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SEMI T3-0302 © SEMI 1995, 2002 8 6.3.10.1 T he initial six characters are a non-printed mes sage header. The next 570 characters are restricted to the Code 39 Ch aracter Set (see 6.1.6) using the s ix- bit EDIFA CT encod…

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SEMI T3-0302 © SEMI 1995, 2002 7
by dashes. For shipping boxes containing 100 to 200 mm diameter wafers, slot 01 is at the bar end of the box. For
300 mm FOSBs, slot 1 is specified by SEMI M31 to be at the bottom of the FOSB.
6.3.5 Any character locations not otherwise used may contain information whose content shall be agreed to between
supplier and customer. These characters may consist of customer-specified data or supplier-specified data (which
may be encrypted) or both.
6.3.6 The data matrix code shall be a square field, constructed in accordance with ISO/IEC 16022, using error
correction code ECC200.
6.3.7 Dot Size — The nominal shape of the dot produced in the matrix may be circular or square, depending on the
printing technique. It is recommended that each " cell" of the data matrix symbol be composed of at least four dots
(a cell with two dots per edge). When printed at 203 dpi, the dot diameter or edge length is 0.125 mm (0.00985 in.).
6.3.8 Symbol Dimensions — Each matrix code symbol shall be composed of 80 rows and 80 columns of cells
spaced equally with cell spacing S (see Figure 3). The nominal outside dimensions of the matrix (C2 and R2 in
Figure 4), printed with 4 dots per cell at 203 dpi is 20 mm.
6.3.9 Border Rows and Columns (see Figure 4)
6.3.9.1 The leftmost border row and the bottom border column shall contain dots in each cell. These are identified
as the primary border row and the primary border column.
6.3.9.2 The opposing (secondary) border row and column shall contain dots in every other cell.
6.3.9.3 These border rows and columns are used by the code reader to determine the origin, size, and orientation of
the matrix.
6.3.9.4 The origin of the matrix code symbol shall be the physical center point of the cell common to the primary
border row and the primary border column.
NOTE 5: This origin location differs from that used in SEMI T2.
6.3.10 Message Characters — The matrix code symbol contains 682 8-bit message characters.
Table 5 Nominal Dimensions of Wafer Box Labels and All Data Fields
Dimension Metric (SI) Value U.S. Customary Value
A (see Note 11) 25 mm 1 in.
B (see Note 11) 0.75 mm 0.04 in.
C (see Note 11) 1.0 mm 0.04 in.
D (see Note 11) 0.50 mm 0.02 in.
E (see Note 11) 2.0 mm 0.08 in.
F (see Note 11) 24.24 mm 0.95 in.
H (see Note 11) 9.0 mm 0.35 in.
J 2.0 mm 0.08 in.
K (see Note 12)
20.0 mm 0.788 in.
L´ 60.06 mm 2.365 in.
L 72.76 mm 2.865 in.
P 119.0 mm 4.69 in.
Q 6.35 mm 0.25 in.
S (see Note 11) 30.0 mm 1.19 in.
T (see Note 11) 24.0 mm 0.95 in.
U (see Note 11) 2.5 mm 0.106 in.
NOTE 1: The Metric (SI) and U.S. Customary values of this dimension are not exact equivalents; the dimension has been rounded to obtain
rational values in both systems.
NOTE 2: Printed at 4 dots/cell and 203 dpi.
SEMI T3-0302 © SEMI 1995, 2002 8
6.3.10.1 The initial six characters are a non-printed
message header. The next 570 characters are restricted
to the Code 39 Character Set (see 6.1.6) using the six-
bit EDIFACT encodation scheme described in Annexe
J3 of ISO/IEC 16022. The remaining 105 message
characters may be any character in the EDIFACT
Encodation Character Set, including unprinted ones.
These 105 characters are available for encrypted or
unencrypted information, as negotiated between
supplier and customer.
6.3.11 Print Quality — To assure reading efficiency, a
minimum contrast of 30% is required between the
reflectance value of a dot and the surrounding label
surface. Various densitometers can provide such
measurements nondestructively.
7 Label Types, Label Dimensions, and
Placement of Data Fields on Labels
7.1 Label Types (see Figure 5 for examples)
7.1.1 Type 1 — Company Field + Data Matrix Field
with hri fields
7.1.2 Type 2 — Company Field + Bar Code Field with
hri fields
7.1.3 Type 3 — Company Field + Data Matrix Field +
Bar Code Field with hri fields. Two of this type of
label are required for use on 300 mm FOSBs.
NOTE 6: The space reserved on the FOSB rear surface
accepts labels as large as 120 mm by 120 mm. This permits
the use of labels wider than is specified in this standard. Such
labels may contain additional information as arranged by
agreement between customer and supplier.
7.1.4 Type 4 — Company Field + Data Matrix Field1 +
Bar Code Field with hri fields + Data Matrix Field2
with hri fields
7.1.5 Type 5 — Company Field + two Data Matrix
Fields, both with hri fields
7.2 Each label shall contain an area containing
Company Information and one or more areas containing
bar codes, data matrix codes, and related human-
readable information.
7.2.1 The Company Information area may contain
supplier-related information in human-readable alpha-
numeric format and other information as agreed to
between customer and supplier.
7.2.2 The other fields that contain bar code, human-
readable, and two-dimensional matrix code data fields,
may be arranged as indicated in the examples shown in
Figure 5.
7.2.3 The human-readable (hri) data fields can be
placed either above or below their associated bar code
data fields. The examples in Figure 5 show the
configuration with the hri fields above the bar code data
fields.
7.3 Approximate overall dimensions of the five label
types shown in Figure 5 are tabulated in Table 6.
7.4 Dimensions of individual fields, label height, and
label length for a type 4 label are given in Table 5 and
Figure 6. Label types 4 and 5 may use perforated label
material so that the sections may be separated after
printing.
Table 6 Overall Dimensions of Box Labels
Length Width
Label
Type
Symbol mm in. Symbol mm in.
1 F+ S 54.2 2.1 A 25.0 1.0
2 F+ L 97.0 3.8 A 25.0 1.0
3 P=F+ T+
L
119.
0
4.7 A 25.0 1.0
4 P+ S 149.
0
5.9 A 25.0 1.0
5 F+ 2S 84.2 3.3 A 25.0 1.0
NOTE 1: For meaning of the symbols, see Table 5.
8 Label Locations on Wafer Box
8.1 For boxes containing wafers from 100 to 200 mm
in diameter, the following recommendations apply.
8.1.1 It is recommended that label type 4 or label type
5 be used for these boxes. These label types may be
printed on perforated label material so that the sections
may be separated after printing.
8.1.2 The recommended location for the larger label is
the center (both vertically and horizontally) of the side
of the cover of the wafer box facing the operator with
the bar end to the left and the wall end to the right (see
Figure 7). Alternatively, this label may be placed in the
center of the same side of the base of the wafer box.
8.1.3 The recommended location for the smaller label
is the center (both vertically and horizontally) of the
wall end of the base of the wafer box (see Figure 7).
Alternatively, this label may be placed at the center of
the wall end of the cover of the wafer box.
8.1.4 It is recommended that the wafer box cover and
the wafer box base each contain a label, so that each
will have a label after they have been separated.
However, in some cases, space limitations may require
that both labels be placed on the same part of the wafer
box.
8.2 For FOSBs containing 300 mm wafers, the
following requirements apply.
8.2.1 Use two identical Type 3 labels.
SEMI T3-0302 © SEMI 1995, 2002 9
8.2.2 Place one label on the center of the rear surface of the FOSB with the long axis of the label perpendicular to
the FOSB base (see Figure 8a).
8.2.3 Place the other, identical, label on the outer wrap bag, which is specified in SEMI M31, at the center of the
side adjacent to the FOSB door (see Figure 8b).
NOTE 1: This specification covers only labels for the wafer package, including the wafer boxes and the wafer box wrap; labels
for transport packages are specified in EAI 556-B.
Figure 1
Wafer Box, Wafer Package and Transport Package