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SEMI E103-0704 © SEMI 2000, 2004 4 RELATED INFORMATION 1 APPLICATION NOTES NOTICE : This relat ed information is not an offici al part of SEMI E 103 but was approved for pu blication by f ull letter ballot procedures on …

SEMI E103-0704 © SEMI 2000, 2004 3

Figure 2

Front View of Example Single-Wafer Box and SWIF

6.7 SWIF Sensing — It is possible that the SWIF is not

removed from the load port when single-wafer boxes

are removed and replaced on the SWIF. However,

when the single-wafer box is removed from the SWIF,

all of the carrier sensing pads (defined in Section 6.6 of

SEMI E1.9) on the bottom of the SWIF must be raised

(so that the load port can sense a change of carriers by

its carrier placement sensor, if any). However, in order

to ensure that the SWIF triggers most optical carrier

presence detectors on the load port, the SWIF (without

a single-wafer box) must block any line of sight

through a volume consisting of the smallest cylindrical

section that contains all of the wafer pick-up volumes

(defined in SEMI E1.9) of the corresponding FOUP

(defined in SEMI E47.1). Note that this standard does

not prevent the use of other kinds of carrier presence

detectors (such as sensors that detect weight on the load

port).

7 Related Documents

7.1 SEMI Standards

SEMI E15.1 — Specification for 300 mm Tool Load

Port

SEMI E57 — Mechanical Specification for Kinematic

Couplings Used to Align and Support 300 mm Wafer

Carriers

SEMI E63 — Mechanical Specification for 300 mm

Box Opener/Loader to Tool Standard (BOLTS-M)

Interface

SEMI E72 — Specification and Guide for 300 mm

Equipment Footprint, Height, and Weight

SEMI E92 — Specification for 300 mm Light Weight

and Compact Box Opener/Loader and Tool-Interface

Standard (BOLTS-Light)

SEMI M31 — Provisional Mechanical Specification for

Front-Opening Shipping Box Used to Transport and

Ship 300 mm Wafers

SEMI S8 — Safety Guidelines for Ergonomics/ Human

Factors Engineering of Semiconductor Manufacturing

Equipment

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

NOTICE: SEMI makes no warranties or representa-

tions as to the suitability of the specification set forth

herein for any particular application. The determination

of the suitability of the specification is solely the

responsibility of the user. Users are cautioned to refer

to manufacturer’s instructions, product labels, product

data sheets, and other relevant literature respecting any

materials mentioned herein. These specifications are

subject to change without notice.

The user’s attention is called to the possibility that

compliance with this specification may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this specification,

SEMI takes no position respecting the validity of any

patent rights or copyrights asserted in connection with

any item mentioned in this specification. Users of this

specification are expressly advised that determination

of any such patent rights or copyrights, and the risk of

infringement of such rights, are entirely their own

responsibility.

SEMI E103-0704 © SEMI 2000, 2004 4

RELATED INFORMATION 1

APPLICATION NOTES

NOTICE: This related information is not an official part of SEMI E103 but was approved for publication by full

letter ballot procedures on July 28, 2000.

R1-1

R1-1.1 In fabs in which this system (of single-wafer box and SWIF) is used, equipment should have control

software algorithms that prevent end effectors and wafer slot mappers from entering the carrier except in the

clearances around the middle wafer (defined in Section 6.2) when the presence of this system is detected. A variety

of methods for differentiating the system from ordinary FOUPs are possible.

R1-1.2 Using sensors, equipment can differentiate the system (of single-wafer box and SWIF) from ordinary

FOUPs. For example, sensors below the info pad B location on the load port and on the FIMS door (opposite the

seal zones or the reserved spaces for vacuum application on the box door) could indicate that the carrier type is an

open cassette but with a FOUP door, together implying the presence of this system (of a single-wafer box and

SWIF). Note that such sensors on the load port are not currently specified in any SEMI standard.

R1-1.3 Carrier ID tags can inform the equipment that the load port holds this system (of single-wafer box and

SWIF) instead of an ordinary FOUP.

R1-1.4 Messages from the host computer system can inform the equipment that the load port holds this system (of

single-wafer box and SWIF) instead of an ordinary FOUP.

NOTICE: SEMI makes no warranties or representations as to the suitability of the specification set forth herein for

any particular application. The determination of the suitability of the specification is solely the responsibility of the

user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other

relevant literature respecting any materials mentioned herein. These specifications are subject to change without

notice.

The user’s attention is called to the possibility that compliance with this specification may require use of

copyrighted material or of an invention covered by patent rights. By publication of this specification, SEMI takes

no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned

in this specification. Users of this specification are expressly advised that determination of any such patent rights or

copyrights, and the risk of infringement of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E104-0303 © SEMI 2000, 2003 1

SEMI E104-0303

SPECIFICATION FOR INTEGRATION AND GUIDELINE FOR

CALIBRATION OF LOW-PRESSURE PARTICLE MONITOR

This specification was technically approved by the Global Metrics Committee and is the direct responsibility

of the European Equipment Automation Committee. Current edition approved by the European Regional

Standards Committee on January 8, 2003. Initially available at www.semi.org January 2003; to be published

March 2003. Originally published October 2000; previously published March 2002.

1 Purpose

1.1 The use of in situ particle monitoring (ISPM;

particle measurements performed while the wafer

resides inside the processing chamber) in low-pressure

and vacuum applications provides a number of

advantages for defect, process, and equipment

management such as:

• Reduction of particle test wafers used for off-line

tests and saving operator time,

• Optimization and real-time characterization of the

process,

• Advanced process control,

• Advanced equipment control,

• Monitoring process chamber conditions, and

• Optimization of cleaning procedures and

maintenance.

1.1.1 Therefore, ISPM achieves more equipment

availability and faster ramp-up of the production,

reduces cost of ownership, improves quality and yield.

To reach these goals, ISPM needs to be easily

integrated into new or existing process equipment and

the acquisition as well as the analysis of the particle

data needs to be automated. The ISPM sensor should

not have any negative influence on the process and the

measurement has to represent the main particle flow.

The sensor should be designed to have a minimum

negative impact on the parameters defined in SEMI E10

for the whole semiconductor process equipment, to

achieve an advantage in capacity.

1.2 This standard is intended to stipulate operating

conditions, mechanical, electrical, and communication

interfaces for the use of Low-pressure Particle

Detectors integrated in semiconductor process

equipment. A guideline for a reference calibration of

those sensors is intended to support correlation between

measurements with different sensors.

2 Scope

2.1 This standard applies to particle measurement

under low-pressure and vacuum conditions in

semiconductor manufacturing equipment.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety health practices and determine the

applicability of regulatory or other limitations prior to

use.

3 Referenced Standards

3.1 SEMI Standards

SEMI C6.5 — Particle Specification for Grade 10/0.2

Nitrogen (N

) and Argon (Ar) Delivered as Pipeline

Gas

SEMI C6.6 — Particle Specification for Grade 10/0.1

Nitrogen (N

) and Argon (Ar) Delivered as Pipeline

Gas

SEMI E4 — SEMI Equipment Communications

Standard 1 Message Transfer (SECS-I)

SEMI E5 — SEMI Equipment Communications

Standard 2 Message Content (SECS-II)

SEMI E10 — Specification for Definition and

Measurement of Equipment Reliability, Availability,

and Maintainability (RAM)

SEMI E33 — Specification for Semiconductor

Manufacturing Facility Electromagnetic Compatibility

SEMI E37 — High-Speed SECS Message Services

(HSMS) Generic Services

SEMI E54 — Sensor/Actuator Network Standard

SEMI E54.10 — Specification for Sensor/Actuator

Network Specific Device Model for an In-Situ Particle

Monitor Device

SEMI F6 — Guide for Secondary Containment of

Hazardous Gas Piping Systems