semi合集-English.pdf - 第7235页

SEMI MF154-0305 © SEMI 2003, 2005 9 Figure 52 Foreign Matter from a Dried Liquid Spot, Magnification 200× Figure 53 Groove or Micro-Scratch, Magnificati on 220× Figure 54 Groove or Micro-Scratch, Magnificati on 220× Figu…

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SEMI MF154-0305 © SEMI 2003, 2005 8
Figure 43
Dopant Striation Rings after
Preferentially Etching, Full
Wafer View
Figure 44
Relatively Large Chip Found at
the End of a Major Flat, No
Preparation Required,
Magnification 37×
Figure 45
Relatively Small Chips Found on
an Edge Face, No Preparation
Required, Magnification 100×
Figure 46
Edge Chips, Full Wafer View
Figure 47
Relatively Small Edge Chips on a
Polished Edge Face,
Magnification 200×
Figure 48
Edge Cracks on an Edge Face,
No Preparation Required,
Magnification 200×
Figure 49
Vertical Cross Section of Edge
Crown on a Cleaved Epitaxial
Wafer, Viewed With Low
Magnification, Bright Field
Microscope
Figure 50
Epitaxial Large Point Defect, No
Preparation Required,
Magnification 200×
Figure 51
Foreign Matter,
Magnification 200×
SEMI MF154-0305 © SEMI 2003, 2005 9
Figure 52
Foreign Matter from a Dried
Liquid Spot, Magnification 200×
Figure 53
Groove or Micro-Scratch,
Magnification 220×
Figure 54
Groove or Micro-Scratch,
Magnification 220×
Figure 55
Haze Seen as Distortion or
Blurring of a Reflected Image,
Full Wafer View
Figure 56
Haze (Extreme Case) Seen as a
White Cloudiness Under High
Intensity Light, Full Wafer View
Figure 57
Localized Light Scatterers,
(Particle Contamination) in the
Form of Small Fiber,
Magnification 200×
Figure 58
Localized Light Scatterers Seen
in High Intensity Light, Full
Wafer View
Figure 59
Mound, No Preparation
Required, Magnification 200×
Figure 60
Orange Peel Surface Roughness,
Magnification 200×
SEMI MF154-0305 © SEMI 2003, 2005 10
Figure 61
Atomic Force Microscope (AFM)
Image of a Faceted COP
Figure 62
Pit (Usually Associated With
Insufficient Polishing of Caustic
Etched Wafer),
Magnification 1000×
NOTE: Air Pocket Size Ranges from a
Few Micrometers to a Few Hundred
Micrometers
Figure 63
Pit Associated with a Crystal Air
Pocket on Lapped Wafer
Figure 64
Saw Blade Defect Seen on
Lapped and Etched Wafer,
Magnification 6×
Figure 65
Multiple Scratches Located by
the Arrow under High Intensity
Light, Full Wafer View
Figure 66
A Single Long Arc Scratch
Located by the Arrow
Under High Intensity Light,
Full Wafer View
Figure 67
Scratch Resulting in a Series of
Pits Following Chemical Etching,
Magnification 70×
Figure 68
Stains from Improper Cleaning
or Drying Located by the Arrow
under High Intensity Light,
Full Wafer View