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SEMI E101-1104 © SEMI 2000, 2004 1 SEMI E101-1104 GUIDE FOR EFEM FUNCTI ONAL STRUCT URE MODEL This guide was technically approved by the Global Ph ysical Interfaces and Carriers Com mittee and is the direct responsibilit…

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SEMI E100-1104 © SEMI 2000, 2003 14
APPENDIX 2
ADDITIONAL INFORMATION
NOTICE: The material in this appendix is an official part of SEMI E100 and was approved by full letter ballot
procedures on September 3, 1999 by the North American Regional Standards Committee.
A2-1 Features on the RSP which enable stacking may be standardized in the future pending learning from first
design approaches and standardization of reticle ID location.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standard set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copy-righted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E101-1104 © SEMI 2000, 2004 1
SEMI E101-1104
GUIDE FOR EFEM FUNCTIONAL STRUCTURE MODEL
This guide was technically approved by the Global Physical Interfaces and Carriers Committee and is the
direct responsibility of the North American Physical Interfaces and Carriers Committee. Current edition
approved by the North American Regional Standards Committee on August 16, 2004. Initially available at
www.semi.org September 2004, to be published November. Originally published February 2000; previously
published October 2000.
1 Purpose
1.1 Productivity improvement is the task with the
highest priority in semiconductor factories of the 300
mm generation, and computer-integrated manufact-
uring or factory automation (CIM/FA) technologies
become more and more important to accomplish it. The
standardization of these technologies is also necessary
to provide the CIM/FA infrastructure in a short period
of time at a low cost. Since the standards will have to
cover a wide range of production equipment, communi-
cation hardware, and software tools, it is very important
that the standards have a high degree of compatibility.
In order to improve the compatibility, this guide
provides a functional structure model of an Equipment
Front End Module (EFEM) that handles carriers and
substrates at the interface between the factory material
handling system and the process equipment.
1.2 The major purposes of this guide are as follows:
1) provide a common understanding of functions of
EFEM (Equipment Front End Module) and associated
interfaces between functional elements (components
with particular function roles),
2) provide a common understanding of the hierarchical
structure of functions and their interfaces in an EFEM,
3) provide a common understanding of possible units
used for maintenance, adjustment, and control, and
4) provide a map between EFEM functional elements
and existing standards.
2 Scope
2.1 Model Structure and Functions
2.1.1 This document recognizes EFEM as a component
of semiconductor manufacturing equipment. It creates
an EFEM functional structure model to clearly describe
EFEM, its functional elements, and the functions of
each functional element. The functional structure model
includes the following:
1) definition of functional elements that constitute
EFEM,
2) definition of functions of functional elements, and
3) hierarchical description of functional elements.
2.1.2 For clarity, Fixed Buffer Type EFEM and
Internal Buffer Type EFEM (see Terminology) are
represented as independent functional structure models
in this document.
2.2 Preconditions for Modeling
2.2.1 The models are created under the following
conditions:
1) Modeling should be restricted to SEMI E15.1,
Option 1, Options 2 and 3, and Option 3 types. (See
SEMI E15.1, Figure 2 (Load Port Options)).
2) The model supports handling of open cassette (OC),
and Front Opening Unified Pod (FOUP) (see
Terminology).
3) The model is created for the maximum structure
including options.
4) Functional elements that have interfaces with EFEM
are also included in the model.
NOTE 1: Functional elements that don’t belong to EFEM, but
are important in defining interfaces among the functional
elements, are represented in this model to clarify their
functional positions and attributes in the entire equipment.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E1.9 Mechanical Specification for Cassettes
Used to Transport and Store 300 mm Wafers
SEMI E15 Specification for Tool Load Port
SEMI E15.1 Specification for 300 mm Tool Load
Port
SEMI E19 Standard Mechanical Interface (SMIF)
SEMI E23 Specification for Cassette Transfer
Parallel I/O Interface
SEMI E101-1104 © SEMI 2000, 2004 2
SEMI E47.1 Provisional Mechanical Specification
for Boxes and Pods Used to Transport and Store 300
mm Wafers
SEMI E57 Mechanical Specification for Kinematic
Couplings Used to Align and Support 300 mm Wafer
Carriers
SEMI E64 Specification for 300 mm Cart to SEMI
E15.1 Docking Interface Port
SEMI E84 Specification for Enhanced Carrier
Handoff Parallel I/O Interface
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Abbreviations and Acronyms
4.1.1 AGV — automatic guided vehicle (cart)
4.1.2 OHT — overhead transport system with hoist for
lifting carriers between load port level and transport
level.
4.1.3 PGV — person guided vehicle (cart).
4.1.4 PI/O — parallel input/output interface, for
example, as specified in SEMI E23.
4.1.5 RGV — rail guided vehicle (moving on the
floor).
4.2 Definitions
4.2.1 BOLTS plane — a plane parallel to the facial
datum plane near the front of the tool where the box
opener/loader is attached (as defined in SEMI E63).
4.2.2 box — a protective portable container for a
cassette and/or substrate(s).
4.2.3 box opener/loader — the equipment component
that opens wafer carriers (if needed) and presents the
carriers to the equipment’s Substrate Handler for
unloading and loading wafers.
4.2.4 carrier — any cassette, box, or pod that are used
to transport substrates (as defined in SEMI E15).
4.2.5 cart — a floor-based carrier transfer vehicle.
4.2.6 cassette — an open structure that holds one or
more wafer substrates.
4.2.7 docking — the act of locating a floor-based
carrier transport vehicle for carrier transfer to/from
equipment.
4.2.8 equipment front end module (EFEM) — it
consists of the carrier handler that receives carriers
from the factory material handling system on one or
more load ports (as specified in SEMI E15.1), opens the
carriers (if needed), and may include a Substrate
Handler for unloading and loading wafers from the
carrier to the process part of equipment.
4.2.9 fixed buffer — EFEM configuration with carrier
places only on load port units arranged in a load port
group.
4.2.10 front opening unified pod (FOUP) — front
opening type box/pod with non-removable cassettes (as
defined in SEMI E47.1).
4.2.11 internal buffer — EFEM configuration with
carrier places different from load port units.
4.2.12 kinematic coupling — the physical alignment
mechanism on the bottom of the wafer carrier that
consists of features that mate with three vertical pins on
the load port (as defined in SEMI E57).
4.2.13 load port — the interface location on a tool
where carriers are placed to allow the tool to process
wafers (as defined in SEMI E15).
4.2.14 open cassette (OC) — a cassette (as defined in
SEMI E1.9) without a protective barrier around it.
4.2.15 transfer — to either load or unload (as defined
in SEMI E15).
5 Modeling Methodology (General Rules)
5.1 Notation
5.1.1 A functional element to be defined is represented
by a rectangle.
5.1.2 The name of a functional element is written in the
rectangle representing the element.
5.1.3 Numbers preceding the functional element name
indicate the number of elements.
[0, 1] indicates the element may exist or may not exist.
[1+] indicates the element may exist one or more times.
5.2 Rules of Notation Usage
5.2.1 A functional element that is written on the border
between adjacent layers indicates the element may
belong to either of two functional elements in the
adjacent layers.
5.2.2 Functional elements whose position in the
Functional Structure Model diagram are similar in the
two models of Fixed Buffer Type EFEM and Internal
Buffer Type EFEM have the same name.
5.2.3 A functional element whose location is still
undecided between two adjacent layers is located in
between them.