibiting a Scratch-Like
Appearance
Figure 38
Cracks in an Etched Wafer
Surface, Magnification 38×
Figure 39
Crater, Usually Caused by
Inadequate Rinse of Polishing
Chemicals, Magnification 50×
Figure 40
“Crows-Foot” Crack Resulting
from the Impact of a Hard
Object with the Wafer
Highlighted by Preferential Etch,
Magnification 300×
Figure 41
Dimples Under Fluorescent
Lighting Conditions Distort the
Reflected Image
Figure 42
Dimple, No Preparation
Required, Magnification 512×
SEMI MF154-0305 © SEMI 2003, 2005 8
Figure 43
Dopant Striation Rings after
Preferentially Etching, Full
Wafer View
Figure 44
Relatively Large Chip Found at
the End of a Major Flat, No
Preparation Required,
Magnification 37×
Figure 45
Relatively Small Chips Found on
an Edge Face, No Preparation
Required, Magnification 100×
Figure 46
Edge Chips, Full Wafer View
Figure 47
Relatively Small Edge Chips on a
Polished Edge Face,
Magnification 200×
Figure 48
Edge Cracks on an Edge Face,
No Preparation Required,
Magnification 200×
Figure 49
Vertical Cross Section of Edge
Crown on a Cleaved Epitaxial
Wafer, Viewed With Low
Magnification, Bright Field
Microscope
Figure 50
Epitaxial Large Point Defect, No
Preparation Required,
Magnification 200×
Figure 51
Foreign Matter,
Magnification 200×